Electronic component package and method for manufacturing the same

This is a continuation of International Application No. PCT/JP2019/000483 filed on Jan. 10, 2019 which claims priority from Japanese Patent Application No. 2018-004157 filed on Jan. 15, 2018. The contents of these applications are incorporated herein by reference in their entireties.

The present disclosure relates to an electronic component package and a method for manufacturing the same.

Background Art

Examples of an electronic component package that includes an electronic component, a resin layer, and a conductor film without including a support board include an electronic component package described in International Publication No. 2016/092633 (Patent Document 1). FIG. 14 is a cross-sectional view of an electronic component package described in Patent Document 1.

An electronic component package 200 includes an electronic component 210 , a resin layer 240 , a conductor film 250 , a lead frame 280 , and wires 290 without including a support board. The electronic component 210 , the lead frame 280 , and the wires 290 are embedded in the resin layer 240 .

The lead frame 280 includes a first portion 281 , second portions 282 , and third portions 283 disposed to surround the second portions 282 . The second portions 282 are internal wirings, and the third portions 283 are ground terminals. The electronic component 210 is fixed onto the first portion 281 , and connected to the second portions 282 via the wires 290 . The conductor film 250 is applied to the outer surface of the resin layer 240 , and connected to portions of the third portions 283 exposed from the resin layer 240 .

Each of FIGS. 15A, 15B and 15C is a cross-sectional view illustrating part of a process for manufacturing the electronic component package 200 . As illustrated in FIG. 15A , in the process for manufacturing the electronic component package 200 , first, a package aggregate is manufactured. In the package aggregate, the electronic component 210 is connected to each of the lead frames 280 and an aggregate of the lead frames 280 is embedded in a coupled resin layer 240 A. In the package aggregate, the third portions 283 correspond to a coupled unit 283 W containing adjacent two third portions 283 .

Subsequently, as illustrated in FIG. 15B , the package aggregate is cut with, for example, a dicing saw. Here, each coupled unit 283 W is cut into two third portions 283 . Then, as illustrated in FIG. 15C , the conductor film 250 is applied to each cut semifinished product to complete the electronic component package 200 . The conductor film 250 is connected to portions of the third portions 283 exposed from the resin layer 240 .

Patent Document 1: International Publication No. 2016/092633

One of the characteristics of the above electronic component package 200 is that the electronic component package 200 is manufactured using an aggregate of the lead frames 280 each including the first portion 281 , the second portions 282 , and the coupled unit 283 W for the third portions 283 . Thus, in the manufacturing process, the coupled resin layer 240 A and the coupled units 283 W made of metal are concurrently cut with, for example, a dicing saw.

Normally, cutting starts from the coupled resin layer 240 A. When the dicing saw blade cuts in from the coupled resin layer 240 A and reaches the coupled unit 283 W made of metal, the hardness of an object to be cut changes abruptly. This abrupt change may require replacement of the dicing saw blade due to acceleration of a wearing out of the dicing saw blade that is to further cut the object or distortion and breakage. This replacement of the blade may hinder smooth manufacturing.

In addition, the dicing saw blade that pushes the coupled unit 283 W may separate the coupled unit 283 W from the coupled resin layer 240 A. This separated portion may cause a structural defect that degrades the electronic component package 200 in view of, for example, moisture resistance.

Specifically, an object of the present disclosure is to provide an electronic component package that prevents occurrence of structural defects, and a method for manufacturing the same.

An electronic component package according to a first aspect of the present disclosure includes a resin layer, an electronic component, a grounding member, and a conductor film. The electronic component is partially covered with the resin layer, and includes an external terminal. The grounding member is partially covered with the resin layer. The conductor film is disposed on a surface of the resin layer. The grounding member includes a multilayer body and an outer conductor disposed at an end portion of the multilayer body in a lamination direction. The multilayer body includes at least one resin film and at least one pattern conductor laminated one on another, and at least one via conductor extending in the lamination direction and connected to the outer conductor. The multilayer body includes a first surface, a second surface disposed opposite to the first surface in the lamination direction, and a third surface, which connects the first surface and the second surface. In the multilayer body, at least one of the pattern conductor has at least part of a circumference connected to the conductor film at the third surface, and electrically connected to a via conductor. Part of the external terminal and part of the outer conductor are exposed from an identical surface of the resin layer.

A method for manufacturing an electronic component package according to a second aspect of the present disclosure is a method for manufacturing an electronic component package including a resin layer, an electronic component, a grounding member, and a conductor film. The electronic component is partially covered with a resin layer, and includes an external terminal. The grounding member is partially covered with the resin layer. The grounding member includes a multilayer body, and an outer conductor disposed at an end portion of the multilayer body in a lamination direction. The multilayer body includes at least one resin film and at least one pattern conductor laminated one on another. A conductor film is disposed on a surface of the resin layer. The method for manufacturing an electronic component package includes a holding step, a resin-layer application step, a removal step, a cutting step and a conductor-film application step. In the holding step, a base including a base member and an adhesive layer applied to a first main surface of the base member, the electronic component, and a coupled grounding member including a coupled multilayer body obtained by coupling a plurality of the multilayer bodies are manufactured or prepared, and the external terminal of the electronic component and the outer conductor of the coupled grounding member are arranged on the adhesive layer to allow the electronic component and the coupled grounding member to be held on the base. In the resin-layer application step, the resin layer is applied to the adhesive layer to cover a surface of the electronic component excluding an area over which the external terminal is in contact with the adhesive layer and a surface of the coupled grounding member excluding an area over which the outer conductor is in contact with the adhesive layer. In the removal step, the base is removed to expose, from an identical surface of the resin layer, at least part of the external terminal of the electronic component and at least part of the outer conductor of the coupled grounding member. In the cutting step, together with the resin layer, the coupled grounding member is cut into a plurality of the grounding members and exposing part of a circumference of the pattern conductor. In the conductor-film application step, the conductor film is applied to a surface of the resin layer to connect the conductor film with the exposed part of the circumference of the pattern conductor.

