Inventor
Shin-Wen Chen
Inventor
New Taipei, TW
Overview
Patents· 56 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Nprimary
H04NPictorial communication, e.g. television25%
G02BOptical elements, systems or apparatus16%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them15%
H05KPrinted circuits14%
H01LSemiconductor devices7%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%
G06VImage or video recognition or understanding2%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light2%
Y10TTechnical subjects covered by former us classification2%
H02KDynamo-electric machines1%
PatentTitleYear
10,863,624Camera module with reduced light leakage and electronic device using same202010,863,068Camera module202010,856,418Power supply for a camera202010,827,105Lens module and electronic device using the lens module202010,827,128Camera module and electronic device using same202010,823,973Laser light projection module having transparent conductive film with insulating colloid in connecting junction202010,827,606Lens module having photosensitive chip embedded in through hole of circuit board and assembly method thereof202010,785,4673D sensing camera of electronic device202010,768,413Flare- and ghost-free imaging device202010,768,392Lens module and method of assembling lens module202010,763,734Voice coil motor202010,763,735Voice coil motor and electronic device having the same202010,754,232Optical projector module202010,749,046Encapsulation structure for image sensor chip and method for manufacturing the same202010,748,946Lens module202010,748,829Encapsulation structure for image sensor chip and method for manufacturing the same202010,743,415Camera module with reduced light leakage and electronic device using same202010,712,642Optical projection module with improved heat dissipation202010,681,255Holder for camera module and camera module with holder202010,663,744Optical projector device202010,666,843Imaging chip packaging structure and camera device having the same202010,645,352Optical projection module202010,627,097Optical projection device202010,585,335Camera module202010,574,875Camera module202010,574,870Lens module comprising an image sensor mounted in the receiving groove of a circuit board with electronic components and method for assembling the same202010,564,523Constant-focus camera module202010,567,625Lens module with enhanced stability202010,484,586Camera module and lens holder of the camera module201910,359,615Camera module201910,274,812Camera module201910,268,018Lens module201910,178,285Double-camera imaging device20199,971,938Camera module20189,413,932'Camera module having efficient electromagnetic shielding'20169,413,933'Camera module with electro-magnetic interference shielding'20169,392,170'Multi-mode camera module'20169,272,493'Stamping head used for pressing anisotropic conductive film onto ceramic substrate'20169,223,145'Device for assembling camera module having anisotropic conductive film'20159,197,797'Camera module'20159,095,943'Apparatus for assembling camera modules'20159,041,849'Image sensor module and camera module using same'20159,040,140'SMT tape'20159,030,602'Image sensor module and camera module using same'20159,013,621'Image sensor module and camera module using same'20159,007,499'Image sensor module and camera module using same'20158,982,257'Image sensor module and camera module using same'20158,982,276'Camera module with ambient light sensor'20158,976,291'Image sensor module with substrate defining gas pressure relieving hole and camera module using same'20158,917,340'Circuit board assembly and camera module using same'20148,884,164'Circuit board assembly with flexible printed circuit board and reinforcing plate'20148,872,037'Circuit board assembly with flexible circuit board and reinforcing plate'20148,836,830'Flexible printed circuit board assembly with stiffener and camera module'20148,780,243'Image sensor module and camera module using same'20148,622,638'Protection cap for protecting camera module'20147,744,296'Camera module having colloid layer surrounding sensor'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2020Patents assigned to HON HAI PREC IND CO LTD (38)· patent assignee history
2010Based in Taipei, TW· patent location history
2014–2018Patents assigned to HONGFUJIN PREC IND SHENZHEN (11)· patent assignee history
2014–2020Based in New Taipei, TW· patent location history
2019–2020Patents assigned to TRIPLE WIN TECH SHENZHEN CO LTD (28)· patent assignee history
2020Patents assigned to TRIPLE WIN TECHNOLOGY(SHENZHEN) CO LTD (3)· patent assignee history
2020Patents assigned to TRIPLE WIN TECHNOLOGY(SHENZHEN) COLTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HON HAI PREC IND CO LTD | 38 | 2010–2020 |
| TRIPLE WIN TECH SHENZHEN CO LTD | 28 | 2019–2020 |
| HONGFUJIN PREC IND SHENZHEN | 11 | 2014–2018 |
| TRIPLE WIN TECHNOLOGY(SHENZHEN) CO LTD | 3 | 2020 |
| TRIPLE WIN TECHNOLOGY(SHENZHEN) COLTD | 3 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Taipei, TW | 55 | 2014–2020 |
| Taipei, TW | 1 | 2010 |