Memory device

This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2017-059602, filed Mar. 24, 2017; the entire contents of which are incorporated herein by reference.

Embodiments described herein relate generally to a memory device.

An MRAM (Magnetoresistive Random Access Memory) is a memory device that uses a magnetic element with a magnetoresistive effect as a memory cell configured to store information. The MRAM has received attention as a next generation memory device featuring a high speed operation, large capacity, and nonvolatility. The MRAM is under research and development as a replacement for a volatile memory such as a DRAM (Dynamic Random Access Memory) or an SRAM (Static Random Access Memory). In this case, the MRAM is preferably operated in the same specifications as the DRAM and the SRAM from the viewpoint of keeping the development cost low and implementing smooth replacement.

FIG. 1 is a block diagram showing a memory system including a memory device according to the first embodiment;

FIG. 2 is a circuit diagram showing the memory array of the memory device according to the first embodiment;

FIG. 3 is a view showing the basic arrangement of a memory cell of the memory device according to the first embodiment;

FIG. 4 is a block diagram showing a sense amplifier & write driver of the memory device according to the first embodiment;

FIG. 5 is a circuit diagram showing the preamplifier of the memory device according to the first embodiment;

FIG. 6 is a circuit diagram showing the sense amplifier of the memory device according to the first embodiment;

FIG. 7 is a flowchart showing the read operation of the memory system including the memory device according to the first embodiment;

FIG. 8 is a timing chart of the read operation of the memory system according to the first embodiment;

FIG. 9 is a circuit diagram showing the operation of the preamplifier of the memory device according to the first embodiment in a first read operation;

FIG. 10 is a circuit diagram showing the operation of the preamplifier of the memory device according to the first embodiment in a write operation;

FIG. 11 is a circuit diagram showing the operation of the preamplifier of the memory device according to the first embodiment in a second read operation;

FIG. 12 is a circuit diagram showing the operation of the sense amplifier of the memory device according to the first embodiment in a determination operation;

FIG. 13 is a graph showing the relationship between the characteristic of a transistor M 8 and the characteristic of a memory cell in the first read and the relationship between the characteristic of the transistor M 8 and the characteristic of the memory cell in the second read;

FIG. 14 is a graph showing the relationship of voltages after the second read operation;

FIG. 15 is a timing chart showing currents and voltages generated in the sense amplifier in a case in which the memory cell stores “1” data at the time of the first read operation;

FIG. 16 is a timing chart showing currents and voltages generated in the sense amplifier in a case in which the memory cell stores “0” data at the time of the first read operation;

FIG. 17 is a timing chart of the read operation of the memory system according to the first embodiment;

FIG. 18 is a circuit diagram showing the operation of the sense amplifier of the memory device according to the first embodiment in the determination operation;

FIG. 19 is a circuit diagram showing the preamplifier of a memory device according to a comparative example of the first embodiment;

FIG. 20 is a timing chart showing the waveform of a voltage at the time of the read operation of the memory system according to the first embodiment and the waveform of a voltage at the time of the read operation of the memory system according to the comparative example of the first embodiment;

FIG. 21 is a circuit diagram showing the preamplifier of a memory device according to the second embodiment;

FIG. 22 is a timing chart of the read operation of a memory system according to the second embodiment;

FIG. 23 is a timing chart of the read operation of the memory system according to the second embodiment;

FIG. 24 is a circuit diagram showing the sense amplifier of a memory device according to the third embodiment;

FIG. 25 is a timing chart of the read operation of a memory system according to the third embodiment;

FIG. 26 is a circuit diagram showing the operation of the sense amplifier of the memory device according to the third embodiment in a determination operation;

FIG. 27 is a timing chart of the read operation of the memory system according to the third embodiment;

FIG. 28 is a circuit diagram showing the operation of the sense amplifier of the memory device according to the third embodiment in a determination operation;

FIG. 29 is a timing chart of the read operation of a memory system according to the fourth embodiment; and

FIG. 30 is a timing chart of the read operation of the memory system according to the fourth embodiment.

In general, according to one embodiment, a memory device includes a memory cell; and a first circuit configured to perform first read for the memory cell and generate a first voltage, write first data to the memory cell that has undergone the first read, perform second read for the memory cell to which the first data is written and generate a second voltage, and determine data stored in the memory cell at the time of the first read based on the first voltage and the second voltage, wherein when writing the first data, the first circuit electrically sets a generation unit configured to generate the second voltage in a floating state.

Embodiments will now be described with reference to the accompanying drawings. Note that in the following explanation, the same reference numerals denote constituent elements having almost the same functions and arrangements, and a repetitive description will be made only when necessary. The embodiments to be described below merely exemplify devices and methods for embodying the technical concepts of the embodiments, and the technical concepts of the embodiments do not limit the materials, shapes, structures, layouts, and the like of the components to those to be described below. The technical concepts of the embodiments allow various changes and modifications to be made in the appended claims.

Each functional block can be implemented as one of hardware and computer software or a combination thereof. For this reason, each block will be described from the viewpoint of its function to clearly show that the block is implemented by either of them. Whether the function is executed as hardware or software depends on a detailed embodiment or a design restriction imparted to the whole system. Those skilled in the art can implement these functions by various methods for each detailed embodiment. However, deciding the implementation is incorporated in the present invention.

A case in which an MRAM is applied to a memory array will be described in the following embodiments.

<1> First Embodiment

<1-1> Arrangement

<1-1-1> Arrangement of Memory System

The basic arrangement of a memory system 1 according to the first embodiment will schematically be described with reference to FIG. 1 . The memory system 1 includes a memory device 10 and a memory controller 20 .

<1-1-2> Arrangement of Memory Controller

The memory controller 20 receives an instruction from a host (external device) 2 such as a personal computer, and reads data from the memory device 10 or writes data to the memory device 10 .