The present disclosure can prevent occurrence of structural defects in an electronic component package.

FIG. 1 is a cross-sectional view of an electronic component package 100 , which is an electronic component package according to an embodiment of the present disclosure.

FIGS. 2A and 2B include a perspective view of a grounding member 30 and a perspective partially-cut view of a coupled grounding member 30 W used in a process for manufacturing an electronic component package 100 .

Each of FIGS. 3A to 3F is a cross-sectional view of an example of a process for manufacturing the electronic component package 100 .

Each of FIGS. 4A and 4B is a plan view of an example of a process for manufacturing the electronic component package 100 , where an electronic component 10 , electronic components 20 , and coupled grounding members 30 W are held on a base B.

Each of FIGS. 5A, 5B and 5C is a bottom view of coupled grounding members 30 W according to first to third modification examples.

Each of FIGS. 6A, 6B and 6C includes a bottom view and a cross-sectional view of a coupled grounding member 30 W according to a fourth modification example, and a front view of a grounding member 30 according to a modification example obtained by sectioning the coupled grounding member 30 W according to the fourth modification example.

Each of FIGS. 7A, 7B and 7C includes a bottom view and a cross-sectional view of a coupled grounding member 30 W according to a fifth modification example, and a front view of a grounding member 30 according to a modification example obtained by sectioning the coupled grounding member 30 W according to the fifth modification example.

FIG. 8 is a plan view (top view) of another example of a process for manufacturing an electronic component package 100 , where an electronic component 10 , electronic components 20 , and coupled grounding members 30 W according to a sixth modification example are held on the base B.

FIG. 9 is a plan view of another example of a process for manufacturing an electronic component package 100 , where an electronic component 10 , electronic components 20 , and coupled grounding members 30 W according to a seventh modification example are held on the base B.

FIG. 10 is a cross-sectional view of an electronic component package 100 A, which is an electronic component package according to a first modification example of the present disclosure.

FIG. 11 is a cross-sectional view of an electronic component package 100 B, which is an electronic component package according to a second modification example of the present disclosure.

Each of FIGS. 12A to 12F is a cross-sectional view illustrating an example of a process for manufacturing the electronic component package 100 B, specifically, part of the process.

Each of FIGS. 13A, 13B and 13C is a cross-sectional view illustrating an example of a process for manufacturing the electronic component package 100 B, specifically, part of the process following the process in FIGS. 12A to 12F .

FIG. 14 is a cross-sectional view of an electronic component package 200 described in the background art.

FIGS. 15A, 15B and 15C include cross-sectional views illustrating part of a process for manufacturing an electronic component package 200 .

Embodiments of the present disclosure will be described below to describe the characteristics of the present disclosure in further detail. The present disclosure is included in, for example, an electronic component package that forms a circuit module required to have a low height, but the application thereof is not limited to this.

Electronic Component Package According to First Embodiment

Structure of Electronic Component Package

A structure and characteristics of an electronic component package 100 , which is an electronic component package according to a first embodiment of the present disclosure, will be described with reference to FIG. 1 and FIGS. 2A and 2B .

The drawings are schematic diagrams. Variations in shape between components resulting from the manufacturing process are not necessarily reflected on the drawings. Specifically, the drawings used for illustration in this description are said to essentially represent an actual product although being different from the actual product in some points.

FIG. 1 is a cross-sectional view of the electronic component package 100 . FIG. 2A is a perspective view of a grounding member 30 included in an electronic component package 100 . FIG. 2B is a perspective partially-cut view of a coupled grounding member 30 W used in a process for manufacturing an electronic component package 100 , described below.

As illustrated in FIG. 1 , the electronic component package 100 includes an electronic component 10 including an external terminal, grounding members 30 , a resin layer 40 , and a conductor film 50 . The electronic component 10 includes an electronic component element 11 , and an external terminal exposed on the surface of the electronic component element 11 . The electronic component 10 is an electronic component, such as an integrated circuit (IC) or a circuit module smaller than the electronic component package 100 .

In the first embodiment, the external terminal includes an outer electrode 12 and solder bumps S 1 , which form the first connecting members connected to the outer electrode 12 . The solder bumps S 1 are formed from a Sn—Ag—Cu-based lead-free solder material. The material for the solder bumps S 1 is not limited to this. As will be described below, the external terminal may not include the solder bumps S 1 .

As illustrated in FIG. 1 , the electronic component package 100 may also include an electronic component 20 that includes an electronic component element 21 and an outer electrode 22 . Examples of the electronic component 20 include a multilayer capacitor, a multilayer inductor, various types of filters, and various types of ICs.

