Patterned epitaxial substrate and semiconductor structure

This application claims the priority benefit of Taiwan patent application serial no. 108117777, filed on May 23, 2019. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.

The disclosure relates to a substrate structure and a semiconductor structure; more particularly, the disclosure relates to a patterned epitaxial substrate and a semiconductor structure to which the patterned epitaxial substrate is applied.

With the advancement of photoelectric technologies, the volume of many photoelectric devices has gradually become smaller and smaller. In the process of manufacturing a micro light-emitting diode (LED), it is necessary to grow another different material (such as an epitaxial structure) on one material (such as an epitaxial substrate); in this case, the thermal expansion coefficient and the atomic lattice matching level of the two materials must be taken into consideration. The thermal temperature difference or the difference in the thermal expansion coefficient in a heating process and a lattice mismatch lead to uneven distribution of stresses, stress unevenness, thus causing warpage of the edge of the epitaxial substrate and resulting in a decrease in yield of subsequent manufacturing processes.

The disclosure provides a patterned epitaxial substrate capable of preventing the warpage of the edge in the heating process and improving the yield of the subsequent manufacturing processes.

The disclosure further provides a semiconductor structure including the aforesaid patterned epitaxial substrate and featuring good photoelectric properties and reliability.

The disclosure further provides a semiconductor structure configured to adjust full band wavelength uniformity.

According to an embodiment of the disclosure, a patterned epitaxial substrate including a substrate and a plurality of patterns is provided. The substrate has a first zone and a second zone surrounding the first zone. The first zone and the second zone are disposed in a concentric manner. The patterns and the substrate are integrally formed, and the patterns are disposed on the substrate. The patterns include a plurality of first patterns and a plurality of second patterns. The first patterns are disposed in the first zone. The second patterns are disposed in the second zone. Sizes of the first patterns are different from sizes of the second patterns.

In an embodiment of the disclosure, a shape of each of the patterns includes a cylinder, a polygonal cylinder, a cone, or a polygonal cone.

In an embodiment of the disclosure, each of the first patterns has a first orthogonal projection area on the substrate, each of the second patterns has a second orthogonal projection area on the substrate, and the first orthogonal projection area is greater than the second orthogonal projection area.

In an embodiment of the disclosure, each of the first patterns has a first vertical height on the substrate, and each of the second patterns has a second vertical height on the substrate. Each of the first patterns has a first bottom width on the substrate, and each of the second patterns has a second bottom width on the substrate. The first vertical height is greater than the second vertical height, and the first bottom width is greater than the second bottom width.

In an embodiment of the disclosure, each of the patterns has a bottom width and a height, and a ratio of the height to the bottom width is from 0.2 to 0.9.

In an embodiment of the disclosure, the height is greater than or equal to 10 nm and less than or equal to 1500 nm, and the bottom width is greater than or equal to 0.1 μm and less than or equal to 2 μm.

In an embodiment of the disclosure, there is a first pitch between any two adjacent first patterns of the first patterns, there is a second pitch between any two adjacent second patterns of the second patterns, and the first pitch is less than the second pitch.

In an embodiment of the disclosure, there is a first pitch between any two adjacent patterns of the patterns, and the pitch is less than or equal to 0.5 μm.

In an embodiment of the disclosure, a ratio of the first zone to the substrate is from 0.4 to 0.8.

In an embodiment of the disclosure, the substrate further has a third zone surrounding the second zone, and the third zone, the second zone, and the first zone are disposed in a concentric manner. The patterns further include third patterns. The third patterns are disposed in the third zone, and sizes of the third patterns are different from the sizes of the second patterns and the sizes of the first patterns.

In an embodiment of the disclosure, a ratio of the first zone to the substrate is from 0.4 to 0.8, and a ratio of the second zone to the substrate is from 0.1 to 0.5.