The memory controller 20 includes a host interface (I/F) 21 , a data buffer 22 , a register 23 , a CPU (Central Processing Unit) 24 , a device interface (I/F) 25 , and an ECC (Error Correcting Code) circuit 26 .

The host interface 21 is connected to the host 2 . Data transmission/reception or the like is performed between the host 2 and the memory system 1 via the host interface 21 .

The data buffer 22 is connected to the host interface 21 . The data buffer 22 receives data transmitted from the host 2 to the memory system 1 via the host interface 21 and temporarily stores the data. The data buffer 22 also temporarily stores data to be transmitted from the memory system 1 to the host 2 via the host interface 21 . The data buffer 22 can be a volatile memory or a nonvolatile memory.

The register 23 is, for example, a volatile memory, and stores setting information, a command, a status, or the like executed by the CPU 24 . The register 23 can be a volatile memory or a nonvolatile memory.

The CPU 24 controls the operation of the entire memory system 1 . The CPU 24 , for example, executes predetermined processing for the memory device 10 in accordance with a command received from the host 2 .

The device interface 25 transmits/receives various kinds of signals between the memory controller 20 and the memory device 10 .

The ECC circuit 26 receives, via the data buffer 22 , write data received from the host 2 . The ECC circuit 26 adds an error correcting code to the write data. The ECC circuit 26 supplies the write data with the added error correcting code to, for example, the data buffer 22 or the device interface 25 .

In addition, the ECC circuit 26 receives, via the device interface 25 , data supplied from the memory device 10 . The data is data stored in a memory cell of a memory array 11 . The FCC circuit 26 determines whether an error exists in the data received from the memory device 10 . Upon determining that an error exists in the received data, the ECC circuit 26 performs error correction processing for the received data using an error correcting code. The ECC circuit 26 then supplies the data that has undergone the error correction processing to, for example, the data buffer 22 or the device interface 25 .

<1-1-3> Arrangement of Memory Device

The memory device 10 according to the first embodiment includes the memory array 11 , a sense amplifier & write driver 12 , a column decoder 13 , a word line driver 14 , a row decoder 15 , an IO circuit 16 , a controller 17 , and a command address input circuit 18 .

Various kinds of external control signals, for example, a chip select signal CS, a clock signal CK, a clock enable signal CKE, and a command address signal CA are input from the memory controller 20 to the command address input circuit 18 . The command address input circuit 18 transfers the command address signal CA to the controller 17 .

The controller 17 identifies commands and addresses. The controller 17 controls the memory device 10 .

The memory array 11 is an MRAM in which a plurality of memory cells MC are two-dimensionally arranged in a matrix. Each memory cell MC includes an MTJ (Magnetic Tunnel Junction) element 30 (not shown) and a select transistor 31 (not shown). The MTJ element 30 is a magnetic tunnel junction element capable of storing data according to a change in the resistance state and rewriting the data by a current. The select transistor 31 is provided in correspondence with each MTJ element 30 and configured to be rendered conductive when supplying a current to the corresponding MTJ element 30 . Note that the MTJ element may be referred to as a resistance change element.

A plurality of word lines WL extend in the row direction, and a plurality of bit lines BL extend in the column direction. The word lines WL and the bit lines EL are wired to cross each other. Two adjacent bit lines EL form a pair, and a memory cell MC is provided in correspondence with the intersection between a word line WL and a bit line pair (to the referred to as the bit line BL and a source line SL for the descriptive convenience in this embodiment). The MTJ element 30 and the select transistor 31 of each memory cell MC are connected in series between the bit line EL and the source line EL (in a bit line pair). The gate of the select transistor 31 is connected to the word line WL.

The word line driver 14 is arranged at least along one side of the memory array 11 . The word line driver 14 is configured to apply a voltage to the word line WL in data read or data write.

The row decoder 15 decodes the address of the command address signal CA supplied from the command address input circuit 18 . More specifically, the row decoder 15 supplies the decoded row address to the word line driver 14 . Accordingly, the word line driver 14 can apply a voltage to the selected word line WL.

The column decoder 13 decodes the address of the command address signal CA supplied from the command address input circuit 18 . The column decoder 13 supplies the decoded column address to the sense amplifier & write driver 12 .

The sense amplifier & write driver 12 includes a sense amplifier and a write driver. The sense amplifier & write driver 12 is arranged at least along one side of the memory array 11 . The sense amplifier is connected to the bit line BL via a global bit line GBL and detects a current flowing to the memory cell MC connected to the selected word line WL, thereby reading data stored in the memory cell MC. The write driver is connected to the bit line BL via the global bit line GBL or to the source line SL via a global source line GSL. When writing data to the selected memory cell MC, the write driver supplies a current to the selected memory cell MC connected to the selected word line WL.

In addition, the sense amplifier & write driver 12 includes a page buffer (not shown). The page buffer is, for example, a volatile memory and stores data read by the sense amplifier or write data transferred via the IO circuit 16 .

Data transmission/reception between the sense amplifier & write driver 12 and a data line DQ is done via the IO circuit 16 .

<1-1-4> Memory Array

A detailed arrangement of the memory array of the memory device according to the first embodiment will be described next with reference to FIG. 2 . As described above, the memory array 11 is formed by arranging the plurality of memory cells MC in a matrix. More specifically, the memory array 11 is provided with a plurality of word lines WL 0 to WLi−1 (i: an integer of 2 or more), a plurality of bit lines BL 0 to BLj−1, and a plurality of source lines SL 0 to SLj−1 (j: an integer of 2 or more).

The memory cell MC is formed by the MTJ element 30 and the select transistor 31 . The select transistor 31 is formed from, for example, an N-channel MOSFET (Metal Oxide Silicon Field Effect Transistor).

