Semiconductor device

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2017-030339, filed on Feb. 21, 2017; the entire contents of which are incorporated herein by reference.

Embodiments of the invention relate generally to a semiconductor device.

A MOSFET (Metal Oxide Semiconductor Field Effect Transistor) is a semiconductor device used in applications such as power control, etc. Such a MOSFET may have a trench gate structure, includes an element region in which semiconductor elements are provided, and includes a terminal region surrounding the element region. Trenches are formed through the terminal region from the element region; and a conductive body and/or an insulating film is filled into the interior of the trenches. It is a challenge to increase the breakdown voltage of the insulating film in the terminal region in the MOSFET having the trench gate structure.

FIG. 1 is a plan view showing a semiconductor device according to a first embodiment;

FIG. 2 is an enlarged view of region R of FIG. 1 ;

FIG. 3 is a cross-sectional view along line A 1 -A 2 of FIG. 2 ;

FIG. 4 is a cross-sectional view along line B 1 -B 2 of FIG. 2 ;

FIG. 5 is a cross-sectional view along line C 1 -C 2 of FIG. 2 ;

FIG. 6 is a cross-sectional view along line D 1 -D 2 of FIG. 2 ;

FIG. 7 is a cross-sectional view along line E 1 -E 2 of FIG. 2 ;

FIG. 8A and FIG. 8B are circuit diagrams showing connection states of the semiconductor device;

FIG. 9 is a plan view showing a semiconductor device according to a second embodiment;

FIG. 10 is a cross-sectional view along line A 1 -A 2 of FIG. 9 ;

FIG. 11 is a cross-sectional view along line B 1 -B 2 of FIG. 9 ;

FIG. 12 is a cross-sectional view along line C 1 -C 2 of FIG. 9 ;

FIG. 13 is a plan view showing a semiconductor device according to a third embodiment;

FIG. 14 is a cross-sectional view along line A 1 -A 2 of FIG. 13 ;

FIG. 15 is a cross-sectional view along line B 1 -B 2 of FIG. 13 ;

FIG. 16 is a plan view showing a semiconductor device according to a fourth embodiment;

FIG. 17 is a cross-sectional view along line A 1 -A 2 of FIG. 16 ;

FIG. 18 is a cross-sectional view along line B 1 -B 2 of FIG. 16 ;

FIG. 19 is a plan view showing a semiconductor device according to a fifth embodiment;

FIG. 20 is a cross-sectional view along line A 1 -A 2 of FIG. 19 ;

FIG. 21 is a cross-sectional view along line B 1 -B 2 of FIG. 19 ;

FIG. 22 is a cross-sectional view along line C 1 -C 2 of FIG. 19 ;

FIG. 23 is a cross-sectional view along line D 1 -D 2 of FIG. 19 ;

FIG. 24 is a plan view showing a semiconductor device according to a sixth embodiment;

FIG. 25 is a cross-sectional view along line A 1 -A 2 of FIG. 24 ;

FIG. 26 is a cross-sectional view along line B 1 -B 2 of FIG. 24 ;

FIG. 27 is a plan view showing a semiconductor device according to a seventh embodiment;

FIG. 28 is a cross-sectional view along line A 1 -A 2 of FIG. 27 ;

FIG. 29 is a cross-sectional view along line B 1 -B 2 of FIG. 27 ; and

FIG. 30 is a cross-sectional view along line C 1 -C 2 of FIG. 27 .

According to an embodiment, a semiconductor device includes a semiconductor layer, a first electrode, and a first insulating film. The first electrode extends in a first direction and is provided inside the semiconductor layer. The first insulating film is provided between the semiconductor layer and the first electrode, a thickness of the first insulating film in a direction from the first electrode toward the semiconductor layer increasing in stages along the first direction. The first insulating film has three or more mutually-different thicknesses.

Embodiments of the invention will now be described with reference to the drawings.

The drawings are schematic or conceptual; and the relationships between the thicknesses and widths of portions, the proportions of sizes between portions, etc., are not necessarily the same as the actual values thereof. The dimensions and/or the proportions may be illustrated differently between the drawings, even in the case where the same portion is illustrated.

In the drawings and the specification of the application, components similar to those described thereinabove are marked with like reference numerals, and a detailed description is omitted as appropriate.

Hereinafter, in the specification, an XYZ orthogonal coordinate system is employed. Two directions parallel to an upper surface 10 a of the substrate 10 and orthogonal to each other are defined as an “X-direction” and a “Y-direction”, and a direction orthogonal to both the X-direction and the Y-direction is defined as a “Z-direction”.