In an embodiment of the disclosure, each of the first patterns has a first orthogonal projection area on the substrate. Each of the second patterns has a second orthogonal projection area on the substrate. Each of the third patterns has a third orthogonal projection area on the substrate. The first orthogonal projection area, the second orthogonal projection area, and the third orthogonal projection area appear to have a progressive change in a radial direction from each of the first patterns to each of the third patterns.

In an embodiment of the disclosure, each of the first patterns has a first vertical height on the substrate. Each of the second patterns has a second vertical height on the substrate. Each of the third patterns has a third vertical height on the substrate. The first vertical height, the second vertical height, and the third vertical height appear to have a progressive change in a radial direction from each of the first patterns to each of the third patterns.

In an embodiment of the disclosure, there is a first pitch between any two adjacent first patterns of the first patterns, there is a second pitch between any two adjacent second patterns of the second patterns, and there is a third pitch between any two adjacent second patterns of the third patterns. The first pitch, the second pitch, and the third pitch appear to have a progressive change in a radial direction from each of the first patterns to each of the third patterns.

In an embodiment of the disclosure, each of the first patterns has a first bottom width on the substrate, each of the second patterns has a second bottom width on the substrate, and each of the third patterns has a third bottom width on the substrate. The first bottom width, the second bottom width, and the third bottom width appear to have a progressive change in a radial direction from each of the first patterns to each of the third patterns.

In an embodiment of the disclosure, a rate of the progressive change is from 1% to 5%.

According to an embodiment of the disclosure, a semiconductor structure including a patterned epitaxial substrate, a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor layer is provided. The patterned epitaxial substrate includes a substrate and a plurality of patterns. The substrate has a first zone and a second zone surrounding the first zone, wherein the first zone and the second zone are disposed in a concentric manner. The patterns and the substrate are integrally formed, and the patterns are disposed on the substrate. The patterns include a plurality of first patterns and a plurality of second patterns. The first patterns are disposed in the first zone. The second patterns are disposed in the second zone. Sizes of the first patterns are different from sizes of the second patterns. The first-type semiconductor layer is disposed on the patterned epitaxial substrate. The light-emitting layer is disposed on the first-type semiconductor layer. The second-type semiconductor layer is disposed on the light-emitting layer.

In an embodiment of the disclosure, the substrate further has a third zone surrounding the second zone, and the third zone, the second zone, and the first zone are disposed in a concentric manner. The patterns further include a plurality of third patterns disposed in the third zone, and sizes of the third patterns are different from the sizes of the second patterns and the sizes of the first patterns.

According to an embodiment of the disclosure, a semiconductor structure including a first-type semiconductor layer, a plurality of patterns, a light-emitting layer, and a second-type semiconductor layer is provided. The first-type semiconductor layer has a top surface and a bottom surface opposite to each other. The bottom surface has a first zone and a second zone surrounding the first zone. The first zone and the second zone are disposed in a concentric manner. The patterns are disposed on the bottom surface of the first-type semiconductor layer, and the patterns and the first-type semiconductor layer are integrally formed. The patterns include a plurality of first patterns and a plurality of second patterns. The first patterns are disposed in the first zone. The second patterns are disposed in the second zone. Sizes of the first patterns are different from sizes of the second patterns. The light-emitting layer is disposed on the top surface of the first-type semiconductor layer. The second-type semiconductor layer is disposed on the light-emitting layer.

In an embodiment of the disclosure, the first-type semiconductor layer further has a third zone surrounding the second zone, and the third zone, the second zone, and the first zone are disposed in a concentric manner. The patterns further include a plurality of third patterns disposed in the third zone, and sizes of the third patterns are different from the sizes of the second patterns and the sizes of the first patterns.

In view of the above, according to the design of the patterned epitaxial substrate provided in one or more embodiments of the disclosure, the patterns and the substrate are integrally formed, the first zone and the second zone of the substrate are disposed in a concentric manner, and the sizes of the first patterns disposed in the first zone are different from the sizes of the second patterns in the second zone. Thereby, the issue of the warpage of the edge of the conventional substrate in the heating process can be effectively prevented, and the yield of the subsequent manufacturing processes can be improved. Besides, the semiconductor structure to which the aforesaid patterned epitaxial substrate is applied can have good photoelectric properties and reliability.