One terminal of the MTJ element 30 is connected to the bit line BL, and the other terminal is connected to the drain of the select transistor 31 . The gate of the select transistor 31 is connected to the word line WL, and the source is connected to the source line SL.

<1-1-5> Memory Cell

The memory cell of the memory device according to the first embodiment will schematically be described next with reference to FIG. 3 .

As shown in FIG. 3 , the MTJ element 30 using a TMR (Tunneling MagnetoResistive) effect has a stacked structure including two ferromagnetic layers F and P and a nonmagnetic layer (tunnel insulating film) B sandwiched between them, and stores digital data based on a change in the magnetoresistance by a spin polarization tunneling effect. The MTJ element 30 can obtain a low resistance state and a high resistance state according to the magnetic alignment of the two ferromagnetic layers F and P. For example, when the low resistance state is defined as “0” data, and the high resistance state is defined as “1” data, 1-bit data can be recorded in the MTJ element 30 . The low resistance state may be defined as “1” data, and the high resistance state may be defined as “0” data, as a matter of course.

For example, the MTJ element 30 is formed by sequentially stacking the fixed layer (pinned layer) P, the tunnel barrier layer B, and the recording layer (free layer) F. The pinned layer P is a layer in which the direction of magnetic alignment is fixed. In the free layer F, the direction of magnetic alignment can change. The free layer F stores data depending on the direction of magnetization. The pinned layer P and the free layer F are made of a ferromagnetic material, and the tunnel barrier layer B is made of an insulating film.

More specifically, for example, cobalt iron boron (CoFeB) or on boride (FeB) may be used for the free layer F. For example, cobalt platinum (CoPt), cobalt nickel (CoNi), or cobalt palladium (CoPd) may be used for the pinned layer P. The tunnel barrier layer B is made of a nonmagnetic material, and a nonmagnetic metal, a nonmagnetic semiconductor, or an insulating material can be used. For example, magnesium oxide (MgO) or aluminum oxide (Al 2 O 3 ) may be used for the tunnel barrier layer B.

When a current is supplied in the direction of an arrow A 1 at the time of write, the direction of magnetization in the free layer F is set in an antiparallel state (AP state) with respect to that in the pinned layer P, and the high resistance state (“1” data) is obtained. This write operation can be referred to as a “1” write operation. When a current is supplied in the direction of an arrow A 2 at the time of write, the direction of magnetization in the pinned layer P and that in the free layer F are set in a parallel state (P state), and the low resistance state (“0” data) is obtained. This write operation can be referred to as a “0” write operation. In this way, the MTJ element can write different data depending on the direction to supply the current.

<1-1-6> Sense Amplifier & Write Driver

The sense amplifier & write driver 12 of the memory device according to the first embodiment will be described with reference to FIG. 4 .

As shown in FIG. 4 , the sense amplifier & write driver 12 includes a plurality of sense circuits 100 . The plurality of sense circuits 100 are provided in correspondence with the bit lines (global bit lines), respectively. Each of the plurality of sense circuits 100 includes a preamplifier 110 and a sense amplifier (SA) 120 .

The preamplifier 110 supplies a current (cell current) to the memory cell MC via the bit line, and stores voltages V1st and V2nd based on the cell current.

The sense amplifier 120 determines data (DO or DOB) based on the voltages V1st and V2nd stored in the preamplifier 110 .

<1-1-6-1> Arrangement of Preamplifier

The arrangement of the preamplifier 110 of the memory device according to the first embodiment will be described next with reference to FIG. 5 .

As shown in FIG. 5 , the preamplifier 110 includes PMOS transistors M 1 , M 2 , M 5 , and M 6 , NMOS transistors M 3 , M 4 , M 7 , M 8 , and M 9 , and a capacitor C 1 .

A power supply voltage VDD is applied to one terminal of the transistor M 1 , and the other terminal and the gate electrode are connected to a node N 1 .

One terminal of the transistor M 2 is connected to a node N 3 , the other terminal is connected to a node N 4 , and the gate electrode is connected to the node N 1 .

The transistor M 1 and the transistor M 2 function as a current mirror.

One terminal of the transistor M 3 is connected to the node N 1 , the other terminal is connected to a node N 2 , and a signal Vclamp is supplied to the gate electrode.

One terminal of the transistor M 4 is connected to the node N 2 , the other terminal is connected to the bit line (global bit line), and a signal REN is supplied to the gate electrode.

The power supply voltage VDD is applied to one terminal of the transistor M 5 , the other terminal is connected to the node N 3 , and a signal RENB is supplied to the gate electrode.

One terminal of the transistor M 6 is connected to the node N 4 , the other terminal is connected to a node N 5 , and a signal SW 1 B is supplied to the gate electrode.

One terminal of the transistor M 7 is connected to the node N 4 , the other terminal is connected to the node N 5 , and a signal SN 1 P is supplied to the gate electrode.

The transistor M 6 and the transistor M 7 function as one switch.

One terminal of the transistor M 8 is connected to the node N 4 , the other terminal is connected to a node N 6 , and the gate electrode is connected to the node N 5 .

One terminal of the transistor M 9 is connected to the node N 6 , a ground voltage VSS is applied to the other terminal, and the signal REN is supplied to the gate electrode.

One terminal of the capacitor C 1 is connected to the node N 5 , and the ground voltage VSS is applied to the other terminal.

The potential of the node N 4 is supplied to the sense amplifier 120 as V2nd. The transistor M 8 and the node N 4 can be considered as a V2nd generation unit.

The potential of the node M 5 is supplied to the sense amplifier 120 as V1st. The transistors M 6 , M 7 , and M 8 , the capacitor C 1 , and the node N 5 can be considered as a V1st generation unit.

The operation of the preamplifier 110 will be described later.

<1-1-6-2> Arrangement of Sense Amplifier

The arrangement of the sense amplifier 120 of the memory device according to the first embodiment will be described next with reference to FIG. 6 .

