System in package structure for perform electrostatic discharge operation and electrostatic discharge protection structure thereof

This application claims the priority benefit of Taiwan application serial no. 107116632, filed on May 16, 2018 and China application serial no. 201811208060.7, filed on Oct. 17, 2018. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.

The disclosure relates to a system in package structure and an electrostatic discharge protection structure thereof.

As electronic technology advances, electronic devices nowadays usually execute a variety of different functions by disposing a plurality of integrated circuits. To reduce areas required for layout of integrated circuits, and to simplify wiring complexity between integrated circuits, a system in package (SiP) has become a popular option.

In the conventional system in package, a plurality of integrated circuits included in the system in package, during processing and manufacturing, may store a certain degree of electrostatic charge. While the integrated circuit is packed to the system in package, the electrostatic charge is dissipated to a redistribution layer (RDL), and may cause damage of the integrated circuit or circuit damage in the redistribution layer.

The electrostatic discharge protection structure of an exemplary embodiment of the disclosure includes a redistribution layer and a first transistor array. The redistribution layer is coupled to at least one integrated circuit. The redistribution layer has a first electrode and a second electrode. The first transistor array is coupled to a pin end of the at least one integrated circuit, the first electrode, and the second electrode. The first transistor array has a plurality of transistors. A plurality of first transistors of the transistors are coupled in parallel. A plurality of second transistors of transistors are coupled in parallel. The first transistors and the second transistors are configured to be turned on for dissipating an electrostatic discharge current.

A system in package structure of an exemplary embodiment of the disclosure includes the at least one integrated circuit and the aforementioned electrostatic discharge protection structure. The electrostatic discharge protection structure is coupled to the pin end of the at least one integrated circuit, and is configured to dissipate the electrostatic discharge current occurred on the pin end.

To make the aforementioned more comprehensible, several exemplary embodiments accompanied with drawings are described in detail as follows.

FIG. 1 illustrates a cross-sectional schematic diagram of a system in package structure of an exemplary embodiment of the disclosure.

FIG. 2 illustrates an equivalent circuit diagram of a transistor array of an exemplary embodiment of the disclosure.

FIG. 3 illustrates a schematic top view of an electrostatic discharge protection structure of an exemplary embodiment of the disclosure.

FIGS. 4A to 4D illustrate schematic diagrams of different examples of a transistor array of an exemplary embodiment of the disclosure.

FIG. 5 illustrates a schematic diagram of another example of an electrostatic discharge protection structure of an exemplary embodiment of the disclosure.

FIG. 6A and FIG. 6B illustrate schematic diagrams of examples of a transistor array of an exemplary embodiment of the disclosure.

FIG. 6C and FIG. 6D are schematic diagrams of different examples of the cross-sectional structure illustrated according to the example of sectional line A-A′ of FIG. 6A , respectively.

FIG. 7 illustrates a schematic top view of another example of an electrostatic discharge protection structure of the disclosure.

FIG. 8 illustrates a schematic view of a system in package structure of an exemplary embodiment of the disclosure.

FIG. 9 illustrates a schematic top view of a system in package structure of an exemplary embodiment of the disclosure.

FIGS. 10A and 10B illustrate schematic cross-sectional views of a system package structure according to various embodiments of the disclosure.

Please refer to FIG. 1 . FIG. 1 illustrates a cross-sectional schematic diagram of a system in package structure of an exemplary embodiment of the disclosure. A system in package structure 100 includes an integrated circuit 110 and an electrostatic discharge protection structure coupled to the integrated circuit 110 . The electrostatic discharge protection structure includes a redistribution layer 130 and a transistor array 120 . The redistribution layer 130 , for example, includes multilayer dielectric layers and multilayer conductive layers alternately stacked. The redistribution layer 130 is coupled to the integrated circuit 110 , and redistributes the integrated circuit 110 . In an exemplary embodiment, the redistribution layer 130 has a first electrode PD 1 and a second electrode PD 2 , wherein the first electrode PD 1 and the second electrode PD 2 are coupled to the transistor array 120 .

In addition, in an exemplary embodiment, the integrated circuit 110 is disposed in an encapsulating material 101 , and the redistribution layer 130 is disposed between the encapsulating material 101 and a substrate 140 .

