FIG. 1 is a perspective view of an earphone headset of the design as seen from the front and one side with the boom and the connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 2 is a front elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 3 is a rear elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 4 is a side elevation view as seen from left to right of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 5 is a side elevation view as seen from right to left of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 6 is a top plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 7 is a bottom plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 8 is a perspective view of a modified embodiment of the earphone headset of the design as seen from the front and one side with boom and the connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 9 is a front elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 10 is a rear elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 11 is a side elevation view as seen from left to right of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 12 is a side elevation view as seen from right to left of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;

FIG. 13 is a top plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention; and,

FIG. 14 is a bottom plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims as granted

1 claim

Classifications

2 codes

IPC · International Patent Classification

Section /

/DRW

USPC · US Patent Classification

D14/205

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Pendency

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355 days filing → grant

Office actions

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Examiner

Paula A. Mortimer

art unit 2914 · TC 2900

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