As shown in FIG. 6 , the sense amplifier 120 includes PMOS transistors M 10 , M 11 , M 12 , M 13 , M 14 , and M 15 , and NMOS transistors M 16 , M 17 , M 18 , M 19 , M 20 , M 21 , M 22 , M 23 , M 24 , M 25 , M 26 , and M 27 .

The power supply voltage VDD is applied to one terminal of the transistor M 10 , the other terminal is connected to a node N 7 , and a signal LATPB is supplied to the gate electrode.

One terminal of the transistor M 11 is connected to the node N 7 , the other terminal is connected to a node N 8 , and the gate electrode is connected to a node N 9 .

One terminal of the transistor M 12 is connected to the node N 7 , the other terminal is connected to the node N 9 , and the gate electrode is connected to the node N 8 .

One terminal of the transistor M 13 is connected to the node N 8 , the other terminal is connected to the node N 9 , and a signal SEN is supplied to the gate electrode.

The power supply voltage VDD is applied to one terminal of the transistor M 14 , the other terminal is connected to the node N 8 , and the signal SEN is supplied to the gate electrode.

The power supply voltage VDD is applied to one terminal of the transistor M 15 , the other terminal is connected to the node N 8 , and the signal SEN is supplied to the gate electrode.

One terminal of the transistor M 16 is connected to the node N 8 , the other terminal is connected to a node N 10 , and the gate electrode is connected to the node N 9 .

One terminal of the transistor M 17 is connected to the node N 10 , the other terminal is connected to a node N 13 , and a signal SEN 2 is supplied to the gate electrode via a node N 12 .

One terminal of the transistor M 18 is connected to the node N 10 , the ground voltage VSS is applied to the other terminal, and a signal LATN is supplied to the gate electrode.

One terminal of the transistor M 19 is connected to the node N 9 , the other terminal is connected to a node N 11 , and the gate electrode is connected to the node N 8 .

One terminal of the transistor M 20 is connected to the node N 11 , the other terminal is connected to a node N 15 , and the signal SEN 2 is supplied to the gate electrode via the node N 12 .

One terminal of the transistor M 21 is connected to the node N 11 , the ground voltage VSS is applied to the other terminal, and the signal LATN is supplied to the gate electrode.

One terminal of the transistor M 22 is connected to the node N 13 , the ground voltage VSS is applied to the other terminal, and the signal V1st is supplied to the gate electrode.

One terminal of the transistor M 23 is connected to the node N 13 , the other terminal is connected to a node N 14 , and a signal SHFTDO is supplied to the gate electrode.

One terminal of the transistor M 24 is connected to the node N 14 , the ground voltage VSS is applied to the other terminal, and a signal VSHFT is supplied to the gate electrode.

One terminal of the transistor M 25 is connected to the node N 15 , the ground voltage VSS is applied to the other terminal, and the signal V2nd is supplied to the gate electrode.

One terminal of the transistor M 26 is connected to the node N 15 , the other terminal is connected to a node N 16 , and a signal SHFTDOB is supplied to the gate electrode.

One terminal of the transistor M 27 is connected to the node N 16 , the ground voltage VSS is applied to the other terminal, and the signal VSHFT is supplied to the gate electrode.

The potential of the node N 8 is supplied to the IO circuit 16 as DO.

The potential of the node N 9 is supplied to the IO circuit 16 as DOB.

The operation of the sense amplifier 120 will be described later.

<1-2> Operation

As described above, the MTJ element of the memory device according to the first embodiment stores data using a change in the resistance value. To read information stored in the MTJ element, the memory device supplies a read current (to be also referred to as a cell current) to the MTJ element. The memory device then converts the resistance value of the MTJ element into a current value or a voltage value and compares the value with a reference value, thereby determining the resistance state.

However, if the resistance variation of the MTJ element increases, the interval of the resistance value distribution of the “0” state and the “1” state may narrow. For this reason, in a read method of setting the reference value in the resistance value distribution and discriminating the state of the MTJ element based on the magnitude of a value relative to the reference value, the read margin considerably decreases.

In the first embodiment, shift signal information is added to the signal information (the current value or the voltage value) of one of the “0” state and the “1” state of the MTJ element to generate a reference signal. A self-reference read method of discriminating the initial state of the MTJ element based on the reference signal will be described.

The read operation of the memory system according to the first embodiment will be described next.

<1-2-1> Outline of Read Operation

The outline of the read operation of the memory system according to the first embodiment will be described with reference to FIG. 7 .

[Step S 1001 ]

Upon receiving a read instruction from the host 2 , the memory controller 20 issues an active command and a read command to the memory device 10 .

The memory device 10 receives the active command and the read command from the memory controller 20 , and performs a first read operation (1st READ) for a read target memory cell. By the first read operation, the preamplifier 110 stores the resistance state of the read target memory cell as the voltage information (signal voltage) V1st.

[Step S 1002 ]

The memory device 10 performs a “0” write operation (WRITE “0”) for the memory cell as the target of the first read operation. Accordingly, “0” data is overwritten to the memory cell as the target of the first read operation. In this operation, the memory cell is set in a standard state (“0” here) to generate V2nd to be described later. That is, the write operation may be referred to as a standardization operation.

[Step S 1003 ]

The memory device 10 performs a second read operation (2nd READ) for the memory cell as the target of the first read operation. By the second read operation, the preamplifier 110 generates the voltage information (signal voltage) V2nd.

[Step S 1004 ]

Based on V2nd generated in step S 1003 , the sense amplifier 120 determines the result of V1st generated in step S 1001 . More specifically, the sense amplifier 120 compares a current obtained by adding a current I1st based on V1st and a reference current Ishift with a current I2nd based on V2nd, thereby determining data stored in the memory cell.