The substrate 140 in this embodiment may include an organic polymer material, an inorganic polymer material, or an organic-inorganic hybrid material. The organic polymer material may be polyimide (PI), polybenzoxazole (PBO), benzocyclobutene polymer (BCB) or other suitable materials. The inorganic polymer material may be silicon oxide, silicon nitride, silicon oxynitride, polysiloxane, polysilazane, polysiloxazane, polycarbosilane or other suitable materials. In other embodiments, it may also be substrates of glass substrates, printed circuit boards, semiconductor integrated circuit carriers, or semiconductor chips.

The transistor array 120 is also coupled to a pin end PIN of the integrated circuit 110 , wherein, in this exemplary embodiment, the transistor array 120 is coupled to the pin end PIN of the integrated circuit 110 by a wire of the redistribution layer 130 . The transistor array 120 includes a plurality of first transistors and a plurality of second transistors, wherein a plurality of the first transistors are coupled in parallel between the pin end PIN and the first electrode PD 1 , and a plurality of second transistors are coupled in parallel between the pin end PIN and the second electrode PD 2 . When an electrostatic discharge phenomenon occurs on the pin end PIN of the integrated circuit 110 , the first transistors or the second transistors may be correspondingly turned on, and are configured to dissipate an electrostatic discharge current.

In an exemplary embodiment of the disclosure, the transistor array 120 may be disposed in the redistribution layer 130 . Moreover, a vertical projection plane of the transistor array 120 against the redistribution layer 130 totally overlaps with a vertical projection plane of the integrated circuit 110 against the redistribution layer 130 (as shown in FIG. 1 ). However, the disclosure is not limited thereto. In other embodiments, the vertical projection plane of the transistor array 120 against the redistribution layer 130 partially overlaps or does not overlap with a vertical projection plane of the integrated circuit 110 against the redistribution layer 130 .

The transistor array 120 in the embodiment is formed in the redistribution layer 130 outside the integrated circuit 110 , not disposed in the integrated circuit 110 or in the interposer of the substrate 140 . In this way, the transistor array 120 may perform a highly efficient electrostatic discharge operation without occupying the layout area of the integrated circuit 110 .

Please refer FIG. 1 and FIG. 2 at the same time, wherein FIG. 2 illustrates an equivalent circuit diagram of a transistor array of an exemplary embodiment of the disclosure. In FIG. 2 , each of the transistors of the plurality of the first transistors is coupled into a diode configuration. For example, a gate and a source of each of the transistors are coupled together (if the first transistors are thin film transistors). The plurality of the first transistors are coupled in parallel, equivalent to a diode D 1 . Each of the transistors of a plurality of second transistors is coupled into a diode configuration. For example, the gate and the source of each of the transistors are coupled together (if the first transistors are thin film transistors). The plurality of second transistors are coupled in parallel, equivalent to a diode D 2 , wherein a cathode of the diode D 1 is coupled to the first electrode PD 1 , an anode of the diode D 1 is coupled to the pin end PIN, and is coupled to a cathode of the diode D 2 . In addition, an anode of the diode D 2 is coupled to the second electrode PD 2 .

When a positive electrostatic discharge phenomenon ESD 1 occurs on the pin end PIN of the integrated circuit 110 , the diode D 1 may be correspondingly turned on, a current dissipation path between the pin end PIN and the first electrode PD 1 is formed, and the electrostatic discharge current generated from the electrostatic discharge phenomenon ESD 1 is effectively dissipated. In contrast, when a negative electrostatic discharge phenomenon ESD 2 occurs on the pin end PIN of the integrated circuit 110 , the diode D 2 may be correspondingly turned on, the current dissipation path between the pin end PIN and the second electrode PD 2 is formed, and the electrostatic discharge current generated from the electrostatic discharge phenomenon ESD 2 is effectively dissipated.