Each grounding member 30 is connected to the ground electrode of a circuit board (not illustrated) of an electronic device when the electronic component package 100 is connected to the circuit board. As illustrated in FIG. 2A , the grounding member 30 includes a multilayer body 31 and an outer conductor 32 disposed at a first end of the multilayer body 31 in the lamination direction. The grounding member 30 may include an outer conductor 33 disposed at a second end of the multilayer body 31 in the lamination direction.

The multilayer body 31 has a first surface P 1 , a second surface P 2 , which is disposed opposite to the first surface P 1 , and third surfaces P 3 , which connect the first surface P 1 and the second surface P 2 to each other. In the first embodiment, the multilayer body 31 is a rectangular parallelepiped. In FIGS. 2A and 2B , the bottom surface corresponds to the first surface P 1 , the top surface corresponds to the second surface P 2 , and the four side surfaces correspond to the third surfaces P 3 . The shape of the multilayer body 31 is not limited to this.

The outer conductor 32 is disposed on the first surface P 1 . When the grounding member 30 includes the outer conductor 33 , the outer conductor 33 is disposed on the second surface P 2 . When the outer conductor 33 is disposed on the second surface P 2 , the top and the bottom of the grounding member 30 do not need to be distinguished from each other, so that the electronic component package 100 can be more efficiently manufactured.

In the first embodiment, the multilayer body 31 includes three resin films 31 a , two pattern conductors 31 b , and three via conductors 31 c . The multilayer body 31 is formed by alternately laminating the resin films 31 a and the pattern conductors 31 b one on another while having the main surface of one of the resin films 31 a serving as the first surface P 1 . The via conductors 31 c are disposed inside the multilayer body 31 , as will be described below. The structure of the multilayer body 31 is not limited to the above. For example, the multilayer body 31 may be constituted of one resin film 31 a , one via conductor 31 c disposed in the resin film 31 a , and one pattern conductor 31 b laminated on the resin film 31 a . The multilayer body 31 may also include components other than the resin films 31 a , the pattern conductors 31 b , and the via conductors 31 c.

In the multilayer body 31 , each of the pattern conductors 31 b has its circumference exposed from the third surfaces P 3 , which are four side surfaces of the multilayer body 31 . The pattern conductors 31 b are electrically connected to the via conductor 31 c having one end exposed from the first surface P 1 , directly or indirectly via the other via conductors 31 c . The first surface P 1 serves as the bottom surface of the multilayer body 31 . In addition to the above structure, at least one of the pattern conductors 31 b may have at least part of the circumference exposed from the third surfaces P 3 of the multilayer body 31 and electrically connected to the via conductor 31 c having one end exposed from the first surface P 1 of the multilayer body 31 (refer to FIGS. 5A, 5B and 5C , below).

The outer conductor 32 is disposed on the first surface P 1 of the multilayer body 31 , and electrically connected to a first end of one of the via conductors 31 c electrically connected to the pattern conductors 31 b having the circumferences exposed from the third surfaces P 3 of the multilayer body 31 . As described above, at least one via conductor 31 c extending in the lamination direction of the multilayer body 31 and connected to the outer conductor 32 is disposed.

The grounding member 30 is formed from, for example, a resin multilayer substrate manufactured by a known manufacturing method. The resin films 31 a are formed from an insulating resin material such as epoxy resin. The pattern conductors 31 b are formed from copper foil. The via conductors 31 c are formed from cured copper paste. The outer conductor 32 is formed from copper foil to which a metal plating film selected from plating films such as Sn, Ni, and Au plating films is applied.

The materials for the components are not limited to the above. For example, the resin films 31 a may be made of a composite material containing a woven or nonwoven fabric of, for example, glass, and an insulating resin such as epoxy resin, or a resin material such as a liquid crystal polymer. The via conductors 31 c may be made of copper plating.

The resin layer 40 covers part of the electronic component 10 and part of the grounding members 30 . Part of the circumferences of the pattern conductors 31 b exposed from the third surfaces P 3 of the multilayer body 31 is exposed from the resin layer 40 . Part of the external terminal of the electronic component 10 , that is, part of the solder bumps S 1 forming the first connecting member s, and part of the outer conductor 32 of the grounding member 30 are exposed from the resin layer 40 . Specifically, part of the solder bumps S 1 serving as the external terminal of the electronic component 10 and part of the outer conductor 32 of the grounding member 30 are exposed from the same surface of the resin layer 40 .

The resin layer 40 is made of a resin material containing, for example, a glass material or silica dispersed as a filler. Instead of this, the resin layer 40 may be simply made or a resin material.

The conductor film 50 covers the surface of the resin layer 40 to be connected to part of the circumferences of the pattern conductors 31 b of the multilayer body 31 exposed from the resin layer 40 . The conductor film 50 is made of a copper film formed by adhering metal fine particles to the resin layer 40 by sputtering. Instead of this, the conductor film 50 may be formed by curing a film of a copper paste.

