Magnetic memory device

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2017-179563, filed on Sep. 19, 2017; the entire contents of which are incorporated herein by reference.

Embodiments described herein relate generally to a magnetic memory device.

There exists a magnetic memory device including a magnetic shift register based on a magnetic material. A stable operation is required in the magnetic memory device.

FIG. 1A to FIG. 1C are schematic views illustrating a magnetic memory device according to a first embodiment;

FIG. 2 is a schematic view illustrating the operation of the magnetic memory device according to the first embodiment;

FIG. 3A and FIG. 3B are schematic views illustrating another magnetic memory device according to the first embodiment;

FIG. 4A and FIG. 4B are schematic views illustrating another magnetic memory device according to the first embodiment;

FIG. 5A and FIG. 5B are schematic views illustrating another magnetic memory device according to the first embodiment;

FIG. 6A to FIG. 6C are schematic views illustrating the magnetic memory device according to the first embodiment;

FIG. 7 is a schematic plan view illustrating another magnetic memory device according to the first embodiment;

FIG. 8 is a schematic plan view illustrating another magnetic memory device according to the first embodiment;

FIG. 9 is a schematic plan view illustrating another magnetic memory device according to the first embodiment;

FIG. 10 is a schematic plan view illustrating another magnetic memory device according to the first embodiment;

FIG. 11 is a schematic perspective view illustrating another magnetic memory device according to the first embodiment;

FIG. 12A and FIG. 12B are a schematic view illustrating the magnetic memory device according to the first embodiment;

FIG. 13 is a schematic perspective view illustrating a magnetic memory device according to a second embodiment;

FIG. 14 is a schematic perspective view illustrating another magnetic memory device according to the second embodiment; and

FIG. 15 is a schematic perspective view illustrating another magnetic memory device according to the second embodiment.

According to one embodiment, a magnetic memory device includes a first magnetic member, a first electrode, a first magnetic layer, a first non-magnetic layer, a first conductive layer and a controller. The first magnetic member includes a first extending portion being tubular and a third magnetic portion. The first extending portion includes a first magnetic portion and a second magnetic portion. The first extending portion extends along a first direction. The third magnetic portion is connected with the second magnetic portion. A direction from the first magnetic portion toward the second magnetic portion is along the first direction. The first electrode is electrically connected with the first magnetic portion. The first non-magnetic layer is provided between the first magnetic layer and at least a part of the third magnetic portion. The first conductive layer includes a first conductive portion, a second conductive portion, and a third conductive portion being between the first conductive portion and the second conductive portion. A direction from at least a part of the second magnetic portion toward at least a part of the third conductive portion is along the first direction. The controller is electrically connected with the first electrode, the first magnetic layer, the first conductive portion and the second conductive portion. The controller is configured to supply a first current to the first conductive layer in a first operation. The first current flows between the first conductive portion and the second conductive portion. The controller is configured to apply a voltage between the first electrode and the first magnetic layer in a second operation.

According to another embodiment, a magnetic memory device includes a first magnetic member, a first electrode, a first magnetic layer, a first non-magnetic layer, a first conductive layer, and a controller. The first magnetic member includes a first extending portion being tubular and a third magnetic portion. The first extending portion includes a first magnetic portion and a second magnetic portion. The first extending portion extends along a first direction. The third magnetic portion is connected with the second magnetic portion. A direction from the first magnetic portion toward the second magnetic portion is along the first direction. The first electrode is electrically connected with the first magnetic portion. The first non-magnetic layer is provided between the first magnetic layer and at least a part of the third magnetic portion. The first conductive layer includes a first conductive portion, a second conductive portion, and a third conductive portion being between the first conductive portion and the second conductive portion. At least a part of the third conductive portion curves along the first extending portion. The controller is electrically connected with the first electrode, the first magnetic layer, the first conductive portion and the second conductive portion. The controller is configured to supply a first current to the first conductive layer in a first operation, the first current flowing between the first conductive portion and the second conductive portion. The controller is configured to apply a voltage between the first electrode and the first magnetic layer in a second operation.

Various embodiments will be described hereinafter with reference to the accompanying drawings.

The drawings are schematic and conceptual; and the relationships between the thickness and width of portions, the proportions of sizes among portions, etc., are not necessarily the same as the actual values thereof. Further, the dimensions and proportions may be illustrated differently among drawings, even for identical portions.

In the specification and drawings, components similar to those described or illustrated in a drawing thereinabove are marked with like reference numerals, and a detailed description is omitted as appropriate.

First Embodiment

FIG. 1A to FIG. 1C are schematic views illustrating a magnetic memory device according to a first embodiment.

FIG. 1A is a plan view seen from the arrow AA of FIG. 1B and FIG. 1C . FIG. 1B is a B 1 -B 2 line sectional view of FIG. 1A . FIG. 1C is an A 1 -A 2 line sectional view of FIG. 1A .

As shown in FIG. 1A to FIG. 1C , a magnetic memory device 110 according to the embodiment includes a first magnetic member 10 , a first electrode 51 , a first magnetic layer 10 L, a first non-magnetic layer 10 n , a first conductive layer 31 , and a controller 70 .

The first magnetic member 10 includes a first extending portion 10 e . The first extending portion 10 e extends along a first direction. The first extending portion 10 e is tubular extending along the first direction, for example.