First Embodiment

FIG. 1 is a plan view showing a semiconductor device according to the embodiment. FIG. 2 is an enlarged view of region R of FIG. 1 . FIG. 3 , FIG. 4 , FIG. 5 , FIG. 6 , and FIG. 7 are cross-sectional views along line A 1 -A 2 , line B 1 -B 2 , line C 1 -C 2 , and lines D 1 -D 2 and E 1 -E 2 of FIG. 2 .

As shown in FIG. 1 , an element portion 8 and a pad 9 are provided in the semiconductor device 1 . The element portion 8 is electrically connected to the pad 9 via an interconnect. A semiconductor layer 20 , a gate electrode 40 , an insulating film 50 , a source electrode 70 , and a drain electrode 80 described below are provided in the element portion 8 ; and a cell pattern is formed. The pad 9 is, for example, a gate pad and is connected to the gate electrode 40 via a draw-out interconnect. The upper surface of the element portion 8 is used as the source electrode 70 ; the lower surface of the element portion 8 is used as the drain electrode 80 ; and each are connected to an external circuit.

As shown in FIG. 3 to FIG. 7 , a substrate 10 is provided in the semiconductor device 1 . The substrate 10 is, for example, a semiconductor substrate such as a silicon substrate, etc. For example, the conductivity type of the substrate 10 is an n + -type.

The “n + -type” is the n-type in which the effective impurity concentration is higher than the “n − -type.” This is similar for the “p + -type” and the “p − -type” as well. The “effective impurity concentration” refers to the concentration of the impurities contributing to the conductivity of the semiconductor material, and refers to the concentration excluding the cancelled portion in the case where both an impurity that forms donors and an impurity that forms acceptors are included. The n-type impurity is, for example, phosphorus (P); and the p-type impurity is, for example, boron (B).

An element region R 1 and a terminal region R 2 are provided in the semiconductor device 1 . The element region R 1 is provided in the center of the element portion 8 . The terminal region R 2 is provided in the end portion of the element portion 8 . For example, the terminal region R 2 is provided to surround the periphery of the element region R 1 . For example, in FIG. 1 , the configurations of the terminal region R 2 positioned at the two ends in an X-direction are the same; and the configurations of the terminal region R 2 positioned at the two ends in a Y-direction are the same. The configurations of the terminal region R 2 positioned at the two ends in the X-direction are different from the configurations of the terminal region R 2 positioned at the two ends in the Y-direction.

First, the element region R 1 will be described.

As shown in FIG. 2 , the element region R 1 includes a region R 1 a and a region R 1 b . The region R 1 a and the region R 1 b are arranged in order in a direction from the center of the element portion 8 toward the end portion of the element portion 8 . That is, the region R 1 a and the region R 1 b are arranged along the X-direction to be adjacent to each other.

As shown in FIG. 3 , the semiconductor device 1 includes the substrate 10 , the semiconductor layer 20 , a field plate electrode 30 , the gate electrode 40 , the insulating film 50 , a contact 60 , the source electrode 70 , and the drain electrode 80 in the region R 1 a of the element region R 1 .

The semiconductor layer 20 is provided on an upper surface 10 a of the substrate 10 . The semiconductor layer 20 is, for example, a silicon layer. The semiconductor layer 20 includes a drift layer 22 , a base layer 23 , and a source layer 24 .

The drift layer 22 is provided on the substrate 10 ; and the conductivity type of the drift layer 22 is, for example, the n − -type.

The base layer 23 is provided on the drift layer 22 ; and the conductivity type of the base layer 23 is, for example, the p-type.

The source layer 24 is provided selectively on the base layer 23 ; and the conductivity type of the source layer 24 is, for example, the n + -type.

The field plate electrode 30 and the gate electrode 40 are formed inside the semiconductor layer 20 and are disposed inside a trench T 1 . The trench T 1 is formed to reach the drift layer 22 from the upper surface of the source layer 24 . For example, the trench T 1 extends in the X-direction.

As shown in FIG. 2 and FIG. 3 , the multiple trenches T 1 that are arranged along the Y-direction are formed inside the semiconductor layer 20 ; and the field plate electrode 30 and the gate electrode 40 are disposed inside each of the trenches T 1 . That is, the semiconductor device 1 of the embodiment is a MOSFET having a trench gate structure, and includes the field plate electrode 30 .

The field plate electrode 30 is positioned lower than the gate electrode 40 ; and the gate electrode 40 is positioned on the field plate electrode 30 with the insulating film 50 interposed. For example, the field plate electrode 30 and the gate electrode 40 each extend in the X-direction inside the trench T 1 . The field plate electrode 30 and the gate electrode 40 include, for example, polysilicon.