<1-2-2> Details of Read Operation

Details of the read operation of the memory system according to the first embodiment will be described with reference to the timing chart of FIG. 8 .

[Time T 0 ] to [Time T 1 ]

In the first read operation (step S 1001 ), the controller 17 sets the signal REN, the signal SW 1 P, and the signal Vclamp to “H (High)” level, and sets the signal RENB and the signal SW 1 B to “L (Low)” level (L<H).

Accordingly, as shown in FIG. 9 , the transistors M 3 , M 4 , M 5 , M 6 , and M 7 change to the ON (conductive) state. The node N 1 is thus grounded via the node N 2 , the bit line (global bit line), the memory cell MC, and the source line (global source line). As a result, the potential of the node N 1 lowers, and the transistor M 1 is turned on. The transistor M 1 is driven as a diode-connection transistor.

In the ON state, the transistor M 1 supplies a cell current (Icell_1st) to the memory cell MC.

The transistor M 2 is driven based on the potential of the node N 1 . For this reason, the transistor M 2 supplies a copy current (Icopy_1st) of the cell current (Icell_1st) to the node N 4 .

As described above, the transistors M 1 and M 2 constitute a current mirror.

The potential of the node N 5 is the voltage information (signal voltage) V1st based on the copy current (Icopy_1st).

As described above, the preamplifier 110 supplies the cell current (Icell_1st) to the memory cell MC via a first current path formed from the transistors M 1 , M 3 , and M 4 . The preamplifier 110 also supplies the copy current (Icopy_1st) to the node N 5 via a second current path formed from the transistors M 2 and M 5 . The first current path and the second current path are electrically separated.

[Time T 1 ] to [Time T 2 ]

In the “0” write operation (step S 1002 ), the controller 17 lowers the signal REN and the signal SW 1 P to “L” level, and raises a signal WRITE 0 , the signal RENB, and the signal SW 1 B to “H” level. The signal WRITE 0 is a signal concerning the “0” write operation. When the signal WRITE 0 is at “H” level, the “0” write operation is performed.

Accordingly, “0” data is written to the memory cell by a write driver (not shown).

In addition, as shown in FIG. 10 , the transistor M 5 , M 6 , M 7 , and M 9 change to the OFF (nonconductive) state. Accordingly, the nodes N 4 and N 5 are electrically set in a floating state. The node N 5 stores the voltage information (signal voltage) V1st.

[Time T 2 ] to [Time T 3 ]

In the second read operation (step S 1003 ), the controller 17 raises the signal REN to “H” level, and lowers the signal WRITE 0 and the signal RENB to “L” level.

Accordingly, as shown in FIG. 11 , the transistors M 3 , M 4 , M 5 , and M 9 are turned on. The node N 1 is thus grounded via the node N 2 , the bit line (global bit line), the memory cell MC, and the source line (global source line). As a result, the potential of the node N 1 lowers, and the transistor M 1 is turned on. The transistor M 1 is driven as a diode-connection transistor.

In the ON state, the transistor M 1 supplies a cell current (Icell_ 0 ) to the memory cell MC.

The transistor M 2 is driven based on the potential of the node N 1 . For this reason, the transistor M 2 supplies a copy current (Icopy_ 0 ) of the cell current (Icell_ 0 ) to the node N 4 .

In addition, the transistor M 8 is turned on based on V1st.

The potential of the node N 4 is the voltage information (signal voltage) V2nd based on the copy current (Icopy_ 0 ) and V1st.

[Time T 3 ] to [Time T 5 ]

In the determination operation (step S 1004 ), the controller 17 lowers the signal REN to “L” level, and raises the signal RENB and the signal SEN 2 to “H” level. The controller 17 also sets the signal SHFTDO, the signal VSHFT, and the signal LATPB to “H” level, and sets the signal SHFTDOB, the signal LATN, and the signal SEN to “L” level.

Accordingly, the transistors M 5 and M 9 of the preamplifier 110 change to the OFF (nonconductive) state. The node N 4 thus stores the voltage information (signal voltage) V2nd.

As shown in FIG. 12 , in the sense amplifier 120 , the transistors M 13 , M 14 , M 15 , M 17 , M 19 , M 20 , M 22 , M 23 , M 24 , and M 25 are turned on.

Accordingly, the transistor M 22 supplies a current I1st corresponding to V1st, and the transistor M 24 supplies a shift current Ishift corresponding to VSHFT.

In addition, the transistor M 25 supplies a current I2nd corresponding to V2nd.

When the signal SEN is set to “H” level, the transistors M 14 and M 15 change to the OFF state, and the current supply from the transistors M 14 and M 15 is cut off. Accordingly, the potential of the node N 8 is decided based on the current I1st and the shift current Ishift. The potential of the node N 9 is decided based on the current I2nd. Hence, a voltage difference is generated between the node N 8 and the node N 9 . The voltage difference is widened immediately by the positive feedback of the transistors M 11 , M 22 , M 16 , and M 19 .

The sense amplifier 120 thus determines the signal DO and the signal DOB.

[Time T 5 ]

When the determination operation (step S 1004 ) ends, the controller 17 lowers the signal LATPB to “L” level, and raises the signal LATN to “H” level. The transistors M 10 , M 18 , and M 21 of the sense amplifier 120 are thus turned on. Accordingly, the potential difference between the signal DO and the signal DOB is widened to the difference between “H” level and “L” level.

<1-2-3> Determination Method of Read Operation

A detailed determination method in the determination operation (step S 1004 ) will be described next.

The operation characteristic of the preamplifier 110 will be described with reference to FIG. 13 .

FIG. 13 shows the relationship between the characteristic of the transistor M 8 and the characteristic of the memory cell in the first read. FIG. 13 also shows the relationship between the characteristic of the transistor M 8 and the characteristic of the memory cell in the second read.