The first direction is taken as a Z-axis direction. A direction perpendicular to the Z-axis direction is taken as an X-axis direction. A direction perpendicular direction to the Z-axis direction and the X-ax is taken as a Y-axis direction.

The first extending portion 10 e includes a first magnetic portion 11 and a second magnetic portion 12 . The direction from the first magnetic portion 11 toward the second magnetic portion 12 is along the first direction.

The first electrode 51 is electrically connected with the first magnetic portion 11 .

In the specification, “the state of being electrically connected” includes a state where a plurality of conductors contact physically and current flows between the conductors. Further, “the state of being electrically connected” includes a state where another conductor is inserted between conductors and a current flows through these conductors. Furthermore, “the state of being electrically connected” includes a state in which an electric element is inserted between conductors and a state where a current flows through these conductors can be formed. The electric element includes an element etc. which have a nonlinear electrical property, for example.

The first non-magnetic layer 10 n is provided between the at least parts of the first magnetic layer 10 L and the third magnetic portion 13 .

The first conductive layer 31 includes a first conductive portion 31 a , a second conductive portion 31 b , and a third conductive portion 31 c . The third conductive portion 31 c is located between the first conductive portion 31 a and the second conductive portion 31 b . A direction from at least a part of the second magnetic portion 12 toward at least a part of the third conductive portion 31 c is along the first direction (Z-axis direction). For example, the third conductive portion 31 c overlaps the at least the part of the second magnetic portion 12 in the Z-axis direction. For example, the third conductive portion 31 c overlaps the at least the part of the first extending portion 10 e in the Z-axis direction.

The controller 70 is electrically connected with the first electrode 51 , the first magnetic layer 10 L, the first conductive portion 31 a , and the second conductive portion 31 b . In this example, a first functional element 75 is provided on a current path between the first magnetic layer 10 L and the controllers 70 . The first functional element 75 is a transistor, for example. Alternatively, the first functional element 75 is a nonlinear element.

The first extending portion 10 e of the first magnetic member 10 functions as a shift register which memorizes information, for example. The third magnetic portion 13 of the first magnetic member 10 functions as a reading portion of information. The first magnetic layer 10 L, the first non-magnetic layer 10 n , and the third magnetic portion 13 function as reading elements. The first magnetic layer 10 L, the first non-magnetic layer 10 n , and the third magnetic portion 13 serve as an MTJ element, for example.

The first magnetic member 10 , the first magnetic layer 10 L, and the first non-magnetic layer 10 n become one memory portion (a first memory portion MP 1 ).

In this example, a first insulating layer 31 i is further provided. The first insulating layer 31 i is provided between the at least the part of the second magnetic portion 12 and the at least the part of the third conductive portion 31 c.

In this example, a first magnetic film 41 is further provided. The first conductive layer 31 (the third conductive portion 31 c , in this example) is located between the first magnetic film 41 and the first insulating layer 31 i in the Z-axis direction. The first conductive layer 31 (the third conductive portion 31 c , in this example) is located between two parts of the first magnetic film 41 in the X-Y plane.

In this example, a first insulation part 61 is provided in the first extending portion 10 e being tubular.

The first magnetic member 10 includes at least one selected from the group consisting of Fe, Co, and nickel, for example. Examples of the material of the first magnetic member 10 will be described later. The first magnetic layer 10 L includes at least one selected from the group consisting of Fe, Co, and nickel, for example. Examples of the material of the first magnetic layer 10 L will be described later. The first non-magnetic layer 10 n includes MgO etc., for example. Examples of the material of the first non-magnetic layer 10 n will be descried later. Cu etc. are used for the first electrode 51 , for example. Examples of the material of the first electrode 51 will be described later. The first insulation part 61 includes at least one selected from the group consisting of silicon oxide, nitride silicon, silicon oxynitride, and an aluminum oxide, for example.

In the magnetic memory device 110 , a magnetic field is generated by the current flowing in the first conductive layer 31 . This magnetic field is applied to the first magnetic member 10 . Thereby, magnetization of the first magnetic member 10 is controlled. For example, depending on the orientation of the current flowing in the first conductive layer 31 , information held in first magnetic member 10 is changed. Such an operation is performed by the controller 70 .

The controller 70 supplies a first current to the first conductive layer 31 in one operation (a first operation). The first current flows between the first conductive portion 31 a and the second conductive portion 31 b . Thereby, a writing operation is performed.

In another operation (a second operation), the controller 70 applies a voltage between the first electrode 51 and the first magnetic layer 10 L. Thereby, a current (a second current) flows into the first extending portion 10 e . By the second current, information (for example, magnetization information) which is held in the first extending portion 10 e shifts in the first extending portion 10 e . Thereby, a shift operation is performed.

In further another operation (a third operation), the controller 70 detects a value (at least one of resistance value, a voltage value, and a current value) corresponding to the electrical resistance between the first electrode 51 and the first magnetic layer 10 L. Thereby, a reading operation is performed. For example, the electrical resistance between the third magnetic portion 13 and the first magnetic layer 10 L changes depending on the state (information) of magnetization of the third magnetic portion 13 . The change of this electrical resistance is based on a magneto-resistive effect, for example.

FIG. 2 is a schematic view illustrating the operation of the magnetic memory device according to the first embodiment.