The insulating film 50 is disposed inside the trench T 1 . The insulating film 50 includes, for example, silicon oxide. The insulating film 50 may include, for example, a silicate glass such as BPSG, PSG, NSG, etc. The insulating film 50 may include, for example, silicon nitride or silicon oxynitride. The insulating film 50 includes a field plate insulating film 50 a , an inter-layer insulating film 50 b , a gate insulating film 50 c , and an inter-layer insulating film 50 d.

The field plate insulating film 50 a is provided between the semiconductor layer 20 and the field plate electrode 30 . The field plate insulating film 50 a covers a lower surface 30 b and a side surface 30 s of the field plate electrode 30 . For example, the field plate electrode 30 and the drift layer 22 oppose each other with the field plate insulating film 50 a interposed.

The inter-layer insulating film 50 b is provided between the field plate electrode 30 and the gate electrode 40 . The inter-layer insulating film 50 b covers an upper surface 30 a of the field plate electrode 30 and a lower surface 40 b of the gate electrode 40 and electrically insulates the field plate electrode 30 and the gate electrode 40 .

The gate insulating film 50 c is provided between the semiconductor layer 20 and the gate electrode 40 . The gate insulating film 50 c covers a side surface 40 s of the gate electrode 40 . For example, the gate electrode 40 opposes the drift layer 22 , the base layer 23 , and the source layer 24 with the gate insulating film 50 c interposed.

The inter-layer insulating film 50 d is provided between the gate electrode 40 and the source electrode 70 . The inter-layer insulating film 50 d covers an upper surface 40 a of the gate electrode 40 and electrically insulates the gate electrode 40 and the source electrode 70 .

A thickness W 1 of the field plate insulating film 50 a is larger than a thickness W 2 of the gate insulating film 50 c . In the region R 1 a of the element region R 1 , the maximum value of the thickness W 1 is larger than the maximum value of the thickness W 2 .

In the specification, the thickness of the field plate insulating film 50 a is the thickness of the field plate insulating film 50 a positioned between the field plate electrode 30 and at least a portion of the semiconductor layer 20 . For example, the thickness of the field plate insulating film 50 a is the thickness in the Y-direction of the field plate insulating film 50 a positioned on the side surface 30 s of the field plate electrode 30 .

The thickness of the gate insulating film 50 c is the thickness of the gate insulating film 50 c positioned between the gate electrode 40 and at least a portion of the semiconductor layer 20 . For example, the thickness of the gate insulating film 50 c is the thickness in the Y-direction of the gate insulating film 50 c positioned on the side surface 40 s of the gate electrode 40 .

In the example shown in FIG. 3 , the thickness W 1 is the thickness in the Y-direction of the field plate insulating film 50 a positioned between the field plate electrode 30 and a portion of the drift layer 22 . The thickness W 2 is the thickness in the Y-direction of the gate insulating film 50 c positioned between the gate electrode 40 and a portion of the drift layer 22 , between the gate electrode 40 and the base layer 23 , and between the gate electrode 40 and a portion of the source layer 24 .

The contact 60 is provided selectively on the base layer 23 . For example, the contact 60 is provided inside a trench T 2 formed between the source layers 24 adjacent to each other in the Y-direction. For example, the contact 60 is formed by filling titanium-tungsten (TiW), etc., into the trench T 2 . In such a case, the location directly under the trench T 2 is caused to be of the p + -type prior to filling the metal, etc. The contact 60 may be formed without forming the trench T 2 . In such a case, the contact 60 is formed by, for example, p + -type ion implantation. By forming the contact 60 , the connection resistance of the base layer 23 and the source electrode 70 can be reduced.

The source electrode 70 is provided on the source layer 24 , the inter-layer insulating film 50 d , and the contact 60 . The source electrode 70 is electrically connected to the field plate electrode 30 at a not-illustrated portion. For example, the source electrode 70 has a two-layer structure including a barrier metal and a metal film.

The drain electrode 80 is provided on a lower surface 10 b of the substrate 10 .

As shown in FIG. 4 , the semiconductor device 1 includes the substrate 10 , the drift layer 22 , a guard ring layer 25 , the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , the contact 60 , the source electrode 70 , and the drain electrode 80 in the region R 1 b of the element region R 1 .

