Inventor
Hoa Pham
Inventor
San Jose, CA, US
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing18%
LOC1414%
H05KPrinted circuits11%
A47BTables5%
B29CShaping or joining of plastics5%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers5%
B67DDispensing, delivering or transferring liquids, not otherwise provided for5%
Y10TTechnical subjects covered by former us classification5%
A61BDiagnosis2%
A61NElectrotherapy2%
PatentTitleYear
10,357,651Method of manufacturing a flexible conductive track arrangement, flexible conductive track arrangement and neurostimulation system2019D0848255Hand strap device2019D0832859Display mount201810,047,477Textile coating composition20189,974,203Rack system for supporting a computing device20189,053,143'Allowing updates to database objects'20158,495,043'System and method for allowing updates to database objects'20137,845,638'Feeder assembly for laser imaging apparatus'20107,301,719'Clearance sweep test'2007RE039340'Spill-reduction cap for fluid container'20066,665,069'Spectro-temporal analyzer'2003D0469770'Headset signal converter pod'2003D0468723'Earphone headset'20036,496,589'Headset with overmold'2002D0449038'Headset'2001D0448751'Earphone headset'2001D0444143'Microphone'20016,208,523'Processor retention apparatus'20016,081,419'Protection device for an electronic instrument and method'20005,906,497'Processor retention frame and extraction device'19995,687,865'Spill-reduction cap for fluid container'19975,291,838'Packaging system'19944,967,311'Electronic module interconnection system'19904,899,254'Electronic module interconnection system'19904,885,436'Electronic module interlock and extraction mechanism'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–1994Patents assigned to TANDEM COMPUTERS INC (4)· patent assignee history
1989–2018Based in San Jose, CA, US· patent location history
1997–2006Based in Mountain View, CA, US· patent location history
1999–2001Patents assigned to HEWLETT PACKARD CO (2)· patent assignee history
2001–2003Patents assigned to TELEX COMMUNICATIONS (6)· patent assignee history
2001–2002Based in St. Paul, MN, US· patent location history
2003–2010Based in Woodbury, MN, US· patent location history
2013–2015Patents assigned to IBM (2)· patent assignee history
2018–2019Patents assigned to MOBILE TECH INC (2)· patent assignee history
2018–2019Based in Hillsboro, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TELEX COMMUNICATIONS | 6 | 2001–2003 |
| TANDEM COMPUTERS INC | 4 | 1989–1994 |
| HEWLETT PACKARD CO | 2 | 1999–2001 |
| IBM | 2 | 2013–2015 |
| MOBILE TECH INC | 2 | 2018–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 9 | 1989–2018 |
| St. Paul, Minnesota, US | 4 | 2001–2002 |
| Woodbury, Minnesota, US | 3 | 2003–2010 |
| Mountain View, California, US | 3 | 1997–2006 |
| Hillsboro, OR, US | 2 | 2018–2019 |