As shown in FIG. 13 , when the memory cell stores “1” data, V1st is set to V1st_ 1 by the first read operation. In the second read operation, if V1st is V1st_ 1 , V2nd is V2nd_ 1 (V1st_ 1 <V2nd_ 1 ).

As shown in FIG. 13 , when the memory cell stores “0” data, V1st is set to V1st_ 0 (V1st_ 1 <V1st_ 0 <V2nd_ 1 ) by the first read operation. In the second read operation, if V1st is V1st_ 0 , V2nd is V2nd_ 0 (V1st_ 0 =V2nd_ 0 ).

FIG. 14 shows the relationship of voltages. As shown in FIG. 14 , V1st_ 0 , V1st_ 1 , and V2nd_ 0 almost equal.

The operation of the sense amplifier 120 in a case in which the memory cell stores “1” data at the time of the first read operation will be described next with reference to FIG. 15 . If the memory cell stores “1” data at the time of the first read operation, V1st is V1st_ 1 , and V2nd is V2nd_ 1 .

As described above, V2nd_ 1 is higher than V1st_ 1 . For this reason, I2nd (I2nd_ 1 ) flowing to the transistor M 25 based on V2nd_ 1 is larger than I1st (I1st_ 1 ) flowing to the transistor M 22 based on V1st_ 1 .

Additionally, as described above, the sense amplifier 120 compares I1st+Ishift with I2nd. Note that VSHFT is set such that I1st_ 1 +Ishift becomes smaller than I2nd_ 1 .

However, as shown in FIG. 15 , I2nd_ 1 is much larger than I1st_ 1 +Ishift. For this reason, when the determination operation is performed in times T 3 to T 4 of FIG. 8 , the signal. DO and the signal DOB can appropriately be generated.

The operation of the sense amplifier 120 in a case in which the memory cell stores “0” data at the time of the first read operation will be described next with reference to FIG. 16 . If the memory cell stores “0” data at the time of the first read operation, V1st is V1st_ 0 , and V2nd is V2nd_ 0 .

As described above, V2nd_ 0 almost equals V1st_ 0 . For this reason, I2nd (I2nd_ 0 ) flowing to the transistor M 25 based on V2nd_ 0 almost equals I1st (I1st_ 0 ) flowing to the transistor M 22 based on V1st_ 0 .

As described above, the sense amplifier 120 compares I1st+Ishift with I2nd. Note that VSHFT is set such that Ishift becomes I2nd_ 0 .

As shown in FIG. 16 , I2nd_ 0 is smaller than I1st_ 0 +Ishift. For this reason, when the determination operation is performed in times T 3 to T 4 of FIG. 8 , the signal DO and the signal DOB can appropriately be generated.

Note that in the above-described embodiment, the operation of writing “0” to the memory cell as the target of the first read operation by the memory device 10 in step S 1002 has been described. However, the memory device 10 may write “1” to the memory cell as the target of the first read operation in step S 1002 . That is, “1” may be the standard state.

When writing “1” in step S 1002 , the controller 17 sets the signal SHFTDO to “L” level, and sets the signal SHFTDOB to “H” level in the read operation (see FIG. 17 ). Accordingly, I2nd+Ishift is supplied to the node N 9 , and I1st is supplied to the node N 8 in the determination operation (step S 1004 ). The determination operation can thus be performed (see FIG. 18 ).

<1-3> Effects

According to the above-described embodiment, in the “0” write operation, the node N 4 configured to generate V2nd is set in the floating state. It is therefore possible to perform a high-quality read operation by easy control.

For easy understanding of the above-described embodiment, a comparative example will be described below.

As shown in FIG. 19 , a preamplifier according to the comparative example does not include the transistors M 5 and M 9 . For this reason, in the preamplifier according to the comparative example, the node N 4 is grounded at the time of the write operation.

The waveform of a voltage at the time of the read operation will be described with reference to FIG. 20 .

As shown in FIG. 20 , in the memory device according to the comparative example, the node N 4 is discharged via the transistor M 8 in the “0” write operation after the first read operation (times T 1 to T 2 ). Hence, the potential of V2nd is VSS, as shown in FIG. 20 .

When the second read operation starts at the time T 2 , the preamplifier 110 starts precharging the node N 4 . At this time, since the node N 4 needs to be charged, time is required until the potential of the node N 4 stabilizes.

On the other hand, according to the above-described embodiment, in the “0” write operation, the transistors M 5 and M 9 are turned off. Hence, the node N 4 is set in the floating state, and V2nd keeps the potential at the time of the first read operation during the “0” write operation (times T 1 to T 2 ), as show in FIG. 20 .

For this reason, when the second read operation starts at the time T 2 , V2nd quickly stabilizes as compared to the comparative example because the preamplifier 110 need not charge the node N 4 .

As described above, according to this embodiment, the node N 4 configured to generate V2nd is set in the floating state in the “0” write operation, thereby speeding up the read operation. As a result, it is possible to provide a memory device capable of performing a high-quality read operation by easy control.

<2> Second Embodiment

The second embodiment will be described. In the second embodiment, another example of the preamplifier will be described. Note that the basic arrangement and the basic operation of a memory system according to the second embodiment are the same as those of the memory system according to the above-described first embodiment. Hence, a description of matters explained in the above-described first embodiment and matters easily supposable from the above-described first embodiment will be omitted.

<2-1> Arrangement of Preamplifier

The arrangement of a preamplifier 110 of a memory device according to the second embodiment will be described next with reference to FIG. 21 .

As shown in FIG. 21 , the basic arrangement of the preamplifier 110 is the same as the arrangement described with reference to FIG. 5 . The preamplifier is different from the preamplifier described with reference to FIG. 5 in that a signal REN 2 B is supplied to the gate electrode of a transistor M 5 , and a signal REN 2 is supplied to the gate electrode of a transistor M 9 .

