Lens module

This application claims priority to Chinese Patent Application No. 201711337672.1 filed on Dec. 13, 2017, the contents of which are incorporated by reference herein.

The subject matter herein generally relates to a lens module.

Nowadays, with the development of the electronic device, the electronic device has configured on lens module for taking photos. Photo performance has been an important parameter of the electronic device for users.

Photo performance of the electronic device is depends on the lens module. Usually, the lens module includes a circuit assembled together with a lens unit, a motor, a sensor and a base. The lens unit, the motor, the base, the sensor, and the circuit are sealed together for preventing dust and moisture etc into the lens module. However, many of the lens unit, the base, sensor, and the circuit are made of plastic material and have bad heat dissipation. While the lens module works in a long time, the circuit may generate a lot of heat, the heat from the circuit can make the sensor, the lens unit or the base occur thermal expansion. Thus, thermal expansion of the sensor, the lens unit or the base can influence the photo performance of the lens module. Further, nowadays, the electronic devices have designed becoming more frivolous, the lens module and the electronic components (such as antenna, CPU etc.) of the electronic device have small distance. Thus, an electromagnetic interference between the lens module and the electronic components of the electronic device may be generated to make noise point on photos.

Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.

FIG. 1 is an isometric view of a lens module of the present disclosure.

FIG. 2 is an exploded view of the lens module of FIG. 1 .

FIG. 3A is an isometric view of a base of the lens module.

FIG. 3B is an isometric of the base of the lens module showed from another angle.

FIG. 4 is a cross-sectional view of the lens module of FIG. 1 .

It will be appreciated that for simplicity and clarity of illustration, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure. The description is not to be considered as limiting the scope of the embodiments described herein.

Several definitions that apply throughout this disclosure will now be presented. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like. The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected.

Referring to FIGS. 1-2 , a lens module 100 of the present disclosure includes a circuit 10 , a sensor 20 mounted, a base 30 , an optical filter 40 , a motor 50 and a lens unit 60 . The sensor 20 and the base 30 are mounted on the circuit 10 . The optical filter 40 , the motor 50 and the lens unit 60 are assembled on the base 30 . The lens module 100 catches light through lens unit 60 and forms images on the sensor 20 .

The circuit 10 can be rigid circuit board or flexible printed circuit board. The circuit 10 is used to connect with a power and control the motor, the sensor 20 to work.

The circuit 10 includes a connector 11 . The connector 11 is mounted on an end of the circuit 10 and coupled with some electronic components.

The sensor 20 is made of semiconductor materials with high sensitivity. Light entered from the lens unit 60 is through the optical filter 40 and imaged on the sensor 20 . The sensor 20 is mounted on an end of the circuit 10 away from the connector 11 . In the exemplary embodiment, the sensor includes CCD (charge coupled device) component or CMOS (complementary metal oxide semiconductor) component.

Also referring to FIGS. 3A-3B and FIG. 4 , the base 30 is mounted on the circuit 10 . The base 30 is coupled with the circuit 10 and the motor 50 with conducting resin 70 . The conducting resin 70 includes a first conducting resin 71 coupled between the circuit 10 and the base 30 , and a second conducting resin 72 coupled between the base 30 and the motor 50 . The base 10 supports the optical filter 40 and the motor 50 thereon and received the sensor 20 therein.

Specially, the base 30 has a first surface 301 , a second surface 302 opposite to the first surface 301 and an outer surface connected with the first surface 301 and the second surface 302 . The base 30 also forms a sunken portion 31 concaved from the first surface 301 to the second surface 302 . The sensor 20 is received in the sunken portion 31 . A bottom of the sunken portion 31 forms a through hole 310 cooperated correspondingly with the lens unit 60 . The base 30 also forms a cavity 3020 concaved from the second surface 302 to the first surface 301 . The cavity 3020 communicates with the through 310 . A diameter of the cavity 3020 is greater than a diameter of the through hole 310 . The through hole 310 is used to receive the optical filter 40 therein. The base 10 also forms a connecting portion 3021 . The connecting portion 3021 is formed on an outer periphery of the cavity 3020 to cooperate with the motor 50 and the lens unit 60 .

Further, the base 10 also forms a plurality of heat dissipation layers 32 . In the exemplary embodiment, the heat dissipation layers 32 are spaced from each other. Two non-adjacent heat dissipation layers 32 are relative each other. Each heat dissipation layer 32 includes a main portion 321 , a first extending portion 322 and a second extending portion 323 . The first extending portion 322 and the second extending portion 323 are respectively extended from two ends of the main portion 321 to the second surface 302 of the base 30 . Specifically, the main portion 321 is formed on the first surface 301 of the base 30 . The first extending portion 322 extends from an end of the main portion 321 and along an inner surface 311 of the sunken portion 31 to an bottom surface 312 of the sunken portion 31 . The first extending portion 322 contacts to the inner surface 311 and the bottom surface 312 of the sunken portion 31 . The second extending portion 323 extends from another end of the main portion 321 and along the outer surface 303 of the base 30 to the second surface 302 of the base 30 . The first conducting resin 71 is coupled between the main portion 321 of the base 10 and the circuit 10 .

In the exemplary embodiment, the base 30 is made of plastic material except for the heat dissipation layer 32 . The heat dissipation layer 32 is made of metal material. The heat dissipation layer 32 is formed on the base 30 by plating.

The optical filter 40 is received in the cavity 3020 and opposite to the lens unit 60 . The optical filter 40 absorbs selectively light with some wavelengths to improve an image quality of the lens module 100 .

The motor 50 is assembled on the base 30 for deriving to change an focus of the lens unit 60 . Generally, the motor 50 has a first end 51 and a second end 52 opposite to the first end 51 . The first end 51 cooperates with the connecting portion 3021 of the base 30 . The second conducting resin 72 is coupled between an periphery of the first end 51 and the second extending portion 323 of the heat dissipation layer 32 . So, an static electricity generated from the motor 30 can be conducted to the circuit 10 through the heat dissipation layer 32 .

Further, an center of the motor 50 forms a receiving hole 501 extended throughout the first end 51 and the second end 52 . The receiving hole 501 is corresponding to the through hole 310 and receives the lens unit 60 therein.

Further, the lens unit 100 includes a protective film 80 mounted on the second end 52 of the motor 50 . The protective 80 covers on the receiving hole 501 to prevent the lens unit 60 from scratch or collision.

In the lens module 100 of the present disclosure, because the base 30 forms the heat dissipation layer 32 made of metal material, and the heat dissipation layer 32 coupled with the circuit 10 and the motor 50 by the conducting resin 70 , so static electricity from the motor 50 conducts to the circuit 10 through the heat dissipation layer 32 . So, the static electricity can be prevented from influencing the image formed on the sensor 20 . Thus, the lens unit 100 has good image quality. Also, heat generated from the motor 50 can be dissipated directly by the heat dissipation layer 32 . Thus, the heat dissipation layer also can improve a heat resistance of the lens module 100 . Further, the heat dissipation layer 32 also can prevent an electromagnetic radiation from electronic component from presenting noisy point. So the lens module 100 of the present disclosure has a good image quality and heat resistance.

The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of an lens module. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes can be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above can be modified within the scope of the claims.