As will be described below, the electronic component package 100 is efficiently manufactured by, firstly, preparing a semifinished product in the form of an aggregate, and then dividing the semifinished product into pieces with a cutting step using a dicing saw or other devices. As illustrated in FIG. 2B , a semifinished product is manufactured from the coupled grounding member 30 W including the coupled multilayer body 31 W including the via conductors 31 c and formed by alternately laminating a coupled resin film 31 Wa and a coupled pattern conductor 31 Wb.

The coupled grounding member 30 W illustrated in FIG. 2B includes two grounding members 30 . The coupled grounding member 30 W includes, for example, a resin multilayer substrate manufactured by a known manufacturing method, as described above. In the above cutting process, the portion drawn with the broken lines is removed by cutting to separate the coupled grounding member 30 W into two grounding members 30 .

As described above, the coupled grounding member 30 W includes the coupled resin films 31 Wa. Thus, the coupled grounding member 30 W is softer than a coupled unit 283 W of a third portion 283 of a lead frame made of a single metal, as described in the background art. Specifically, the difference in hardness between the coupled grounding member 30 W and a coupled resin layer 40 A (refer to FIG. 3C ), described below, is smaller than the difference in hardness between the coupled unit 283 W and the coupled resin layer 40 A. This structure thus prevents an increase of the resistance of a to-be-cut object against a dicing saw blade that continues cutting into the object after cutting in from the coupled resin layer 40 A and reaching the coupled grounding member 30 W.

Specifically, the pushing force exerted on the coupled grounding member 30 W in the travel direction of the dicing saw blade is small. This small force prevents separation at the interface between the coupled multilayer body and the coupled resin layer. This structure can thus prevent occurrence of structural defects of the finished electronic component package 100 .

Method for Manufacturing Electronic Component Package

A method for manufacturing an electronic component package 100 will be described with reference to FIGS. 3A to 3F , and FIGS. 4A and 4B .

Each of FIGS. 3A to 3F illustrates an example of a process for manufacturing the electronic component package 100 . FIGS. 3A to 3F are schematic cross-sectional views of successive processes performed in an example of a process for manufacturing the electronic component package 100 . FIGS. 3A to 3F correspond to the cross-sectional view of the electronic component package 100 illustrated in FIG. 1 .

FIG. 3A and FIG. 3B are cross-sectional views of a holding step. In the holding step, as illustrated in FIG. 3A , first, a base B including a base member B 1 and an adhesive layer B 2 applied to a first main surface B 11 of the base member B 1 , an electronic component 10 , an electronic component 20 , and coupled grounding members 30 W each formed by coupling multiple grounding members 30 together are manufactured or prepared. The electronic component 10 , the electronic component 20 , and the coupled grounding members 30 W have the above-described structures. Thus, they are not described in detail, here. Examples used as the base B include a known sheet to which an adhesive layer is attached.

As illustrated in FIG. 3B , solder bumps S 1 , which are part of the external terminal of the electronic component 10 , the outer electrodes 22 of the electronic component 20 , and the outer conductors 32 of the coupled grounding members 30 W are arranged on the adhesive layer B 2 . Thus, the base B holds the electronic component 10 , the electronic component 20 , and the coupled grounding members 30 W. FIG. 4A is a plan view of the electronic component 10 , the electronic components 20 , and the coupled grounding members 30 W arranged on the adhesive layer B 2 . The outer conductor 33 is not illustrated. The cross-sectional view illustrated in FIG. 3B corresponds to a cross-sectional view of a semifinished product of the electronic component package in an aggregate illustrated in FIG. 4A , taken along the plan including the line X 1 -X 1 and viewed in the arrow direction.

After being cut in a cutting step described below, multiple coupled grounding members 30 W are arranged while the third surfaces P 3 , which are cut surfaces, are exposed on the sixth surfaces P 6 , which are four side surfaces of the resin layer 40 . In this arrangement, part of the circumferences of the cut pattern conductors 31 b is exposed from the third surfaces P 3 and the sixth surfaces P 6 . Specifically, the pattern conductors 31 b exposed from the four side surfaces of the resin layer 40 and the conductor film 50 can be grounded.

As illustrated in FIG. 4B , the coupled grounding members 30 W may be arranged so that the grounding members 30 obtained after cutting are disposed in an area in the electronic component package 100 where few electronic components 10 and few electronic components 20 are disposed. As in the case of FIG. 4A , the outer conductor 33 is not illustrated. Specifically, when each electronic component is disposed at a portion in the electronic component package 100 near the side surfaces, the coupled grounding members 30 W can be arranged, while avoiding the above portion, on side surfaces where the electronic components are not disposed nearby. Thus, the electronic component package 100 can achieve size reduction.

FIG. 3C is a cross-sectional view of a resin-layer application step. In the resin-layer application step, a coupled resin layer 40 A is applied onto the adhesive layer B 2 . The coupled resin layer 40 A includes a fourth surface P 4 , which comes into contact with the adhesive layer B 2 , and a fifth surface P 5 , which is disposed opposite to the fourth surface P 4 . At this time, the coupled resin layer 40 A covers the surface of the electronic component 10 excluding the area touching the adhesive layer B 2 on the solder bumps S 1 , the surface of the electronic component 20 excluding the area touching the adhesive layer B 2 on the outer electrode 22 , and the surfaces of the coupled grounding members 30 W excluding the areas touching the adhesive layer B 2 on the outer conductors 32 .