<2-2> Details of Read Operation

Details of the read operation of the memory system according to the second embodiment will be described with reference to the timing chart of FIG. 22 .

[Time T 0 ] to [Time T 1 ]

In the first read operation (step S 1001 ), a controller 17 sets a signal REN, the signal REN 2 , a signal SW 1 P, and a signal Vclamp to “H” level, and sets a signal RENB, the signal REN 2 B, and a signal SW 1 B to “L” level.

Accordingly, the preamplifier 110 performs the same operation as that described with reference to FIG. 9 .

[Time T 1 ] to [Time T 2 ]

In the “0” write operation (step S 1002 ), the controller 17 lowers the signal REN, the signal REN 2 , and the signal SW 1 P to “L” level, and raises a signal WRITE 0 , the signal RENB, the signal REN 2 B, and the signal SW 1 B to “H” level.

Accordingly, the preamplifier 110 per forms the same operation as that described with reference to FIG. 10 .

[Time T 2 ] to [Time T 3 ]

In the second read operation (step S 1003 ), the controller 17 raises the signal REN and the signal REN 2 to “H” level, and lowers the signal WRITE 0 , the signal RENB, and the signal REN 2 B to “L” level.

Accordingly, a sense circuit 100 performs the same operation as that described with reference to FIGS. 11 and 12 .

[Time T 3 ] to [Time T 5 ]

A memory system 1 performs the same operation as that described in the first embodiment.

Note that in the above-described embodiment, the operation of writing “0” to the memory cell as the target of the first read operation by a memory device 10 in step S 1002 has been described. However, the memory device 10 may write “1” to the memory cell as the target of the first read operation in step S 1002 . That is, “1” may be the standard state.

When writing “1” in step S 1002 , the controller 17 sets a signal SHFTDO to “L” level, and sets a signal SHFTDOB to “H” level in the read operation (see FIG. 23 ). Accordingly, I2nd+Ishift is supplied to a node N 9 , and I1st is supplied to a node N 8 in the determination operation (step S 1004 ). The determination operation can thus be performed (see FIG. 18 ).

<2-3> Effects

According to the above-described embodiment, the same effects as in the first embodiment can be obtained.

<3> Third Embodiment

The third embodiment will be described. In the third embodiment, another example of the sense amplifier will be described. Note that the basic arrangement and the basic operation of a memory system according to the third embodiment are the same as those of the memory systems according to the above-described first and second embodiments. Hence, a description of matters explained in the above-described first and second embodiments and matters easily supposable from the above-described first and second embodiments will be omitted.

<3-1> Arrangement of Sense Amplifier

The arrangement of a sense amplifier 120 of a memory device according to the third embodiment will be described next with reference to FIG. 24 .

As shown in FIG. 24 , the sense amplifier 120 includes PMOS transistors M 28 , M 29 , M 30 , and M 33 , and NMOS transistors M 31 , M 32 , M 34 , M 35 , M 36 , M 37 , M 38 , M 39 , and M 40 .

A power supply voltage VDD is applied to one terminal of the transistor M 28 , the other terminal is connected to a node N 17 , and a signal LATPB is supplied to the gate electrode.

One terminal of the transistor M 29 is connected to the node N 17 , the other terminal is connected to a node N 18 , and the gate electrode is connected to a node N 19 .

One terminal of the transistor M 30 is connected to the node N 17 , the other terminal is connected to the node N 19 , and the gate electrode is connected to the node N 18 .

One terminal of the transistor M 31 is connected to the node N 18 , the other terminal is connected to a node N 20 , and the gate electrode is connected to the node N 19 .

One terminal of the transistor M 32 is connected to the node N 19 , the other terminal is connected to the node N 20 , and the gate electrode is connected to the node N 18 .

One terminal of the transistor M 33 is connected to the node N 18 , the other terminal is connected to the node N 19 , and a signal SENB is supplied to the gate electrode.

One terminal of the transistor M 34 is connected to the node N 20 , a ground voltage VSS is applied to the other terminal, and a signal LATN is supplied to the gate electrode.

One terminal of the transistor M 35 is connected to the node N 18 , the ground voltage VSS is applied to the other terminal, and a signal V1st is supplied to the gate electrode.

One terminal of the transistor M 36 is connected to the node N 18 , the other terminal is connected to a node N 21 , and a signal SHFTDO is supplied to the gate electrode.

One terminal of the transistor M 37 is connected to the node N 21 , the ground voltage VSS is applied to the other terminal, and a signal VSHFT is supplied to the gate electrode.

One terminal of the transistor M 38 is connected to the node N 19 , the ground voltage VSS is applied to the other terminal, and a signal V2nd is supplied to the gate electrode.

One terminal of the transistor M 39 is connected to the node N 19 , the other terminal is connected to a node N 22 , and a signal SHFTDOB is supplied to the gate electrode.

One terminal of the transistor M 40 is connected to the node N 22 , the ground voltage VSS is applied to the other terminal, and the signal VSHFT is supplied to the gate electrode.

The potential of the node N 18 is supplied to an IO circuit 16 as DO.

The potential of the node N 19 is supplied to the IO circuit 16 as DOB.

<3-2> Details of Read Operation

Details of the read operation of the memory system according to the third embodiment will be described with reference to the timing chart of FIG. 25 . For example, a case in which the preamplifier described in the first embodiment is applied will be described here.

[Time T 10 ] to [Time T 13 ]

A memory device 10 performs the same operation as in the times T 0 to T 3 described in the first embodiment with reference to FIG. 8 .

[Time T 13 ] to [Time T 15 ]

In the determination operation (step S 1004 ), a controller 17 lowers a signal REN to “L” level, and raises a signal RENB and the signal SENB to “H” level. The controller 17 also sets the signal SHFTDO, the signal VSHFT, and the signal LATPB to “H” level, and sets the signal SHFTDOB and the signal LATN to “L” level.