As shown in FIG. 2 , a magnetization 10 m of the first extending portion 10 e of the first magnetic member 10 crosses the first direction (Z-axis direction), for example. The magnetization 10 m is along a radial direction of the tubular first extending portion 10 e . For example, the magnetization 10 m orients from the inner side toward the outside. Alternatively, the magnetization 10 m orients from the outside toward the inner side. The difference in the orientation of the magnetization 10 m corresponds to the difference in information. In the first extending portion 10 e , a plurality of magnetic domains 10 d are provided. Information is held (memorized) in the plurality of magnetic domains 10 d.

In this example, the width (a length of a direction crossing the Z-axis direction) of the first extending portion 10 e repeatedly increases and decreases along the Z-axis direction. The width (for example, the radius) of the first extending portion 10 e varies periodically. Thereby, the controllability of the magnetization 10 m increases.

In the shift operation, the magnetization 10 m (information) of the first magnetic member 10 is shifted along the first extending portion 10 e.

Thus, the first operation includes the writing operation of the information on the first magnetic member 10 . The second operation includes the shift operation in which the information written in the first magnetic member 10 is shifted.

In the writing operation, when the first current flowing in the first conductive layer 31 is in a first orientation, information of one of “0” and “1” is written, for example. When the first current is in a second orientation, information of the other one of “0” and “1” is written, for example. For example, information written when the first current flows in the orientation from the first conductive portion 31 a to the second conductive portion 31 b differs from information written when the first current flows in the orientation from the second conductive portion 31 b to the first conductive portion 31 a.

The magnetic field by the first current is applied to the second magnetic portion 12 of the first magnetic member 10 , for example. The second magnetic portion 12 corresponds to a portion in which information is written.

As already described, in the embodiment, the direction from at least the part of the second magnetic portion 12 toward the at least the part of the third conductive portion 31 c is along the first direction (Z-axis direction). For example, the third conductive portion 31 c overlaps the at least the part of the second magnetic portion 12 in the Z-axis direction. Thereby, the magnetic field by the first current is effectively applied to the second magnetic portion 12 . For example, the writing operation is performed stably. For example, the writing operation by a small writing current can be performed. According to the embodiment, a magnetic memory device in which the stable operation is possible can be provided.

As shown in FIG. 1A , in the magnetic memory device 110 , the at least the part of the third conductive portion 31 c is curved along the second magnetic portion 12 . The curve is rounded, for example. Thereby, the magnetic field generated by the third conductive portion 31 c is applied to the second magnetic portion 12 more effectively. The more stable operation is obtained.

In the magnetic memory device 110 , the third conductive portion 31 c is covered by the first magnetic film 41 , for example. The first magnetic film 41 corresponds to a cladding layer. For example, the first magnetic film 41 covers the first conductive layer 31 except a portion where the insulating layer 31 i is provided, for example. The first magnetic film 41 concentrates the magnetic flux toward the second magnetic portion 12 . Thereby, the magnetic field generated by the third conductive portion 31 c can be applied to the second magnetic portion 12 more effectively. The more stable operation is obtained.

FIG. 3A and FIG. 3B are schematic views illustrating another magnetic memory device according to the first embodiment.

FIG. 3A is a plan view. FIG. 3B is a sectional view. Also in the magnetic memory device 111 , the first magnetic member 10 , the first electrode 51 , the first magnetic layer 10 L, the first non-magnetic layer 10 n , the first conductive layer 31 , and the controller 70 are provided. In these figures, the first non-magnetic layer 10 n and the controller 70 are not shown.

Also in the magnetic memory device 111 , the direction from the second magnetic portion 12 toward the part of the third conductive portion 31 c is along the first direction (the Z-axis direction). The part of the third conductive portion 31 c overlaps the second magnetic portion 12 in the Z-axis direction. Furthermore, the direction from another part of the third conductive portion 31 c toward the second magnetic portion 12 crosses the first direction. For example, the other part of the third conductive portion 31 c overlaps the second magnetic portion 12 in the X-Y plane.

The second magnetic portion 12 is located around the other part of the third conductive portion 31 c in the magnetic memory device 111 . In the second magnetic portion 12 being tubular (annular), the other part of the third conductive portion 31 c is provided. The stable operation can be performed also in the magnetic memory device 111 .

In the magnetic memory device 111 , the size of the memory portion can be reduced. A high-density memory is obtained. The memory portion can be formed with a manufacturing method of a self alignment. The magnetic field by the first current can be effectively applied to the magnetic member.

FIG. 4A and FIG. 4B are schematic views illustrating another magnetic memory device according to the first embodiment.

FIG. 4A is a plan view. FIG. 4B is a sectional view. Also in a magnetic memory device 112 , the first magnetic member 10 , the first electrode 51 , the first magnetic layer 10 L, the first non-magnetic layer 10 n , the first conductive layer 31 , and the controller 70 are provided. In these figures, the first non-magnetic layer 10 n and the controller 70 are not shown.

Also in the magnetic memory device 112 , the direction from the second magnetic portion 12 to the part of the third conductive portion 31 c is along the first direction (the Z-axis direction). The direction from the other part of the third conductive portion 31 c toward the second magnetic portion 12 crosses the first direction.

In the magnetic memory device 112 , the other part of the third conductive portion 31 c is located around the first extending portion 10 e . The stable operation can be performed also in the magnetic memory device 112 .

Also in the magnetic memory devices 111 and 112 , at least the part of the third conductive portion 31 c is curved along the second magnetic portion 12 . The curve is rounded.