In an exemplary embodiment of the disclosure, the diodes D 1 and D 2 are composed of the plurality of the first transistors and the plurality of the second transistors, respectively. In addition, each of the transistors (each of the first transistors or each of the second transistors) has a relatively small size. For example, a channel length of each of the transistors may be substantially disposed between 3 to 10 micrometers, and a channel width of each of the transistors may be substantially disposed between 3 to 10 micrometers. The aforementioned channel length and the channel width include slight errors generated while manufacturing. Furthermore, the first transistors and the second transistors of this embodiment may be thin film transistors. As such, when the electrostatic discharge phenomenon ESD 1 or ESD 2 occurs, each of the small-sized first transistors or the second transistors may be quickly turned on, and the current dissipation path is effectively formed, to effectively dissipate the electrostatic discharge current.

In addition, regarding the number of the transistors disposed in the transistor array 120 , it may be determined according to an electron mobility of the transistors, wherein the number of the transistors disposed in the transistor array 120 is negatively correlated to the electron mobility of the transistors disposed in the transistor array 120 . That is, if the electron mobility of the transistors is smaller, a relatively large number of the transistors are required to be disposed in the transistor array 120 . In contrast, if the electron mobility of the transistors is larger, a relatively small number of the transistors are required to be disposed in the transistor array 120 . In consideration of both a layout area and an electrostatic discharge capability, in an embodiment, in the transistor array 120 , the number of the first transistors may be disposed between 20 to 1000. In another embodiment, in the transistor array 120 , the number of the first transistors may be disposed between 20 to 800. In yet another embodiment, in the transistor array 120 , the number of the first transistors may be disposed between 20 to 300. The number of the second transistors may be disposed the same quantity as that of the first transistors. However, the disclosure is not limited thereto. Alternatively, under the condition that the requirement of the electrostatic discharge is less strict, 2 of the first transistors of an exemplary embodiment of the disclosure may be disposed.

Then, please refer to FIG. 3 . FIG. 3 illustrates a schematic top view of an electrostatic discharge protection structure of an exemplary embodiment of the disclosure. An electrostatic discharge protection structure 300 includes the transistor array 120 and the redistribution layer, wherein the redistribution layer provides a first electrode PD 1 , a second electrode PD 2 and a connecting wire PINA connected to the pin end of the integrated circuit. The transistor array 120 is coupled to the connecting wire PINA, and is connected to the pin end of the integrated circuit by the connecting wire PINA. The first electrode PD 1 and the second electrode PD 2 of FIG. 3 are adjacent to the transistor array 120 , and are configured on one side of the transistor array 120 , wherein, in an exemplary embodiment, a distance d 1 between the first electrode PD 1 and the second electrode PD 2 is larger or equal to 100 micrometers.

The first electrode PD 1 and the second electrode PD 2 in FIG. 3 are connected to the transistor array 120 by the connecting wire of other location (or layer) in the redistribution layer.

Regarding implementing details of the transistor array of an exemplary embodiment of the disclosure, please refer to schematic diagrams of different examples of a transistor array of an exemplary embodiment of the disclosure illustrated in FIG. 4A to FIG. 4D . In FIG. 4A , a transistor array 410 includes a plurality of first transistors M 11 -M 1 N and a plurality of second transistors M 21 -M 2 N. Each of the first transistors M 11 -M 1 N is coupled into a diode configuration. Each of the first transistors M 11 -M 1 N is coupled in parallel, and is coupled between the first electrode PD 1 and the pin end PIN. Each of the second transistors M 21 -M 2 N is coupled into a diode configuration. Each of the second transistors M 21 -M 2 N is coupled in parallel, and is coupled to between the pin end PIN and the second electrode PD 2 .

In FIG. 4A , the first transistors M 11 -M 1 N and the second transistors M 21 -M 2 N are both P-type transistors, wherein each of a gate end and a first end of the first transistors M 11 -M 1 N are commonly coupled to the first electrode PD 1 , and each of a second end of the first transistors M 11 -M 1 N is commonly coupled to the pin end PIN. Each of the gate end and the first end of the second transistors M 21 -M 2 N is commonly coupled to the pin end PIN. Each of the second end of the second transistors M 21 -M 2 N is commonly coupled to the second electrode PD 2 , wherein the first electrode PD 1 may be a power electrode, and the second electrode PD 2 may be a ground electrode.

