Inventor
AKIO KATSUBE
Inventor
JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H01LSemiconductor devices26%
H05KPrinted circuits26%
H01QAntennas, i.e. radio aerials5%
H01RElectrically-conductive connections5%
H03HImpedance networks, e.g. resonant circuits5%
PatentTitleYear
12,300,587Electronic component module202511,889,625Module and method of manufacturing the same202411,510,311Electronic component module and method for manufacturing electronic component module202211,302,593Electronic component package and method for manufacturing the same202211,276,631Module and method of manufacturing module202211,196,405Electronic component and method of manufacturing the same202111,178,778High frequency module2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to MURATA MANUFACTURING CO (7)· patent assignee history
2021–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 7 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 7 | 2021–2025 |