In the magnetic memory devices 110 - 112 , the part of the third conductive portion 31 c overlaps the second magnetic portion 12 in the Z-axis direction. In addition, the first insulating layer 31 i is provided between the part of the third conductive portion 31 c and the second magnetic portion 12 . The thickness of the first insulating layer 31 i along the first direction (along the Z-axis direction) is preferable to be not less than 2.5 nm and not more than 20 nm, for example. With such thickness, sufficient insulation is obtained. With such thickness, the magnetic field with a high intensity can be effectively applied to the second magnetic portion 12 .

FIG. 5A and FIG. 5B are schematic views illustrating another magnetic memory device according to first embodiment.

FIG. 5A is a plan view. FIG. 5B is a sectional view. Also in a magnetic memory device 120 , the first magnetic member 10 , the first electrode 51 , the first magnetic layer 10 L, the first non-magnetic layer 10 n , the first conductive layer 31 , and the controller 70 are provided. In these figures, the first non-magnetic layer 10 n and the controller 70 are not shown.

Also in the magnetic memory device 120 , the third conductive portion 31 c does not overlap the second magnetic portion 12 in the Z-axis direction. The third conductive portion 31 c overlaps the second magnetic portion 12 in the X-Y plane. The configuration in the magnetic memory device 120 other than the third conduction portion 31 c (first conductive layer 31 ) is the same as that of the magnetic memory device 110 , for example.

As shown in FIG. 5A , the at least the part of the third conductive portion 31 c is curved along the first extending portion 10 e . The curve is rounded. Thereby, the magnetic field by the first current flowing in the third conductive portion 31 c is effectively applied to the second magnetic portion 12 . Thereby, the stable writing operation is obtained.

In the magnetic memory device 120 , the distance between the first extending portion 10 e and the third conductive portion 31 c is preferable to be not less than 2.5 nm and not more than 10 nm. The distance is a distance along the X-Y plane. Sufficient insulation can be obtained by such the distance. According to such the distance, the magnetic field of a high intensity can be effectively applied to the first extending portion 10 e (for example, second magnetic portion 12 ).

A plurality of memory portions may be provided in the embodiment. The example of the plurality of memory portions will be described bellow.

FIG. 6A - FIG. 6C are schematic views illustrating the magnetic memory device according to the first embodiment.

FIG. 6A - FIG. 6C illustrate second to fourth memory portions MP 2 -MP 4 .

As shown in FIG. 6A , in the second memory portion MP 2 , a second magnetic member 10 B, a second electrode 52 and a second magnetic layer 10 LB, and a second non-magnetic layer 10 n B are provided.

The second magnetic member 10 B includes a second extending portion 10 e B being tubular. The second extending portion 10 e B extends along the first direction (Z-axis direction). The second extending portion 10 e B includes a fourth magnetic portion 11 B and a fifth magnetic portion 12 B. The direction from the fourth magnetic portion 11 B toward the fifth magnetic portion 12 B is along in the first direction. The second magnetic member 10 B further includes a sixth magnetic portion 13 B. The sixth magnetic portion 13 B is connected with the fifth magnetic portion 12 B.

The second electrode 52 is electrically connected with the fourth magnetic portion 11 B. The second non-magnetic layer 10 n B is provided between second magnetic layer 10 LB and at least a part of the sixth magnetic portion 13 B. A second insulation part 61 B is provided in the second extending portion 10 e B.

The controller 70 is further electrically connected with the second electrode 52 and second magnetic layer 10 LB. In this example, a second functional element 75 B is provided on a current path between the second magnetic layer 10 LB and the controller 70 . A second conductive layer 32 is provided in this example. The direction from at least a part of the fifth magnetic portion 12 B toward the second conductive layer 32 is along the first direction. In the embodiment, the second conductive layer 32 may be continuous with the first conductive layer 31 . The second electrode 52 may be continuous with the first electrode 51 . A second insulating layer 32 i is provided in this example. The second insulating layer 32 i is provided between the at least the part of the fifth magnetic portion 12 B and at least a part of the second conductive layer 32 .

In this example, a second magnetic film 42 is further provided. For example, the second conductive layer 32 is located between the second magnetic film 42 and the second insulating layer 32 i in the Z-axis direction. For example, the second conductive layer 32 is located between two parts of the second magnetic film 42 in the X-Y plane.

As shown in FIG. 6B , in the third memory portion MP 3 , a third magnetic member 10 C, a third electrode 53 and a third magnetic layer 10 LC, and a third non-magnetic layer 10 n C are provided.

The third magnetic member 10 C includes an extending portion 10 e C being tubular. The extending portion 10 e C extends along the first direction (the Z-axis direction). The extending portion 10 e C includes a magnetic portion 11 C and a magnetic portion 12 C. The direction from the magnetic portion 11 C toward the magnetic portion 12 C is along the first direction. The third magnetic member 10 C further includes a magnetic portion 13 C. The magnetic portion 13 C is connected with the magnetic portion 12 C.

The third electrode 53 is electrically connected with the magnetic portion 11 C. The third non-magnetic layer 10 n C is provided between the third magnetic layer 10 LC and at least a part of the magnetic portion 13 C. A third insulation part 61 C is provided in the extending portion 10 e C.

