Inventor
TAI-JUI WANG
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H01LSemiconductor devices20%
H10DInorganic electric semiconductor devices15%
H10KOrganic electric solid-state devices10%
G01RMeasuring electric variables5%
H01FMagnets5%
H01GCapacitors5%
H02HEmergency protective circuit arrangements5%
H03HImpedance networks, e.g. resonant circuits5%
H10HInorganic light-emitting semiconductor devices having potential barriers5%
PatentTitleYear
12,490,559Pixel structure with high aspect ratio conductive lines for improved aperture ratio202512,456,668Package structure, antenna module and probe card202511,839,120Electronic device with conductive via structures202311,776,920Capacitor and filter and redistribution layer structure including the same202311,764,166Semiconductor package structure202311,387,230System in package structure for perform electrostatic discharge operation and electrostatic discharge protection structure thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to IND TECH RES INST (6)· patent assignee history
2022–2025Based in TW· patent location history
2023Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 6 | 2022–2025 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2022–2025 |