Accordingly, transistors M 5 and M 9 of the preamplifier 110 change to the OFF (nonconductive) state. A node N 4 thus stores the voltage information (signal voltage) V2nd.

As shown in FIG. 26 , in the sense amplifier 120 , the transistors M 35 , M 36 , M 37 , and M 38 are turned on.

Accordingly, the transistor M 35 supplies a current I1st corresponding to V1st, and the transistor M 37 supplies a shift current Ishift corresponding to VSHFT. That is, the potential of the node N 18 is decided based on the current I1st and the shift current Ishift.

In addition, the transistor M 38 supplies a current I2nd corresponding to V2nd. That is, the potential of the node N 19 is decided based on the current I2nd.

At the time T 14 at which a sufficient difference is generated between the potential of the node N 18 and the potential of the node N 19 , the controller 17 lowers the signal LATPB to “L” level.

Accordingly, the sense amplifier 120 determines the signal DO and the signal DOB.

[Time T 15 ]

When the determination operation (step S 1004 ) ends, the controller 17 raises the signal LAIN to “H” level. The transistor M 34 of the sense amplifier 120 is thus turned on. Accordingly, the potential difference between the signal DO and the signal DOB is widened to the difference between “H” level and “L” level.

Note that in the above-described embodiment, the operation of writing “0” to the memory cell as the target of the first read operation by the memory device 10 in step S 1002 has been described. However, the memory device 10 may write “1” to the memory cell as the target of the first read operation in step S 1002 . That is, “1” may be the standard state.

Note that when writing “1” in step S 1002 , the controller 17 sets the signal SHFTDO to “L” level, and sets the signal SHFTDOB to “H” level in the read operation (see FIG. 27 ). Accordingly, I2nd+Ishift is supplied to the node N 19 , and I1st is supplied to the node N 18 in the determination operation (step S 1004 ) (see FIG. 28 ). The determination operation can thus be performed.

<3-3> Effects

According to the above-described embodiment, the same effects as in the first embodiment can be obtained.

<4> Fourth Embodiment

The fourth embodiment will be described. In the fourth embodiment, a case in which the preamplifier described in the second embodiment is applied to the sense circuit of the third embodiment will be described. Note that the basic arrangement and the basic operation of a memory system according to the fourth embodiment are the same as those of the memory systems according to the above-described first to third embodiments. Hence, a description of matters explained in the above-described first to third embodiments and matters easily supposable from the above-described first to third embodiments will be omitted.

<4-1> Details of Read Operation

Details of the read operation of the memory system according to the fourth embodiment will be described with reference to the timing chart of FIG. 29 . A case in which the preamplifier described in the second embodiment applied will be described here.

[Time T 10 ] to [Time T 13 ]

A memory device 10 performs the same operation as in the times T 0 to T 3 described in the second embodiment with reference to FIG. 22 .

[Time T 13 ] to [Time T 15 ]

In the determination operation (step S 1004 ), a controller 17 lowers a signal REN and a signal REN 2 to “L” level, and raises a signal RENB, a signal REN 2 B, and a signal SENB to “H” level. The controller 17 also sets a signal SHFTDO, a signal VSHFT, and a signal LATPB to “H” level, and sets a signal SHFTDOB and a signal LATN to “L” level.

Accordingly, transistors M 5 and M 9 of the preamplifier 110 change to the OFF (nonconductive) state. A node N 4 thus stores voltage information (signal voltage) V2nd.

A sense amplifier 120 operates as described with reference to FIG. 26 .

[Time T 15 ]

When the determination operation (step S 1004 ) ends, the controller 17 raises the signal LATN to “H” level. A transistor M 34 of the sense amplifier 120 is thus turned on. Accordingly, a signal DO and a signal DOB are reset.

Note that in the above-described embodiment, the operation of writing “0” to the memory cell as the target of the first read operation by the memory device 10 in step S 1002 has been described. However, the memory device 10 may write “1” to the memory cell as the target of the first read operation in step S 1002 . That is, “1” may be the standard state.

Note that when writing “1” in step S 1002 , the controller 17 sets the signal SHFTDO to “L” level, and sets the signal SHFTDOB to “H” level in the read operation (see FIG. 30 ). Accordingly, I2nd+Ishift is supplied to a node N 19 , and list is supplied to a node N 18 in the determination operation (step S 1004 ) (see FIG. 28 ). The determination operation can thus be performed.

<4-2> Effects

According to the above-described embodiment, the same effects as in the first embodiment can be obtained.

<5> Others

Note that the term “connect” in the above embodiments also includes a state in which elements are indirectly connected via another element, for example, a transistor or a resistor.

An MRAM that stores data using a magnetoresistive element (Magnetic Tunnel junction (MTJ) element) as a resistance change element has been described here as an example. However, the present invention is not limited to this.

For example, the present invention is also applicable to a resistance change memory like the MRAM, for example, a semiconductor storage device such as an ReRAM or PCRAM including an element that stores data using a resistance change.

The present invention is also applicable to a semiconductor storage device, whether it is a volatile memory or a nonvolatile memory, including an element that stores data based on a resistance change caused by application of a current or a voltage or reads stored data by converting a resistance difference generated by a resistance change into a current difference or a voltage difference.

In the above-described embodiments, the bit line pair has been referred to as the bit line BL and the source line SL for the descriptive convenience. However, the present invention is not limited to this. For example, the bit line pair may be referred to as a first bit line and a second bit line.

In the above-described embodiments, in the memory system 1 , one memory device 10 is connected to the memory controller 20 . However, the present invention is not limited to this. For example, the memory system 1 may have an arrangement in which a plurality of memory devices 10 are connected to the memory controller 20 .

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.