To make the above features and advantages provided in one or more of the embodiments of the disclosure more comprehensible, several embodiments accompanied with drawings are described in detail as follows.

The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles described herein.

FIG. 1A is a schematic top view of a patterned epitaxial substrate according to an embodiment of the disclosure.

FIG. 1B is a schematic cross-sectional view of the patterned epitaxial substrate depicted in FIG. 1A along a line segment A-A′.

FIG. 2A is a schematic three-dimensional view of a portion of a patterned epitaxial substrate according to another embodiment of the disclosure.

FIG. 2B is a schematic three-dimensional view of a portion of a patterned epitaxial substrate according to still another embodiment of the disclosure.

FIG. 2C is a schematic cross-sectional view of a patterned epitaxial substrate according to still another embodiment of the disclosure.

FIG. 3A is a schematic top view of a patterned epitaxial substrate according to another embodiment of the disclosure.

FIG. 3B is a schematic cross-sectional view of the patterned epitaxial substrate depicted in FIG. 3A along a line segment B-B′.

FIG. 4 is a schematic top view of a patterned epitaxial substrate according to still another embodiment of the disclosure.

FIG. 5A is a schematic cross-sectional view of a semiconductor structure according to an embodiment of the disclosure.

FIG. 5B is a schematic cross-sectional view of a semiconductor structure according to another embodiment of the disclosure.

FIG. 6A is a schematic cross-sectional view of a semiconductor structure according to still another embodiment of the disclosure.

FIG. 6B is a schematic cross-sectional view of a semiconductor structure according to still another embodiment of the disclosure.

FIG. 1A is a schematic top view of a patterned epitaxial substrate according to an embodiment of the disclosure. FIG. 1B is a schematic cross-sectional view of the patterned epitaxial substrate depicted in FIG. 1A along a line segment A-A′. With reference to FIG. 1A , a patterned epitaxial substrate 100 a provided in the embodiment includes a substrate 110 a and a plurality of patterns 120 a . The substrate 110 a has a center point C and has a first zone 112 a and a second zone 114 a surrounding the first zone 112 a . Specifically, the first zone 112 a and the second zone 114 a of the substrate 110 a are disposed in a concentric manner. In particular, the first zone 112 a and the second zone 114 a of the substrate 110 a , which should however not be construed as a limitation in the disclosure. Note that a ratio of the first zone 112 a to the substrate 110 a is from 0.4 to 0.8. If the ratio of the first zone 112 a to the substrate 110 a is less than 0.4 or greater than the 0.8, the problem of warpage of the edge cannot be well solved. Herein, the substrate 110 a is suitable for epitaxial growth, such as a sapphire substrate, a silicon wafer substrate, a carbide substrate, or a polymer substrate, which should however not be construed as a limitation in the disclosure.

According to the present embodiment, note that the substrate 110 a is divided into two zones (i.e., the first zone 112 a and the second zone 114 a ) sharing the same center, and the first zone 112 a and the second zone 114 a respectively have the circular profile, which should however not be construed as limitations in the disclosure. In other embodiments that are not shown in the drawings, the substrate can also be divided into three or more zones sharing the same center, and the shape of each region can be a rectangular shape, a polygonal shape, or any other appropriate shape.

Besides, in this embodiment, the patterns 120 a provided and substrate 110 a are integrally formed, i.e., the patterns 120 a and the substrate 110 a are made of the same material and connected in a seamless manner. As shown in FIG. 1A , the patterns 120 a provided in the embodiment are arranged in an array on the substrate 110 a , and the patterns 120 a include a plurality of first patterns 122 a and a plurality of second patterns 124 a . The first patterns 122 a are disposed in the first zone 112 a , and the second patterns 124 a are disposed in the second zone 114 a . In an embodiment that is not shown in the drawings, the first patterns and the second patterns can also be arranged not in an array. Specifically, sizes of the first patterns 122 a are different from sizes of the second patterns 124 a.