In FIG. 4B , different from FIG. 4A , the second transistors M 21 -M 2 N in a transistor array 420 are N-type transistors. In addition, each of the first end of the second transistors M 21 -M 2 N is coupled to the pin end PIN, and each of the second end and the gate end of the second transistors M 21 -M 2 N are commonly coupled to the second electrode PD 2 .

On the other hand, in FIG. 4C , different from FIG. 4B , the first transistors M 11 -M 1 N of the transistor array 430 are also N-type transistors. Furthermore, each of the first end of the first transistors M 11 -M 1 N is coupled to the first electrode PD 1 , and each of the second end and the gate end of the second transistors M 21 -M 2 N are commonly coupled to the pin end PIN.

In FIG. 4D , the first transistors M 11 -M 1 N in a transistor array 440 include one or a plurality of N-type transistors (for example, the first transistor M 12 ) and one or a plurality of P-type transistors (for example, the first transistors M 11 , M 1 N), and are arranged in a staggered configuration. The second transistors M 21 -M 2 N of the transistor array 440 also include one or a plurality of N-type transistors (for example, the second transistor M 22 ) and one or a plurality of P-type transistors (for example, the second transistors M 21 , M 2 N), and are arranged in a staggered configuration. Each of the transistors M 11 -M 2 N is coupled into a diode configuration, wherein the anodes of the diodes consisting of the first transistors M 11 -M 1 N are coupled to the pin end PIN, and the cathodes of the diode are coupled to the first electrode PD 1 . The anodes of the diodes consisting of the second transistors M 21 -M 2 N are coupled to the second electrode PD 2 , and the cathodes of the diodes are coupled to the pin end PIN.

It can be acquired from the descriptions of FIG. 4D that in the embodiments of FIG. 4A to FIG. 4C of the disclosure, the first transistors M 11 -M 1 N or the second transistors M 21 -M 2 N may also be disposed by one or a plurality of P-type transistors and one or a plurality of N-type transistors, and it is unnecessary to choose the same conductive type of transistors.

Please refer to FIG. 5 . FIG. 5 illustrates a schematic diagram of another example of an electrostatic discharge protection structure of an exemplary embodiment of the disclosure. In an electrostatic discharge protection structure 500 , a transistor array 510 may at least include a plurality of transistor strings 511 - 518 . Each of the transistor strings 511 - 518 may respectively include a plurality of the transistors. In addition, each of the transistor strings 511 - 518 is respectively coupled to the pin end PIN by a plurality of wires L 1 -L 8 . To improve the speed consistency of the transistors of the transistor array 510 being turned on, a transmission delay provided by the plurality of the wires L 1 -L 8 between the transistor strings 511 - 518 and the pin end PIN is substantially the same. Although the above takes the transistor strings 511 - 518 as an example, the number of the transistor strings included in the transistor array 510 is not limited thereto. As shown in FIG. 5 , the number of the transistor strings included in the transistor array 510 is more than that of the transistor strings 511 - 518 , which is 8. Moreover, the transmission delay provided by each of the wires between the transistor strings and the pin end PIN is substantially the same.

Take the transistor strings 511 and 514 as examples. To make the transmission delay between the pin end PIN and the transistor strings 511 and 514 substantially the same, more bending portions may be generated on the wire L 1 to enhance the transmission delay between the pin end PIN and the transistor string 511 , and few bending on the wire L 4 may be applied to reduce the transmission delay between the pin end PIN and the transistor string 514 . As such, the transmission delay between the pin end PIN and the transistor strings 511 and 514 is substantially the same. In addition, when an electrostatic discharge phenomenon occurs, the pin end PIN and the transistor strings 511 and 514 may be turned on at the same time, and the dissipation speed of the electrostatic discharge current is enhanced. The wires L 1 -L 8 may include different width and length of wires.

In continuation of the aforementioned example, the wires L 1 and L 4 may be designed to have the same width, length, and thickness, such that the wires L 1 and L 4 may have the same transmission delay. Alternatively, the wires L 1 and L 4 may be designed to have different width, thickness, and/or length, such that the wires have equivalent resistance, and the same transmission delay is generated. Furthermore, the layout method regarding the wires L 1 -L 8 of FIG. 5 is solely one illustrative example, and is not set to limit the implementation of this disclosure. Layout methods for the wires having the same transmission delay shall be applied to this disclosure, and there is no specific limitation thereto.