The controller 70 is further electrically connected with the third electrode 53 and the third magnetic layer 10 LC. In this example, a third functional element 75 C is provided on a current path between the third magnetic layer 10 LC and the controllers 70 . A third conductive layer 33 is provided in this example. The direction from at least a part of the magnetic portion 12 C toward the third conductive layer 33 is along the first direction. In the embodiment, the third conductive layer 33 may be continuous with the first conductive layer 31 or the second conductive layer 32 . The third electrode 53 may be continuous with the first electrode 51 or the second electrode 52 . A third insulating layer 33 i is provided in this example. The third insulating layer 33 i is provided between the at least the part of the magnetic portion 12 C and at least a part of the third conductive layer 33 .

In this example, a third magnetic film 43 is further provided. For example, the third conductive layer 33 is located between the third magnetic film 44 and the third insulating layer 33 i in the Z-axis direction. For example, the third conductive layer 33 is located between two parts of the third magnetic film 42 in the X-Y plane.

As shown in FIG. 6C , in the fourth memory portion MP 4 , a fourth magnetic member 10 D, a fourth electrode 54 and a fourth magnetic layer 10 LD, and a fourth non-magnetic layer 10 n D are provided.

The fourth magnetic member 10 D includes an extending portion 10 e D being tubular. The extending portion 10 e D extends along the first direction (the Z-axis direction). The extending portion 10 e D includes a magnetic portion 11 D and a magnetic portion 12 D. The direction from the magnetic portion 11 D toward the magnetic portion 12 D is along the first direction. The fourth magnetic member 10 D further includes a magnetic portion 13 D. The magnetic portion 13 D is connected with the magnetic portion 12 D.

The fourth electrode 54 is electrically connected with the magnetic portion 11 D. The fourth non-magnetic layer 10 n D is provided between the fourth magnetic layer 10 LD and at least a part of the magnetic portion 13 D. A fourth insulation part 61 D is provided in the extending portion 10 e D.

The controller 70 is further electrically connected with the fourth electrode 54 and the fourth magnetic layer 10 LD. In this example, a fourth functional element 75 D is provided on a current path between the fourth magnetic layer 10 LD and the controllers 70 . A fourth conductive layer 34 is provided in this example. The direction from at least a part of the magnetic portion 12 D toward the fourth conductive layer 34 is along the first direction. In the embodiment, the fourth conductive layer 34 may be continuous with the first conductive layer 31 , the second conductive layer 32 , or the third conductive layer 33 . The fourth electrode 54 may be continuous with the first electrode 51 , the second electrode 52 , or the third electrode 53 . A fourth insulating layer 34 i is provided in this example. The fourth insulating layer 34 i is provided between the at least the part of the magnetic portion 12 D, and the at least a part of the fourth conductive layer 34 .

In this example, a fourth magnetic film 44 is further provided. For example, the fourth conductive layer 34 is located between the fourth magnetic film 44 and the fourth insulating layer 34 i in the Z-axis direction. For example, the fourth conductive layer 34 is located between two parts of the fourth magnetic film 44 in the X-Y plane.

The same configuration as the first magnetic member 10 is applicable to the second magnetic member 10 B, the third magnetic member 10 C, and the fourth magnetic member 10 D. The same configuration as the first electrode 51 is applicable to the second electrode 52 , the third electrode 53 , and the fourth electrode 54 . The same configuration as the first magnetic layer 10 L is applicable to the second magnetic layer 10 LB, the third magnetic layer 10 LC, and the fourth magnetic layer 10 LD. The same configuration as the first non-magnetic layer 10 n is applicable to the second non-magnetic layer 10 n B, the third non-magnetic layer 10 n C, and the fourth non-magnetic layer 10 n D.

FIG. 7 is a schematic plan view illustrating another magnetic memory device according to the first embodiment.

As shown in FIG. 7 , a plurality of memory portions are provided in a magnetic memory device 130 . In this example, the first memory portion MP 1 , the second memory portion MP 2 , and the third memory portion MP 3 are shown. One conductive layer (the first conductive layer 31 ) is provided with respect to the plurality of memory portions.

For example, the first conductive layer 31 includes a fourth conductive portion 31 d in addition to the first to third conductive portions 31 a - 31 c . In this example, the first conductive layer 31 further includes a fifth conductive portion 31 e . The fourth conductive portion 31 d is located between the third conductive portion 31 c and the second conductive portion 31 b . The fifth conductive portion 31 e is located between the fourth conductive portion 31 d and the second conductive portion 31 b.

In the second memory portion MP 2 , a direction from at least a part of the fifth magnetic portion 12 B toward the fourth conductive portion 31 d is along the first direction (Z-axis direction). At least a part of the fourth conductive portion 31 d overlaps the fifth magnetic portion 12 B in the Z-axis direction.

In the third memory portion MP 3 , a direction from the at least the part of the magnetic portion 12 C toward the fifth conductive portion 31 e is along the first direction (the Z-axis direction). At least a part of the fifth conductive portion 31 e overlap the magnetic portion 12 C in the Z-axis direction.

Also in such the magnetic memory device 130 , a magnetic field by the first current flowing in the first conductive layer 31 is applied effectively to each of the memory portions. The stable operation can be obtained.