In detail, each of the first patterns 122 a has a first orthogonal projection area on the substrate 110 a , and each of the second patterns 124 a has a second orthogonal projection area on the substrate 110 a . In the present embodiment, the first orthogonal projection area is greater than the second orthogonal projection area. That is, the sizes of the first patterns 122 a located in the first zone 112 a of the substrate 110 a are greater than the sizes of the second patterns 124 a located in the second zone 114 a.

With reference to FIG. 1B , as shown in the cross-sectional view, the cross-sectional shape of each of the patterns 120 a is a convex pattern, which should however not be construed as a limitation in the disclosure. In detail, each of the first patterns 122 a has a first vertical height H 1 and a first bottom width W 1 , and there is a first pitch P 1 between the adjacent first patterns 122 a . Each of the second patterns 124 a has a second vertical height H 2 and a second bottom width W 2 , and there is a second pitch P 2 between the adjacent second patterns 124 a . In the present embodiment, the first vertical height H 1 is greater than the second vertical height H 2 , the first bottom width W 1 is greater than the second bottom width W 2 , and the first pitch P 1 is less than the second pitch P 2 . That is, the sizes of the first patterns 122 a located in the first zone 112 a of the substrate 110 a are greater than the sizes of the second patterns 124 a located in the second zone 114 a . Since the sizes of the second patterns 124 a are relatively small, stresses can be dispersed in the epitaxial growth process, so as to better solve the problem of warpage of the edge of the epitaxial substrate. Certainly, in other embodiments that are not shown in the drawings, the sizes of the first patterns located in the first zone of the substrate can also be smaller than the sizes of the second patterns located in the second zone according to actual demands, which still falls within the scope of protection in the disclosure. Note that the sizes include the orthogonal projection area, the vertical height, the bottom width, or the pitch between the adjacent patterns. As long as any of the orthogonal projection area, the vertical height, the bottom width, and the pitch is different, the sizes are deemed different.

Specifically, in an embodiment, a ratio of the height H and the bottom width W of the patterns 120 a is, for instance, from 0.2 to 0.9. If the ratio of the height H and the bottom width W of the patterns 120 a is greater than 0.9, defects are generated in an epitaxial structure (not shown) subsequently formed on the patterned epitaxial substrate 100 a . By contrast, if the ratio of the height H and the bottom width W of the patterns 120 a is less than 0.2, the light-emitting efficiency of the epitaxial structure subsequently formed on the patterned epitaxial substrate 100 a cannot be improved. In an embodiment, if the height H of the patterns 120 a is, for instance, greater than or equal to 10 nm and less than or equal to 1500 nm, the epitaxial structure subsequently formed on the patterned epitaxial substrate 100 a can have favorable light-emitting efficiency. In another embodiment, the bottom width W of the patterns 120 a is, for instance, greater than or equal to 0.1 μm and less than or equal to 2.5 μm, so that the epitaxial structure subsequently formed on the patterned epitaxial substrate 100 a can have favorable light-emitting efficiency. Besides, there is a pitch P between any two adjacent patterns 120 a , and the pitch P in an embodiment is less than or equal to 0.5 μm, which allows the epitaxial structure subsequently formed on the patterned epitaxial substrate 100 a to have favorable light-emitting efficiency.

In brief, according to the design of the patterned epitaxial substrate 100 a provided in the embodiment, the patterns 120 a and the substrate 110 a are integrally formed, and the first zone 112 a and the second zone 114 a of the substrate 110 a are disposed in a concentric manner. Specifically, the sizes of the first patterns 122 a disposed in the first zone 112 a of the substrate 110 a are different from the sizes of the second patterns 124 a located in the second zone 114 a . Thereby, the issue of the warpage of the edge of the conventional substrate in the heating process can be effectively prevented. That is, the yield of the subsequent manufacturing process can be improved through the design of the patterns 120 a of the patterned epitaxial substrate 100 a provided in the embodiment.