Please refer to FIG. 6A and FIG. 6B . FIG. 6A and FIG. 6B illustrate schematic diagrams of examples of a transistor array of an exemplary embodiment of the disclosure. In FIG. 6A and FIG. 6B , the corresponding diode of the transistor may also be configured in the transistor array. Take one single transistor in the transistor array as an example. In FIG. 6A , a transistor MA 1 and a diode DA 1 are coupled in parallel. For further illustrations, the transistor MA 1 is an N-type transistor. A first end of the transistor MA 1 is coupled to a cathode of the diode DA 1 , and an end point X is formed. A second end of the transistor MA 1 is coupled to an anode of the diode DA 1 , and an end point Y is formed. The gate of the transistor MA 1 is coupled to an end point S.

In terms of structure, the transistor MA 1 and the diode DA 1 may be disposed by an integrated structure 610 . Please refer to FIG. 6A . FIG. 6A is a top view of the integrated structure 610 . The integrated structure 610 includes a gate structure GS 1 and doped areas DP 1 -DP 4 . The gate structure GS 1 is connected to the end point S, overlaps with an insulating layer (not illustrated) and a semiconductor material (not illustrated), and covers the insulating layer and the semiconductor material. Both sides of the semiconductor material S 1 and S 2 respectively make contact with the doped areas DP 1 and DP 2 -DP 4 , wherein the first side Si is opposite to the second side S 2 . The doped area DP 1 is connected to the end point X. The doped area DP 3 is connected to the end point Y. In this embodiment, the doped areas DP 1 , DP 2 and DP 4 are all N+-type, and the doped area DP 3 is P+-type. Furthermore, the semiconductor material may be N+-type, P+-type, or a neutral type (without doping).

In FIG. 6B , a transistor MA 2 and a diode DA 2 are coupled in parallel. For further illustrations, the transistor MA 2 is a P-type transistor. A first end of the transistor MA 2 is coupled to an anode of the diode DA 2 , and the end point X is formed. A second end of the transistor MA 2 is coupled to a cathode of the diode DA 2 , and the end point Y is formed. A gate end of the transistor MA 2 is coupled to the end point S.

In terms of structure, the transistor MA 2 and the diode DA 2 may be disposed by an integrated structure 620 . Please refer to FIG. 6B . FIG. 6B is a top view of the integrated structure 620 . The integrated structure 620 includes a gate structure GS 2 and doped areas DP 5 -DP 8 . The gate structure GS 2 is connected to the end point S, covers the insulating layer (not illustrated) and the semiconductor material (not illustrated). Both sides of the semiconductor material S 1 and S 2 respectively contact with the doped areas DP 5 and DP 6 -DP 8 , wherein the first side S 1 is opposite to the second side S 2 . The doped area DP 5 is connected to the end point X. The doped area DP 7 is connected to the end point Y. In this embodiment, the doped areas DP 5 , DP 6 and DP 8 are all P+-type. The doped area DP 7 is N+-type. Furthermore, the semiconductor material may be N+-type, P+-type, or a neutral type (without doping).

Please refer to FIG. 6C and FIG. 6D for the below. FIG. 6C and FIG. 6D are schematic diagrams of different examples of the cross-sectional structure illustrated according to the example of sectional line A-A′ of FIG. 6A , respectively. In FIG. 6C , the doped areas DP 1 and DP 3 are respectively configured on opposite sides of a semiconductor material SM 1 . An insulating layer I, the semiconductor material SM 1 , and the gate structure GS 1 are configured to overlap with each other, wherein the insulating layer I covers on the semiconductor material SM 1 . The insulating layer I may also completely cover, partially cover, or do not cover the doped area DP 1 or DP 3 , and the gate structure GS 1 covers over the insulating layer I. In addition, the configuration sequence of the semiconductor material SM 1 , the insulating layer I and the gate structure GS 1 may be different. In FIG. 6D , the insulating layer I, the semiconductor material SM 1 , and the gate structure GS 1 are configured to overlap with each other, wherein the semiconductor material SM 1 covers over the insulating layer I, and the insulating layer I covers over the gate structure GS 1 .