In this example, a direction from the first extending portion 10 e toward the second extending portion 10 e B is along a second direction. The second direction crosses the first direction (the Z-axis direction). In this example, the second direction is the X-axis direction. A direction from the first magnetic layer 10 L toward the second magnetic layer 10 LB is along the second direction (the X-axis direction). In this example, the first conductive layer 31 linearly extends along the X-axis direction.

FIG. 8 and FIG. 9 are schematic plan views illustrating another magnetic memory device according to the first embodiment.

As shown in FIG. 8 and FIG. 9 , in magnetic memory devices 131 and 132 , a plurality of memory portions (the first memory portion MP 1 , the second memory portion MP 2 , the third memory portion MP 3 , and the fourth memory portion MP 4 ) are provided. A conductive layer (the first conductive layer 31 ) is provided with respect to the plurality of memory portions.

In the magnetic memory devices 131 and 132 , a direction from the first extending portion 10 e toward the second extending portion 10 e B crosses a direction from the first magnetic layer 10 L toward the second magnetic layer 10 LB.

For example, a second direction from the second magnetic portion 12 toward the third magnetic portion 13 crosses the first direction (the Z-axis direction). The second direction in this case is the Y-axis direction. A direction from the at least the part of the third conductive portion 31 c toward the at least the part of the fourth conductive portion 31 d crosses the second direction (the Y-axis direction). The direction from the at least the part of the third conductive portion 31 c toward the at least the part of the fourth conductive portion 31 d is inclined with respect to the second direction (the Y-axis direction).

In the magnetic memory devices 131 and 132 , a direction from the first extending portion 10 e toward the third extending portion 10 e C is along the X-axis direction. A direction from the second extending portion 10 e B toward the fourth extending portion 10 e D is along the X-axis direction. A direction from the first magnetic layer 10 L toward the third magnetic layer 10 LC is along the X-axis direction. A direction from the second magnetic layer 10 LB toward the third magnetic layer 10 LD is along the X-axis direction.

High density is obtained in the plurality of memory portions by the above-mentioned arrangement.

In the magnetic memory device 131 , a direction from the first conductive portion 31 a toward the second conductive portion 31 b is along the X-axis direction. In the magnetic memory device 132 , a direction from the first conductive portion 31 a toward the second conductive portion 31 b is inclined with respect to the X-axis direction.

In the magnetic memory device 131 , the third conductive portion 31 c is curved rounded. In the magnetic memory device 132 , the direction of the third conductive portion 31 c changes right-angled substantially.

FIG. 10 is a schematic plan view illustrating another magnetic memory device according to the first embodiment.

As shown in FIG. 10 , in a magnetic memory device 133 , a plurality of memory portions (first memory portion MP 1 , second memory portion MP 2 , third memory portion MP 3 , and fourth memory portion MP 4 ) are provided. The first conductive layer 31 is provided for the first memory portion MP 1 and the second memory portion MP 2 . The second conductive layer 32 is provided for the third memory portion MP 3 and the fourth memory portion MP 4 .

A direction from the first extending portion 10 e toward the second extending portion 10 e B is along the X-axis direction. A direction from third extending portion 10 e C toward the fourth extending portion 10 e D is along the X-axis direction. A direction from the first magnetic layer 10 L toward the second magnetic layer 10 LB is along the X-axis direction. A direction from third magnetic layer 10 LC toward the fourth magnetic layer 10 LD is along the X-axis direction.

A position of the third extending portion 10 e C in the X-axis direction is between a position of the first extending portion 10 e in the X-axis direction and a position of the second extending portion 10 e B in the X-axis direction. A position of the third magnetic layer 10 LC in the X-axis direction is between a position of the first magnetic layer 10 L in the X-axis direction and a position of the second magnetic layer 10 LB in the X-axis direction.

The position of the third magnetic layer 10 LC in the Y-axis direction is between a position of the first magnetic layer 10 L in the Y-axis direction and a position of the second conductive layer 32 in the Y-axis direction. High memory density is obtained in the magnetic memory device 133 .

FIG. 11 is a schematic perspective view illustrating another magnetic memory device according to the first embodiment.

As shown in FIG. 11 , in the magnetic memory device 133 , a plurality of memory portions (the first memory portion MP 1 , the second memory portion MP 2 , eth third memory portion MP 3 , and the fourth memory portion MP 4 ) are provided. In this example, one electrode (the first electrode 51 ) is provided with respect to these memory portions. The first electrode 51 is electrically connected with the first magnetic portion 11 , the fourth magnetic portion 11 B, the magnetic portion 11 C, and the magnetic portion 11 D.

A first interconnect Lw 1 , a second interconnect Lb 1 , a third interconnect Lw 2 , and a fourth interconnect Lb 2 are provided. The first interconnect Lw 1 and the third interconnect Lw 2 extend along the X-axis direction, for example. The second interconnect Lb 1 and fourth interconnect Lb 2 extend along the Y-axis direction, for example.

The first functional element 75 , the second functional element 75 B, the third functional element 75 C, and the fourth functional element 75 D are provided. In this example, these functional elements are transistors.

An end of the first functional element 75 is electrically connected with the first magnetic layer 10 L. Another end of the first functional element 75 is electrically connected with first interconnect Lw 1 . A gate of the first functional element 75 is electrically connected with second interconnect Lb 1 .

An end of the second functional element 75 B is electrically connected with second magnetic layer 10 LB. Another end of the second functional element 75 B is electrically connected with first interconnect Lw 1 . A gate of the second functional element 75 B is electrically connected with fourth interconnect Lb 2 .