It should be mentioned that the structural type of the patterns 120 a is not construed as a limitation in the disclosure. In an embodiment, with reference to FIG. 2A , the patterns 120 b of the patterned epitaxial substrate 100 b are shaped as a cone on the substrate 110 a , and the corn shape allows the epitaxial structure subsequently formed on the patterned epitaxial substrate 100 a to have favorable light-emitting efficiency and light-emitting shapes. Alternatively, with reference to FIG. 2B , the patterns 120 c of the patterned epitaxial substrate 100 c are shaped as a cylinder on the substrate 110 a . Alternatively, with reference to FIG. 2C , the cross-sectional shape of the patterns 120 d of the patterned epitaxial substrate 100 d is a concave pattern; namely, the patterns 120 d sink in a direction from an upper surface 113 d to a lower surface 115 d of the substrate 110 d . Certainly, in other embodiments that are not shown in the drawings, the shape of the patterns can be selected from a polygonal cylinder, a polygonal cone, any other appropriate shape, or a combination thereof, which should however not be construed as a limitation in the disclosure.

It should be noted that the reference numerals and a part of the contents in the previous embodiment are used in the following embodiments, in which identical reference numerals indicate identical or similar components, and repeated description of the same technical contents is omitted. For a detailed description of the omitted parts, reference can be found in the previous embodiment, and no repeated description is contained in the following embodiments.

FIG. 3A is a schematic top view of a patterned epitaxial substrate according to another embodiment of the disclosure. FIG. 3B is a schematic cross-sectional view of the patterned epitaxial substrate depicted in FIG. 3A along a line segment B-B′. With reference to FIG. 1A and FIG. 3A , the patterned epitaxial substrate 100 e provided in the embodiment is similar to the aforesaid patterned epitaxial substrate 100 a , while the difference therebetween lies in that the patterned epitaxial substrate 100 e further has a third zone 116 e surrounding the second zone 114 e , and the third zone 116 e , the first zone 112 e , and the second zone 114 e are disposed in a concentric manner. Herein, the ratio of the first zone 112 e to the substrate 110 e is from 0.4 to 0.8, and the ratio of the second zone 114 e to the substrate 110 e is from 0.1 to 0.5, so as to better solve the problem of warpage of the edge. The patterns 120 e further include a plurality of third patterns 126 e , wherein the third patterns 126 e are disposed in the third zone 116 e of the substrate 110 e . Specifically, sizes of the third patterns 126 e are different from the sizes of the second patterns 124 e and the sizes of the first patterns 122 e.

In detail, each of the first patterns 122 e has a first orthogonal projection area on the substrate 110 e . Each of the second patterns 124 e has a second orthogonal projection area on the substrate 110 e . Each of the third patterns 126 e has a third orthogonal projection area on the substrate 110 e . The first orthogonal projection area, the second orthogonal projection area, and the third orthogonal projection area appear to be decreased in a progressive manner in a radial direction from each of the first patterns 122 e to each of the third patterns 126 e . That is, the orthogonal projection areas of the first patterns 122 e , the second patterns 124 e , and the third patterns 126 e sequentially on the first zone 112 e , the second zone 114 e , and the third zone 116 e of the substrate 110 e appear to have a progressive change and are gradually decreased.