Please refer to FIG. 7 . FIG. 7 illustrates a schematic top view of another example of an electrostatic discharge protection structure of the disclosure. An electrostatic discharge protection structure 700 includes a plurality of transistor arrays 720 , 730 , 740 , 750 and the redistribution layer, wherein the redistribution layer provides the first electrode PD 1 , the second electrode PD 2 and the connecting wire PINA connected to the pin end of the integrated circuit. The transistor arrays 720 , 730 and 740 are coupled to the connecting wire PINA, and are connected to the pin end of the integrated circuit by the connecting wire PINA. In an exemplary embodiment, when the electrostatic discharge phenomenon occurs on the pin end of the integrated circuit, the dissipation capability of the electrostatic discharge current may be enhanced by a plurality of transistor arrays 720 , 730 , 740 , and 750 .

The number of the transistors in the transistor arrays 720 , 730 , 740 and 750 may be the same or may not be the same. In addition, the transistors in the transistor arrays 720 , 730 , and 740 may be formed by the manner as illustrated in FIG. 4A to FIG. 4C , or FIG. 6A , and FIG. 6B . However, there is no limit thereto. In addition, the dispose manner in each of the transistors of each of the transistor arrays 720 , 730 , 740 , and 750 may be completely the same, partially the same, or totally different. However, the disclosure is not limited thereto.

Please refer to FIG. 8 . FIG. 8 illustrates a cross-sectional structural schematic view of a system in package structure of an exemplary embodiment of the disclosure. A system in package structure 800 includes integrated circuits 811 and 812 , a redistribution layer 830 and transistor arrays 821 and 822 , wherein the redistribution layer 830 and the transistor arrays 821 and 822 are configured to form an electrostatic discharge protection structure. The integrated circuits 811 , 812 are disposed in an encapsulating material 801 . The redistribution layer 830 is configured between an encapsulating material 801 and a substrate 840 . The transistor arrays 821 and 822 are disposed in the redistribution layer 830 , and are coupled with the first electrode PD 1 and the second electrode PD 2 provided by the redistribution layer 830 . In addition, the transistor arrays 821 and 822 are respectively coupled to the pin ends PIN 1 and PIN 2 of the integrated circuits 811 and 812 . The transistor arrays 821 and 822 are configured to be turned on, and are respectively configured to dissipate the electrostatic discharge current occurred on the pin ends PIN 1 and PIN 2 of the integrated circuits 811 and 812 .

It should be noted that, in the disclosure, the number of the integrated circuit included in the system in package structure 800 is not specifically limited. In addition, the number of the pin end corresponding to the integrated circuit, and the number of the configured transistor arrays are not specifically limited.

Regarding the implementing details of the electrostatic discharge protection structure of the exemplary embodiment, detailed statements are stated in the aforementioned embodiments and examples, and shall not be repeated.

Please refer to FIG. 9 . FIG. 9 illustrates a schematic top view of a system in package structure of an exemplary embodiment of the disclosure. In a system in package structure 900 , an integrated circuit 920 has a pin end PINA. The pin end PINA is connected to transistor arrays 911 and 912 by the wires L 1 and L 2 formed by the redistribution layer. The redistribution layer provides wires L 3 and L 4 , such that the first electrode PD 1 and the second electrode PD 2 are connected to the transistor arrays 911 and 912 .

In this disclosure, the transistor arrays 911 and 912 are configured to the uncovered parts of the integrated circuit 920 (outside of an edge of the integrated circuit 920 ). In other embodiments of this disclosure, the transistor arrays 911 and 912 may be partially overlapped with the integrated circuit 920 , or completely overlapped with the integrated circuit 920 . However, the disclosure is not limited thereto.