An end of the third functional element 75 C is electrically connected with third magnetic layer 10 LC. Another end of the third functional element 75 C is electrically connected with third interconnect Lw 2 . A gate of the third functional element 75 C is electrically connected with second interconnect Lb 1 .

An end of the fourth functional element 75 D is electrically connected with fourth magnetic layer 10 LD. Another end of the fourth functional element 75 D is electrically connected with third interconnect Lw 2 . A gate of the fourth functional element 75 D is electrically connected with fourth interconnect Lb 2 .

One of the plurality of the memory portions is selected by potentials of the plurality of the interconnects. In the selected memory portion, the writing operation, the shift operation, or the reading operation is performed.

For example, the first interconnect Lw 1 and the third interconnect Lw 2 function as a word line. The second interconnect Lb 1 and the fourth interconnect Lb 2 function as a bit line, for example.

FIG. 12A and FIG. 12B are a schematic view illustrating the magnetic memory device according to the first embodiment.

In FIG. 12A and FIG. 12B , the second memory portion MP 2 is provided in a magnetic memory device 121 . In the second memory portion MP 2 , the second magnetic member 10 B, the second electrode 52 and second magnetic layer 10 LB, and the second non-magnetic layer 10 n B are provided. In FIG. 12A and FIG. 12B , the second magnetic layer 10 LB and the second non-magnetic layer 10 n B are not shown.

The second magnetic member 10 B includes the second extending portion 10 e B being tubular. The second extending portion 10 e B extends along the first direction (Z-axis direction). The second extending portion 10 e B includes the fourth magnetic portion 11 B and the fifth magnetic portion 12 B. A direction from the fourth magnetic portion 11 B toward the fifth magnetic portion 12 B is along the first direction. The second magnetic member 10 B further includes the sixth magnetic portion 13 B. The sixth magnetic portion 13 B is connected with the fifth magnetic portion 12 B.

The second conductive layer 32 is provided. At least a part of the second conductive layer 32 is curved along the second extending portion 10 e B.

The second conductive layer 32 may be continuous with the first conductive layer 31 . In such a case, the first conductive layer 31 may also include the fourth conductive portion 31 d (refer to FIG. 6 ). The fourth conductive portion 31 d may function as the second conductive layer 32 . In such a case, at least a part of the fourth conductive portion 31 d is curved along the second extending portion 10 e B.

Second Embodiment

FIG. 13 is a schematic perspective view illustrating a magnetic memory device according to a second embodiment.

As shown in FIG. 13 , a magnetic memory device 140 includes the first magnetic member 10 , the first electrode 51 , the first magnetic layer 10 L, the first non-magnetic layer 10 n , and the controller 70 . In the magnetic memory device 140 , an element layer 76 is further provided. The element layer 76 is one example of the first functional element 75 , for example. In the magnetic memory device 140 , the configuration other than the element layer 76 is the same as the magnetic memory devices (for example, magnetic memory device 110 or 120 etc.) described about the first embodiment. Hereinafter, the element layer 76 is described.

The element layer 76 is provided on a current path between the first magnetic layer 10 L and the controller 70 . In this example, the element layer 76 is provided between the first magnetic layer 10 L and the first interconnect Lw 1 . A conductive film 76 A is provided between the element layer 76 and the first magnetic layer 10 L. A conductive film 76 B is provided between the first interconnect Lw 1 and the element layer 76 . The first magnetic layer 10 L is located between the element layer 76 and the first non-magnetic layer 10 n.

The first electrode 51 is electrically connected with the second interconnect Lb 1 , for example.

The element layer 76 includes at least one selected from the group consisting of Ge and Te, for example. The element layer 76 functions, for example as a nonlinear element. In the element layer 76 , for example the slope of the I-V characteristic in a first voltage range is different from the slope of the I-V curve in a second voltage range. The element layer 76 has diode characteristic for example. In the element layer 76 , the slope of the I-V characteristic in a third voltage range is different from the slope of the I-V curve in first and second voltage ranges. These voltage ranges are different from each other. The element layer 76 has an ovonic threshold switch characteristic, for example.

By providing the element layer 76 , one of the memory portions can be selected. In a magnetic memory device 140 , few interconnects are provided in one memory portion. A high-density magnetic memory device can be provided.

FIG. 14 is a schematic perspective view illustrating another magnetic memory device according to the second embodiment.

As shown in FIG. 14 , a magnetic memory device 141 includes a plurality of memory portions (for example, first memory portion MP 1 etc.). Conductive layers (for example, first conductive layer 31 etc.) are straight lines-like.

FIG. 15 is a schematic perspective view illustrating another magnetic memory device according to the second embodiment.

As shown in FIG. 15 , a magnetic memory device 142 includes a plurality of memory portions (for example, first memory portion MP 1 etc.). Conductive layers (for example, first conductive layer 31 etc.) bend in the shape of ZIG ZAG.

A second direction from the second magnetic portion 12 toward the third magnetic portion 13 is taken as the Y-axis direction. A direction crossing a plane (Z-Y plane) including the first direction (Z-axis direction) and the second direction (Y-axis direction) is taken as a third direction. The third direction in this case is along the X-axis direction. In the third direction, at least a part of the fourth conductive portion 31 s overlap the first conductive layer 10 L.