To be more specific, the orthogonal projection area of the first patterns 122 e on the substrate 110 e is greater than the orthogonal projection area of the second patterns 124 e on the substrate 110 e , and the orthogonal projection area of the second patterns 124 e on the substrate 110 e is greater than the orthogonal projection area of the third patterns 126 e on the substrate 110 e . In other embodiments that are not shown in the drawings, the first orthogonal projection area, the second orthogonal projection area, and the third orthogonal projection area can also appear to be increased in a progressive manner, which should however not be construed as a limitation in the disclosure. In an embodiment, a rate of the progressive change is from 1% to 5%, for instance; that is, the proportion of the difference between the first orthogonal projection area and the third orthogonal projection area to the first orthogonal projection area is from 1% to 5%.

More particularly, with reference to FIG. 3B , in the cross-sectional view, each of the first patterns 122 e has a first vertical height H 1 and a first bottom width W 1 , and there is a first pitch P 1 between the adjacent first patterns 122 e . Each of the second patterns 124 e has a second vertical height H 2 and a second bottom width W 2 , and there is a second pitch P 2 between the adjacent second patterns 124 e . Each of the third patterns 126 e has a third vertical height H 3 and a third bottom width W 3 , and there is a third pitch P 3 between the adjacent third patterns 126 e . Specifically, in the radial direction from the first patterns 122 e to the third patterns 126 e , i.e., the first vertical height H 1 , the second vertical height H 2 , and the third vertical height H 3 sequentially on the first zone 112 e , the second zone 114 e , and the third zone 116 e of the substrate 110 e appear to be decreased in a progressive manner, the first bottom width W 1 , the second bottom width W 2 , and the third bottom width W 3 appear to be decreased in a progressive manner, and the first pitch P 1 , the second pitch P 2 , and the third pitch P 3 appear to be increased in a progressive manner.

In detail, the first vertical height H 1 is greater than the second vertical height H 2 , the second vertical height H 2 is greater than the third vertical height H 3 , the first pitch P 1 is less than the second pitch P 2 , and the second pitch P 2 is less than the third pitch P 3 . In other embodiments that are not shown in the drawings, the first vertical height, the second vertical height, and the third vertical height can appear to be increased in a progressive manner, and the first pitch, the second pitch, and the third pitch can appear to be decreased in a progressive manner, which should however not be construed as limitations in the disclosure. In an embodiment, a rate of the progressive change is from 1% to 5%; that is, the proportion of the difference between the first vertical height H 1 and the third vertical height H 3 to the first vertical height H 1 is from 1% to 5%, and the proportion of the difference between the first pitch P 1 and the third pitch P 3 to the first pitch P 1 is from 1% to 5%.

In brief, according to the design of the patterned epitaxial substrate 100 e provided in the embodiment, the patterns 120 e and the substrate 110 e are integrally formed, and the first zone 112 e , the second zone 114 e , and the third zone 116 e of the substrate 110 e are disposed in a concentric manner. Specifically, the patterns 120 e appear to have a progressive change in a radial direction from the center to the edge of the substrate 110 e . Thereby, the issue of the warpage of the edge of the conventional substrate in the heating process can be effectively prevented. That is, the yield of the subsequent manufacturing process can be improved through the design of the patterns 120 e of the patterned epitaxial substrate 100 e provided in the embodiment.

FIG. 4 is a schematic top view of a patterned epitaxial substrate according to still another embodiment of the disclosure. With reference to FIG. 3A and FIG. 4 , the patterned epitaxial substrate 100 f provided in the embodiment is similar to the aforesaid patterned epitaxial substrate 100 e , while the difference therebetween lies in that the first zone 112 f , the second zone 114 f , and the third zone 116 f of the substrate 110 f of the patterned epitaxial substrate 100 f provided in the embodiment share the same center C (are arranged in a concentric manner), wherein the first zone 112 f , the second zone 114 f , and the third zone 116 f are respectively shaped as a rectangle. The first orthogonal projection area, the second orthogonal projection area, and the third orthogonal projection area appear to be increased in a progressive manner in a radial direction from each of the first patterns 122 f to each of the third patterns 126 f That is, the orthogonal projection areas of the first patterns 122 f , the second patterns 124 f , and the third patterns 126 f sequentially on the first zone 112 f , the second zone 114 f , and the third zone 116 f of the substrate 110 f appear to have a progressive change and are gradually increased.