Please refer to FIG. 10A . FIG. 10A is a cross-sectional structural diagram of a system package structure according to an embodiment of the disclosure. The system package structure 1100 includes an integrated circuit 1010 and an electrostatic discharge protection structure coupled to the integrated circuit 1010 . The electrostatic discharge protection structure includes a redistribution layer 1030 and a transistor array 1020 . The redistribution layer 1030 includes, for example, alternately stacked multilayer dielectric layers and multilayer conductive layers. The redistribution layer 1030 is coupled to the integrated circuit 1010 and performs redistribution operations on the integrated circuit 1010 . In the embodiment, the redistribution layer 1030 has a first electrode PD 1 and a second electrode PD 2 , herein the first electrode PD 1 and the second electrode PD 2 are coupled to the transistor array 1020 . Also, in the embodiment, the integrated circuit 1010 is disposed in an encapsulation material 1001 , and the redistribution layer 1030 is disposed between the encapsulation material 1001 and the substrate 1040 . The transistor array 1020 in this embodiment is adjacent to the substrate 1040 for configuration. In other embodiments, the transistor array 1020 may be disposed at any location in the redistribution layer 1030 without particular limitations.

Please note that the transistor array 1020 in this embodiment is formed in the redistribution layer 1030 outside the integrated circuit 1010 , not in the integrated circuit 1010 or in the interposer of the substrate 1040 . As such, the transistor array 1020 can perform a highly efficient electrostatic discharge operation without taking up the layout area of the integrated circuit 1010 .

Please refer to FIG. 10B . FIG. 10B is a cross-sectional structural diagram of a system package structure according to an embodiment of the disclosure. The system package structure 1100 includes integrated circuits 1111 , 1112 , a redistribution layer 1130 , and transistor arrays 1121 and 1122 . The redistribution layer 1130 and the transistor arrays 1121 and 1122 are used to construct an electrostatic discharge protection structure. The integrated circuits 1111 , 1112 are disposed in the encapsulation material 1101 , and the redistribution layer 1130 is disposed between the encapsulation material 1101 and a substrate 1140 . The transistor array 1121 is disposed in the redistribution layer 1130 and coupled to the first electrode PD 11 and the second electrode PD 21 provided by the redistribution layer 1130 . The transistor array 1122 is disposed in the redistribution layer 1130 and coupled to the first electrode PD 12 and the second electrode PD 22 provided by the redistribution layer 1130 . In addition, the transistor arrays 1121 and 1122 are coupled to the pin ends PIN 1 and PIN 2 of the integrated circuits 1111 and 1112 , respectively. The transistor arrays 1121 and 1122 are used to be turned on and used to dissipate the electrostatic discharge currents generated on the pin ends PIN 1 and the PIN 2 of the integrated circuits 1111 and 1112 . Unlike the embodiment of FIG. 8 , transistor arrays 1121 , 1122 in the system package structure 1100 are disposed adjacent to substrate 1140 . In other embodiments, the transistor arrays 1121 , 1122 may be disposed at any location in the redistribution layer 1030 without particular limitations.

In view of the above, in the redistribution layer of this disclosure, a transistor array consisting of a plurality of transistors is provided. By coupling the transistor array and the pin end of the integrated circuit, the electrostatic discharge current of a charged-device model (CDM) occurred on the integrated circuit, can be dissipated through the current dissipation path formed when plurality of transistors coupled in parallel are quickly turned on in the transistor array, to effectively prevent the redistribution layer or the integrated circuit from being damaged by the electrostatic discharge current.

Based on the above, an exemplary embodiment of the disclosure provides a transistor array consisting a plurality of the transistors coupled in parallel, such that the transistor array is coupled to the pin end of the integrated circuit, and is coupled to the first electrode and the second electrode provided by the redistribution layer. When an electrostatic discharge phenomenon occurs, a plurality of the transistors in the transistor array may be quickly turned on, such that the electrostatic discharge current is quickly dissipated to the first electrode or the second electrode to effectively perform an electrostatic discharge protection, and protect the integrated circuit or the redistribution layer from being damaged.

Although the disclosure is disclosed as the exemplary embodiments above, the exemplary embodiments are not meant to limit the disclosure. Any person skilled in the art may make slight modifications and variations without departing from the spirit and scope of the disclosure. Therefore, the protection scope of the disclosure shall be defined by the claims attached below.