FIG. 3D is a cross-sectional view illustrating a removal step. In the removal step, the base B is removed to expose the fourth surface P 4 , and expose part of the solder bumps S 1 of the electronic component 10 , part of the outer electrodes 22 of the electronic component 20 , and part of the outer conductors 32 of the coupled grounding members 30 W from the fourth surface P 4 of the coupled resin layer 40 A. This removal step is performed by, for example, separating the base B from the coupled resin layer 40 A.

FIG. 3E is a cross-sectional view illustrating the cutting step. In the cutting step, the dicing saw blade D is used to cut the coupled resin layer 40 A into resin layers 40 each having the fourth surface P 4 , the fifth surface P 5 , and the sixth surfaces P 6 , which connect the fourth surface P 4 and the fifth surface P 5 together. In the present embodiment, each resin layer 40 is a rectangular parallelepiped. When the bottom surface of the rectangular parallelepiped serves as the fourth surface P 4 , and the upper surface of the rectangular parallelepiped serves as the fifth surface P 5 , the four side surfaces serve as the sixth surfaces P 6 .

In this step, each of the coupled grounding members 30 W is cut together with the coupled resin layer 40 A into two grounding members 30 , and part of the circumferences of the pattern conductors 31 b is exposed from the third surfaces P 3 and the sixth surfaces P 6 .

FIG. 3F is a cross-sectional view illustrating a conductor-film application step. In the conductor-film application step, a conductor film is applied to the fifth surface P 5 and the sixth surfaces P 6 , which are surfaces of the resin layer 40 , to be connected to part of the circumferences of the pattern conductors 31 b exposed from the sixth surfaces P 6 .

With the above method for manufacturing the electronic component package 100 , the dicing saw blade D bears a smaller load when cutting the coupled grounding members 30 W, than when cutting coupled grounding members described in the background art, which are all made of metal. In addition, the hardness of a to-be-cut object changes little during cutting. This structure can thus reduce operations of replacing the dicing saw blade D required with a wearing out of the dicing saw blade D that continues cutting the to-be-cut object or required with distortion and breakage. Thus, the electronic component package 100 can be smoothly manufactured.

Coupled Multilayer Body Modification Example

The structures and characteristics of coupled grounding members 30 W according to first to seventh modification examples used for manufacturing the electronic component package 100 according to the first embodiment will be described with reference to FIG. 5A to FIG. 9 .

FIGS. 5A, 5B and 5C include bottom views of coupled grounding members 30 W according to the first to third modification examples. The coupled grounding members 30 W according to the first to third modification examples basically have the same structure as the coupled grounding members 30 W according to the first embodiment.

FIG. 5A is a plan view of one coupled grounding member 30 W according to the first modification example. In the first modification example illustrated in FIG. 5A , the coupled multilayer body 31 W includes a rectangular coupled pattern conductor 31 Wb, as in the case of the coupled grounding member 30 W according to the first embodiment. However, the coupled pattern conductor 31 Wb is not exposed from the side surfaces of the coupled multilayer body 31 W. Specifically, the pattern conductors 31 b of the multilayer body 31 obtained by cutting the coupled multilayer body 31 W according to the first modification example are exposed only from the cut surfaces among the third surfaces P 3 , without touching the side surfaces adjacent to the cut surfaces.

In the first modification example, the side surfaces of the coupled multilayer body 31 W are formed from coupled resin films 31 Wa. Thus, the side surfaces are more tightly in contact with the coupled resin layer 40 A, which are both made of resin materials. Thus, separation at the interface between the coupled grounding member 30 W and the coupled resin layer 40 A is more effectively prevented. Thus, structural defects of the finished electronic component package 100 are more effectively prevented.

FIG. 5B is a plan view of one coupled grounding member 30 W according to a second modification example. In the second modification example illustrated in FIG. 5B , the coupled multilayer body 31 W includes a coupled pattern conductor 31 Wb having a shape of dumbbells in a plan view. As in the case of the first modification example, the coupled pattern conductor 31 Wb is not exposed from the side surfaces of the coupled multilayer body 31 W.

This structure can also obtain the same effects as those of the first modification example. In the second modification example, the interface between the resin film 31 a and the exposed pattern conductor 31 b is reduced in the cross section of the multilayer body 31 , compared to that in the first modification example. This structure can thus effectively prevent defects, such as separation at the interface between the resin film 31 a and the exposed pattern conductor 31 b during the cutting step, or intrusion of moisture at the interface.

FIG. 5C is a plan view of one coupled grounding member 30 W according to the third modification example. In the third modification example illustrated in FIG. 5C , the coupled multilayer body 31 W includes a coupled pattern conductor 31 Wb that is exposed after cutting, continuous between the cut surface and part of the side surfaces adjacent to the cut surface without being exposed from other side surface.

This structure also has the same effects as those of the first modification example. In the third modification example, the exposed pattern conductors 31 b have an area the same as that in the first embodiment in the cut surface of the multilayer body 31 . Specifically, the area over which the pattern conductors 31 b are coupled to the conductor film 50 is not reduced from the area over which they are coupled in the first embodiment. Thus, the conductor film 50 can be effectively grounded.