To be more specific, the orthogonal projection area of the first patterns 122 f on the substrate 110 f is less than the orthogonal projection area of the second patterns 124 f on the substrate 110 f , and the orthogonal projection area of the second patterns 124 f on the substrate 110 f is less than the orthogonal projection area of the third patterns 126 f on the substrate 110 f . In other embodiments that are not shown in the drawings, the first orthogonal projection area, the second orthogonal projection area, and the third orthogonal projection area can also appear to be decreased in a progressive manner, which should however not be construed as a limitation in the disclosure.

In other embodiments that are not shown in the drawings, in the radial direction from the first patterns to the third patterns, note that the first vertical height, the second vertical height, and the third vertical height of the first patterns, the second patterns, and the third patterns can also appear to be decreased in a progressive manner; alternatively, the first pitch, the second pitch, and the third pitch of the first patterns, the second patterns, and the third patterns appear to be increased in a progressive manner, which still falls within the scope of protection provided herein.

FIG. 5A is a schematic cross-sectional view of a semiconductor structure according to an embodiment of the disclosure. With reference to FIG. 5A , the semiconductor structure 10 a provided in the present embodiment includes the patterned epitaxial substrate 100 a depicted in FIG. 1B , a first-type semiconductor layer 130 , a light-emitting layer 140 , and a second-type semiconductor layer 150 . Specifically, the first-type semiconductor layer 130 is disposed on the patterned epitaxial substrate 100 a , the light-emitting layer 140 is disposed on the first-type semiconductor layer 130 , and the second-type semiconductor layer 150 is disposed on the light-emitting layer 140 . That is, the first-type semiconductor layer 130 and the second-type semiconductor layer 150 are respectively disposed on two sides of the light-emitting layer 140 . Herein, the first-type semiconductor layer 130 , the light-emitting layer 140 , and the second-type semiconductor layer 150 can be defined as an epitaxial structure.

The patterned substrate 100 a depicted in FIG. 1B is applied in the semiconductor structure 10 a provided in the present embodiment, wherein the patterns 120 a and the substrate 110 a are integrally formed, and the first zone 112 a and the second zone 114 a of the substrate 110 a are disposed in a concentric manner. Specifically, the sizes of the first patterns 122 a disposed in the first zone 112 a of the substrate 110 a are different from the sizes of the second patterns 124 a located in the second zone 114 a . Thereby, the issue of the warpage of the edge of the conventional substrate in the heating process can be effectively prevented. In other words, the epitaxial structure to which the patterned epitaxial substrate 100 a depicted in FIG. 1B can have an improved manufacturing yield, so that the semiconductor structure 10 a can have good photoelectric properties and reliability. Note that the semiconductor structure 10 a provided in the present embodiment is, for instance, applied to a micro LED of which the height is less than or equal to 6 μm and the width is less than or equal to 100 μm. Since the sizes of the patterns 120 a in the nano-scale patterned epitaxial substrate 100 a are different, the semiconductor structure 10 a can have better photoelectric properties and reliability, which should however not be construed as a limitation in the disclosure.

FIG. 5B is a schematic cross-sectional view of a semiconductor structure according to another embodiment of the disclosure. With reference to FIG. 5B , the semiconductor structure 10 b provided in the present embodiment is similar to the aforesaid semiconductor structure 10 a , while the difference therebetween lies in that: in the present embodiment the semiconductor structure 10 b to which the patterned epitaxial substrate 100 e depicted in FIG. 3B is applied further has a third zone 116 e surrounding the second zone 114 e , and the third zone 116 e , the first zone 112 e , and the second zone 114 e are disposed in a concentric manner. The patterns 120 e further include a plurality of third patterns 126 e , wherein the third patterns 126 e are disposed in the third zone 116 e of the substrate 110 e . Specifically, sizes of the third patterns 126 e are different from the sizes of the second patterns 124 e and the sizes of the first patterns 122 e.