Also in the magnetic memory devices 140 - 142 , the stable operation is possible.

Hereinafter, the example of the material in the embodiment is described.

The first magnetic member 10 includes a perpendicular magnetization film, for example.

The first magnetic member 10 may also include a rare earth-transition metal amorphous alloy, for example. The rare earth-transition metal amorphous alloy includes an alloy including a rare earth transition metal and a 3d transition metal, for example. The rare earth-transition metal amorphous alloy is a ferrimagnetic material, for example. The rare earth-transition metal amorphous alloy includes at least one selected from the group consisting of Tb (terbium, Dy (dysprosium), and Gd (gadolinium), for example, and at least one of the transition metals. The rare earth-transition metal amorphous alloy includes at least one selected from the group consisting of TbFe, TbCo, TbFeCo, DyTbFeCo, GdTbCo, and GdFeCo, for example.

The first magnetic member 10 may also include a multilayer film, for example. The first magnetic member 10 includes at least one selected from the group consisting of the multilayer film including Co film and Ni film, the multilayer film including Co film and Pd film, and the multilayer film including Co film and Pt film, for example.

The first magnetic member 10 may also include a rule alloy, for example. The rule alloy includes at least one selected from the group consisting of Fe, Co, and Ni, for example, and at least one selected from the group consisting of Pt and Pd. The crystal structure in the rule alloy is L 10 type, for example. The rule alloy may also include at least one selected from the group consisting of Co 50 Pd 50 , Co 50 Pt 50 , Fe 50 Pt 50 , Fe 50 Pd 50 , Fe 30 Ni 20 Pd 50 , Co 30 Fe 10 Ni 10 Pt 50 , and Co 30 Ni 20 Pt 50 , for example. The composition ratio in the rule alloy is not limited above.

The first magnetic member 10 may also include the rule alloy and other elements. The other elements include at least one selected from the group consisting of V, Mn, Cu, Cr, B, and Ag, for example. An anisotropy energy or a saturation magnetization may be adjusted by addition of these elements, for example. For example, a large anisotropy energy is obtained.

The first magnetic layer 10 L includes at least one selected from the group consisting of Fe, Co, and Ni, for example. The first magnetic layer 10 L may also include an alloy including at least one selected from the group consisting of Fe, Co, and Ni, for example. The first magnetic layer 10 L may also further include other elements (for example, half-metal), for example. Other elements include at least one selected from the group consisting of boron and silicon, for example. The first magnetic layer 10 L may also include a multilayer film, for example. A multilayer film includes a first film and a second film. The first film includes at least one selected from the group consisting of Fe, Co, and Ni, for example. The second film includes platinum metals (for example, Pt, Pd, etc.). The first magnetic layer 10 L includes a multilayer film (Co—Fe/Ni multilayer film) including the film and nickel film of a Co—Fe alloy, for example.

The first electrode 51 includes at least one selected from the group consisting of Cu, Ag, Au, and Al, for example. At least either of these electrodes may also include an alloy including at least one of the elements of these.

The first non-magnetic layer 10 n includes at least one selected from the group consisting of aluminum oxide (AlO x ), aluminum nitride (AlN), magnesium oxide (MgO), magnesium nitride, silicon oxide (SiO 2 ), silicon nitride (Si—N), silicon oxynitride (Si—O—N), TiO 2 , and Cr 2 O 3 . Such materials function as a non-magnetic tunnel barrier, for example. The first non-magnetic layer 10 n may also include non-magnetic metal, for example. With a suitable material (and thickness) of the first non-magnetic layer 10 n , the magnetoresistive effect is effective, for example.

The first magnetic film 41 may include at least one selected from the group consisting of FeNi, and CoZr, for example. The first magnetic film 41 may include a soft ferromagnetic materials. The first magnetic film 41 may include an alloy including at least one selected from the group consisting of Fe, Co, and Ni, for example. The first magnetic film 41 may further include other elements including at least one selected from the group consisting of boron, silicon, germanium for example. The covering thickness of the first magnetic film 41 on the conductive layer 31 is not less than 1 nm and not more than 10 nm, for example.

According to the embodiment, a magnetic memory device capable of stably operating can be provided.

In the specification of the application, “perpendicular” and “parallel” refer to not only strictly perpendicular and strictly parallel but also include, for example, the fluctuation due to manufacturing processes, etc. It is sufficient to be substantially perpendicular and substantially parallel.

Hereinabove, exemplary embodiments of the invention are described with reference to specific examples. However, the embodiments of the invention are not limited to these specific examples. For example, one skilled in the art may similarly practice the invention by appropriately selecting specific configurations of components included in magnetic memory devices such as magnetic members, magnetic layers, non-magnetic layers, conductive layers, electrodes, insulating layers, magnetic films, controllers, etc., from known art. Such practice is included in the scope of the invention to the extent that similar effects thereto are obtained.

Further, any two or more components of the specific examples may be combined within the extent of technical feasibility and are included in the scope of the invention to the extent that the purport of the invention is included.

Moreover, all magnetic memory devices practicable by an appropriate design modification by one skilled in the art based on the magnetic memory devices described above as embodiments of the invention also are within the scope of the invention to the extent that the spirit of the invention is included.

Various other variations and modifications can be conceived by those skilled in the art within the spirit of the invention, and it is understood that such variations and modifications are also encompassed within the scope of the invention.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the invention.