Each of FIGS. 6A, 6B and 6C illustrates a coupled grounding member 30 W according to a fourth modification example. FIG. 6A is a bottom view of the coupled grounding member 30 W. FIG. 6B is a cross-sectional view of the coupled grounding member 30 W illustrated in FIG. 6A , taken along the plane including the line X 2 -X 2 and viewed in the arrow direction. FIG. 6C is a front view of a grounding member 30 according to a modification example obtained by cutting the coupled grounding member 30 W according to the fourth modification example.

In the fourth modification example illustrated in FIGS. 6A, 6B and 6C , the coupled multilayer body 31 W includes, as multiple via conductors 31 c , two via conductors 31 c 1 and one via conductor 31 c 2 . The via conductors 31 c 1 are arranged at the same positions as those in the coupled multilayer body 31 W according to the first embodiment. On the other hand, as illustrated in FIGS. 2A and 2B , the via conductor 31 c 2 is arranged to overlap a portion that is to be cut off in the cutting step. The number of the via conductor 31 c 2 is not limited to one.

Specifically, as illustrated in FIG. 6C , the multilayer body 31 obtained by cutting the coupled multilayer body 31 W according to the fourth modification example has a third surface P 3 , which is a cut surface, from which the cut via conductor 31 c 2 is exposed in addition to the pattern conductors 31 b . Thus, the electrically contact area between the grounding member 30 and the conductor film 50 increases. Thus, the conductor film 50 can be further effectively grounded.

Each of FIGS. 7A, 7B and 7C illustrates a coupled grounding member 30 W according to the fifth modification example. FIG. 7A is a bottom view of the coupled grounding member 30 W. FIG. 7B is a cross-sectional view of the coupled grounding member 30 W illustrated in FIG. 7A , taken along the plane including the line X 3 -X 3 and viewed in the arrow direction. FIG. 7C is a front view of the grounding member 30 according to a modification example obtained by cutting the coupled grounding member 30 W according to the fifth modification example.

The coupled grounding member 30 W according to the fifth modification example illustrated in FIGS. 7A, 7B and 7C basically has a structure the same as that of the coupled grounding member 30 W according to the first embodiment. The fifth modification example is square in a plan view. The outer conductors 32 are arranged to be symmetric on a diagonal of the first surface P 1 . Specifically, the portion that is cut off in the cutting step is an area indicated with the broken lines in FIG. 7A , including a diagonal orthogonal to the diagonal on which the outer conductors 32 are arranged in the plan view. Thus, the grounding members 30 obtained after cutting have a shape of right-angled isosceles triangles in a plan view.

In this case, the area over which the pattern conductors 31 b are exposed in the cut surface of the multilayer body 31 can be increased. Thus, the electrically contact area between the grounding member 30 and the conductor film 50 increases. The conductor film 50 can thus be further effectively grounded.

FIG. 8 is a plan view of another example of a process for manufacturing an electronic component package 100 , where the solder bumps S 1 of the electronic component 10 , the outer electrodes 22 of the electronic components 20 , the outer conductors 32 of coupled grounding members 30 W according to a sixth modification example are arranged on an adhesive layer B 2 . Each of the coupled grounding members 30 W according to the sixth modification example corresponds to the multiple coupled grounding members 30 W according to the first embodiment connected together while having the portions cut into the grounding members 30 arranged on the same plane. The outer conductor 33 is not illustrated.

Here, the pattern conductors 31 b are exposed at separate areas from each of the third surfaces P 3 , which are cut surfaces of each coupled grounding member 30 W. The number of the coupled grounding members 30 W connected together is not limited to a particular number.

FIG. 9 is a plan view of another example of a process for manufacturing an electronic component package 100 , where solder bumps S 1 of the electronic component 10 , the outer electrodes 22 of the electronic components 20 , and the outer conductors 32 of coupled grounding members 30 W according to a seventh modification example are arranged on an adhesive layer B 2 . Each of the coupled grounding member 30 W according to the seventh modification example includes the coupled grounding members 30 W according to the sixth modification example connected together in a mesh form. As in FIG. 8 , the outer conductor 33 is not illustrated in FIG. 9 .

Here, the pattern conductors 31 b after cutting has a shape of a single window frame, with sides from each of which the grounding members 30 are exposed at separate areas. As in the case of the sixth modification example, the number of coupled grounding members 30 W connected together is not limited to a particular number.

In the process for manufacturing the electronic component package 100 , the coupled grounding members 30 W according to sixth and seventh modification examples are used to reduce time taken to arrange the coupled grounding members 30 W on the adhesive layer B 2 .

Modification Example of Electronic Component Package According to First Embodiment

The structure and characteristics of an electronic component package 100 A, which is a modification example of the electronic component package 100 according to the first embodiment, will be described with reference to FIG. 10 .

FIG. 10 is a cross-sectional view of the electronic component package 100 A. The electronic component package 100 A basically has the same structure as that of the electronic component package 100 , and includes an electronic component 10 A including an external terminal, grounding members 30 , a resin layer 40 , and a conductor film 50 . However, the external terminal of the electronic component 10 A does not include the solder bumps S 1 .

The electronic component package 100 A also obtains the same effects as those of the electronic component package 100 . Compared to the electronic component package 100 , the electronic component package 100 A can reduce its height by the absence of the solder bumps S 1 . Thus, an electronic device on which the electronic component package 100 A is mounted can reduce its size.