FIG. 6A is a schematic cross-sectional view of a semiconductor structure according to still another embodiment of the disclosure. With reference to FIG. 6A , the semiconductor structure 10 c provided in the present embodiment includes a first-type semiconductor layer 130 ′, a plurality of patterns 136 , a light-emitting layer 140 ′, and a second-type semiconductor layer 150 ′. The first-type semiconductor layer 130 ′ has a top surface 132 and a bottom surface 134 opposite to each other, wherein the bottom surface 134 has a first zone 1302 and a second zone 1304 surrounding the first zone 1302 , and the first zone 1302 and the second zone 1304 are disposed in a concentric manner. The patterns 136 and the first-type semiconductor layer 130 ′ are integrally formed and arranged in an array on the bottom surface 134 of the first-type semiconductor layer 130 ′. Herein, the patterns 136 provided in the embodiment are concave patterns; however, in other embodiments that are not shown in the drawings, the patterns can also be convex patterns or other appropriate patterns, which should however not be construed as a limitation in the disclosure. Particularly, the patterns 136 provided in the embodiment includes first patterns 1362 and second patterns 1364 . The first patterns 1362 are disposed in the first zone 1302 , and the second patterns 1364 are disposed in the second zone 1304 . The sizes of the first patterns 1362 are different from the sizes of the second patterns 1364 . The light-emitting layer 140 ′ is disposed on the top surface 132 of the first-type semiconductor layer 130 ′, and the second-type semiconductor layer 150 ′ is disposed on the light-emitting layer 140 ′.

In the semiconductor structure 10 c provided in the present embodiment, the patterns 136 and the first-type semiconductor layer 130 ′ are integrally formed, and the first zone 1302 and the second zone 1304 on the bottom surface 134 of the first-type semiconductor layer 130 ′ are arranged in a concentric manner. Particularly, the sizes of the first patterns 1362 located in the first zone 1302 are different from the sizes of the second patterns 1364 in the second zone 1304 . Thereby, the full band wavelength uniformity of the light-emitting layer 140 ′ can be adjusted, so that the semiconductor structure 10 c can have better light-emitting efficiency.

FIG. 6B is a schematic cross-sectional view of a semiconductor structure according to still another embodiment of the disclosure. With reference to FIG. 6B , the semiconductor structure 10 d provided in the present embodiment is similar to the aforesaid semiconductor structure 10 c , while the difference therebetween lies in that the semiconductor structure 10 d provided in the present embodiment further has a third zone 1306 surrounding the second zone 1304 , and the third zone 1306 , the first zone 1302 , and the second zone 1304 are disposed in a concentric manner. The patterns 136 further include a plurality of third patterns 1366 disposed in the third zone 1306 of the first-type semiconductor layer 130 ′. Specifically, the sizes of the third patterns 1366 are different from the sizes of the second patterns 1364 and the sizes of the first patterns 1362 .

To sum up, according to the design of the patterned epitaxial substrate provided in one or more embodiments of the disclosure, the patterns and the substrate are integrally formed, different zones of the substrate are disposed in a concentric manner, and the sizes of the patterns disposed in different zones are different. Thereby, the issue of the warpage of the edge of the conventional substrate in the heating process can be effectively prevented, and the yield of the subsequent manufacturing processes can be improved. In an embodiment of the disclosure, the sizes (e.g., the orthogonal projection area, the vertical height, or the pitch) of the patterns in different zones can appear to have a progressive change (gradually increased or decreased) in a radial direction from the center to the edge of the substrate, so as to prevent warpage of the edge. Besides, the semiconductor structure to which the aforesaid patterned epitaxial substrate is applied can have good photoelectric properties and reliability.

It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure covers modifications and variations provided that they fall within the scope of the following claims and their equivalents.