Electronic Component Package According to Second Embodiment

Structure of Electronic Component Package

The structure and characteristics of an electronic component package 100 B, which is an electronic component package according to a second embodiment of the present disclosure, will be described with reference to FIG. 11 .

FIG. 11 is a cross-sectional view of the electronic component package 100 B. The electronic component package 100 B includes an electronic component 10 including an external terminal, grounding members 30 , a solder member S 2 forming a second connecting member, a resin layer 40 , and a conductor film 50 . The electronic component 10 , the grounding members 30 , the resin layer 40 , and the conductor film 50 are similar to those of the first embodiment, and thus are not described here. When the electronic component package 100 B includes an electronic component 20 as illustrated in FIG. 11 , the same as in the first embodiment holds true for the electronic component 20 .

In the electronic component package 100 B, the external terminal of the electronic component 10 includes an outer electrode 12 and solder bumps S 1 forming the first connecting members. The solder members S 2 are connected to the outer conductor 32 of the grounding member 30 . When the electronic component package 100 B includes the electronic component 20 , as illustrated in FIG. 11 , the solder members S 2 are also connected to the outer electrodes 22 of the electronic component 20 .

The resin layer 40 covers the electronic component 10 , the grounding members 30 , and the solder members S 2 . Here, part of the circumferences of the pattern conductors 31 b exposed from the third surfaces P 3 of the multilayer body 31 is exposed from the resin layer 40 . In addition, part of the solder bumps S 1 and part of the solder members S 2 are exposed from the resin layer 40 .

The electronic component package 100 B can also obtain the same effects as those of the electronic component package 100 . In addition, the electronic component package 100 B also has the following effects.

When the conductor film 50 is formed on the resin layer 40 by sputtering, metal fine particles may fail to fully adhere to the mount surface near the side surface. Also, when the conductor film 50 is formed with a copper paste and a device such as a spin coat, the copper paste may fail to fully cover the surface. Specifically, when arranged on the mount surface near the side surfaces, the pattern conductors 31 b in the multilayer body 31 may fail to be fully connected to the conductor film 50 .

On the other hand, in the electronic component package 100 B, the multilayer bodies 31 of the grounding members 30 are spaced apart from the bottom surface of the resin layer 40 with the solder members S 2 that is connected to the outer conductors 32 . Specifically, the pattern conductors 31 b in each multilayer body 31 are spaced apart from the bottom surface by the distance of the solder member S 2 . This structure can thus prevent the above problem, and allows the pattern conductors 31 b in the multilayer body 31 and the conductor film 50 to be fully connected together.

Method for Manufacturing Electronic Component Package

A method for manufacturing the electronic component package 100 B will be described with reference to FIGS. 12A to 12F and FIGS. 13A, 13B and 13C .

Each of FIGS. 12A to 12F and FIGS. 13A, 13B and 13C illustrates an example of a process for manufacturing the electronic component package 100 B. FIGS. 12A to 12F are schematic cross-sectional views illustrating sequential steps performed in an example of the process for manufacturing the electronic component package 100 B. FIGS. 13A to 13C are schematic cross-sectional views of the steps following the steps in FIGS. 12A to 12F . Each of the cross-sectional views in FIGS. 12A to 12F and FIGS. 13A, 13B and 13C corresponds to the cross-sectional view of the electronic component package 100 B illustrated in FIG. 11 .

FIGS. 12A to 12E are cross-sectional views illustrating a holding step. In the holding step, first, as illustrated in FIG. 12A , a metal base MB, which includes a metal base member MB 1 and a photoresist layer MB 2 applied to a first main surface MB 11 of the metal base member MB 1 , an electronic component 10 , an electronic component 20 , coupled grounding members 30 W each including multiple grounding members 30 coupled together, and solder paste (not illustrated) serving as the solder members S 2 are manufactured or prepared. The electronic component 10 , the electronic component 20 , and the coupled grounding members 30 W have the above-described structures. Thus, the detailed description thereof will not be described.

Examples used as the metal base member MB 1 include metal foil on which the lead-free solder containing Sn has high wettability and that contains a material having a contact angle of smaller than or equal to 10°, such as copper foil having a thickness of, for example, greater than or equal to 40 μm and smaller than or equal to 100 μm. Examples used as the photoresist layer MB 2 include a film that easily repels the above solder material and contains a material having a contact angle of higher than or equal to 90°, such as an aluminum film with a thickness of, for example, greater than or equal to 0.1 μm and smaller than or equal to 10 μm. The above photoresist layer MB 2 is applied to the first main surface of the metal base member MB 1 by, for example, sputtering. However, the metal base member MB 1 and the photoresist layer MB 2 are not limited to the above.

Subsequently, as illustrated in FIG. 12B , multiple through-holes H are formed in the photoresist layer MB 2 . The multiple through-holes H are formed by irradiating the photoresist layer MB 2 with a laser beam LB to remove areas of the photoresist layer MB 2 on which the laser beam LB is irradiated. Examples used as the laser beam LB include a YAG laser beam and a CO 2 laser beam. The laser beam LB has its properties, such as the irradiation spot diameter and the laser beam output, adjusted so that the areas of the first main surface MB 11 of the metal base member MB 1 in which the through-holes H are formed retain their flatness.

Subsequently, as illustrated in FIG. 12C , some of the through-holes H relating to the connection between the electronic component 20 or the coupled grounding members 30 W and the metal base member MB 1 are filled with solder paste SP 2 , serving as the solder members S 2 forming second connecting members. The through-holes H are filled with the solder paste SP 2 by, for example, screen printing. In the example illustrated in FIG. 12C , the through-holes H for the connection between the electronic component 10 and the metal base member MB 1 are left without being filled with the solder paste SP 2 .

As illustrated in FIG. 12D , the solder bumps S 1 that form the first connecting members in the external terminal of the electronic component 10 are connected, by ultrasonic bonding or another method, to the portions of the metal base member MB 1 exposed through the through-holes H.

The electronic component 20 and the coupled grounding members 30 W are mounted on the solder paste SP 2 , and subjected to reflow in this state. Thus, as illustrated in FIG. 12E , the outer electrodes 22 of the electronic component 20 and the outer conductors 32 of the coupled grounding members 30 W are connected to the portions of the metal base member MB 1 exposed through the through-holes H via the solder members S 2 . Thus, the electronic component 10 , the electronic component 20 , and the coupled grounding members 30 W are held on the metal base MB.

The solder bumps S 1 are made of the same solder material as that in the first embodiment. The solder members S 2 are made of the same solder material as that for the solder bumps S 1 . However, the solder bumps S 1 and the solder members S 2 may be made of different solder materials.

Connection of the electronic component 10 to the metal base member MB 1 and connection of the electronic component 20 and the coupled grounding members 30 W to the metal base member MB 1 may be performed in the reverse order. Alternatively, all the through-holes H may be filled with the solder paste SP 2 to connect the electronic component 10 to the metal base member MB 1 via the solder bumps S 1 and the solder members S 2 . In this case, the first connecting members include the solder bumps S 1 and the solder members S 2 .

FIG. 12F is a cross-sectional view illustrating a resin-layer application step. In the resin-layer application step, a coupled resin layer 40 A is applied to the photoresist layer MB 2 . The coupled resin layer 40 A has a fourth surface P 4 , which is in contact with the photoresist layer MB 2 , and a fifth surface P 5 , which is disposed opposite to the fourth surface P 4 . Here, the coupled resin layer 40 A covers the surface of the electronic component 10 excluding an area over which the solder bumps S 1 are connected to the metal base member MB 1 and the area over which they are in contact with the photoresist layer MB 2 , the surface of the electronic component 20 excluding an area over which the outer electrodes 22 are connected to the solder members S 2 , the surface of the coupled grounding members 30 W excluding an area over which the outer conductors 32 are connected to the solder members S 2 , and the exposed surfaces of the solder members S 2 .

FIG. 13A is a cross-sectional view illustrating a removal step. In the removal step, the metal base MB is removed to expose the fourth surface P 4 , and to expose, from the fourth surface P 4 , part of the solder bumps S 1 on the electronic component 10 , part of the solder members S 2 connected to the outer electrodes 22 of the electronic component 20 , and part of the solder members S 2 connected to the outer conductors 32 of the coupled grounding members 30 W. This removal step is performed by dissolving the metal base MB by etching.

Examples of an etchant used to dissolve copper foil serving as the metal base member MB 1 for removal include a CuCl 2 solution. Examples of an etchant used to dissolve an Al film serving as the photoresist layer MB 2 for removal include a FeCl 3 solution. In either case, an etchant that does not dissolve the coupled resin layer 40 A is used.

FIG. 13B is a cross-sectional view illustrating a cutting step. In the cutting step, the coupled resin layer 40 A is cut with the dicing saw blade D into resin layers 40 , each having a fourth surface P 4 , a fifth surface P 5 , and sixth surfaces P 6 , which connect the fourth surface P 4 and the fifth surface P 5 . Specifically, each resin layer 40 is a rectangular parallelepiped. When the bottom surface of the rectangular parallelepiped is defined as the fourth surface P 4 , and the upper surface of the rectangular parallelepiped is defined as the fifth surface P 5 , the four side surfaces serve as the sixth surfaces P 6 .

In this step, each coupled grounding member 30 W is divided into two grounding members 30 , and part of the circumferences of the pattern conductors 31 b is exposed from the third surfaces P 3 and the sixth surfaces P 6 .

FIG. 13C is a cross-sectional view illustrating a conductor-film application step. In the conductor-film application step, the conductor film is applied to the fifth surface P 5 and the sixth surfaces P 6 of the resin layer 40 to be connected to part of the circumferences of the pattern conductors 31 b exposed from the sixth surfaces P 6 .

The above method for manufacturing the electronic component package 100 B can achieve the same effects as those of the above method for manufacturing the electronic component package 100 .

Embodiments described herein are mere examples. The present disclosure is not limited to the above embodiments or modification examples, and may be changed or modified in various manners within the scope of the present disclosure.

100 electronic component package 10 electronic component 11 electronic component element 12 outer electrode 30 grounding member 31 multilayer body 31 a resin film 31 b pattern conductor 31 c via conductor 32 , 33 outer conductor 40 resin layer 50 conductor film S 1 solder bump (first connecting member)