The guard ring layer 25 is provided on the drift layer 22 and is positioned between the trenches T 1 adjacent to each other in the Y-direction. The guard ring layer 25 is a portion of the semiconductor layer 20 . The conductivity type of the guard ring layer 25 is different from the conductivity type of the drift layer 22 and is, for example, the p-type. The guard ring layer 25 relaxes the electric field concentration occurring in the terminal region R 2 .

The insulating film 50 is disposed inside the trench T 1 and includes the field plate insulating film 50 a , the inter-layer insulating film 50 b , the gate insulating film 50 c , and the inter-layer insulating film 50 d.

The field plate insulating film 50 a covers the lower surface 30 b and the side surface 30 s of the field plate electrode 30 . For example, the field plate electrode 30 and the drift layer 22 oppose each other with the field plate insulating film 50 a interposed.

The gate insulating film 50 c covers the side surface 40 s of the gate electrode 40 . For example, the gate electrode 40 opposes the drift layer 22 and the guard ring layer 25 with the gate insulating film 50 c interposed.

The thickness of the field plate insulating film 50 a in the region R 1 b of the element region R 1 is substantially the same as the thickness W 1 of the field plate insulating film 50 a in the region R 1 a of the element region R 1 . The thickness of the gate insulating film 50 c in the region R 1 b of the element region R 1 is substantially the same as the thickness W 2 of the gate insulating film 50 c in the region R 1 a of the element region R 1 .

The terminal region R 2 will now be described.

As shown in FIG. 2 , the terminal region R 2 includes a region R 2 a 1 , a region R 2 a 2 , and a region R 2 b . The region R 2 a 1 , the region R 2 a 2 , and the region R 2 b are arranged in order in a direction from the center of the element portion 8 toward the end portion of the element portion 8 . That is, the region R 2 a 1 , the region R 2 a 2 , and the region R 2 b are arranged along the X-direction to be adjacent to each other.

Accordingly, the region R 1 a and R 1 b of the element region R 1 and the regions R 2 a 1 , R 2 a 2 , and R 2 b of the terminal region R 2 are arranged in order along the X-direction to be adjacent to each other.

As shown in FIG. 5 , the semiconductor device 1 includes the substrate 10 , the drift layer 22 , the guard ring layer 25 , the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , an inter-layer insulating film 55 , and the drain electrode 80 in the region R 2 a 1 of the terminal region R 2 .

The guard ring layer 25 is provided on the drift layer 22 and is positioned between the trenches T 1 adjacent to each other in the Y-direction. The inter-layer insulating film 55 is provided on the insulating film 50 (the inter-layer insulating film 50 d ). The inter-layer insulating film 55 includes, for example, silicon oxide. The inter-layer insulating film 55 may include, for example, a silicate glass such as BPSG, PSG, NSG, etc. The inter-layer insulating film 55 may include, for example, silicon nitride or silicon oxynitride. The inter-layer insulating film 50 d and the inter-layer insulating film 55 together may be called the inter-layer insulating film.

The insulating film 50 includes the field plate insulating film 50 a , the inter-layer insulating film 50 b , the gate insulating film 50 c , and the inter-layer insulating film 50 d disposed inside the trench T 1 .

The field plate insulating film 50 a covers the lower surface 30 b and the side surface 30 s of the field plate electrode 30 . For example, the field plate electrode 30 and the drift layer 22 oppose each other with the field plate insulating film 50 a interposed.

The gate insulating film 50 c covers the side surface 40 s of the gate electrode 40 . For example, the gate electrode 40 opposes the drift layer 22 and the guard ring layer 25 with the gate insulating film 50 c interposed.

The thickness of the field plate insulating film 50 a in the region R 2 a 1 of the terminal region R 2 is substantially the same as the thickness W 1 of the field plate insulating film 50 a in the region R 1 a of the element region R 1 . The thickness of the gate insulating film 50 c in the region R 2 a 1 of the terminal region R 2 is substantially the same as the thickness W 2 of the gate insulating film 50 c in the region R 1 a of the element region R 1 .

As shown in FIG. 6 , the semiconductor device 1 includes the substrate 10 , the drift layer 22 , the guard ring layer 25 , the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , the inter-layer insulating film 55 , and the drain electrode 80 in the region R 2 a 2 of the terminal region R 2 . As shown in FIG. 2 , the gate electrode 40 is connected to the pad 9 , etc., via a contact 61 .

The guard ring layer 25 is provided on the drift layer 22 and is positioned between the trenches T 1 adjacent to each other in the Y-direction. The inter-layer insulating film 55 is provided on the insulating film 50 (the inter-layer insulating film 50 d ).

The insulating film 50 is disposed inside the trench T 1 and includes the field plate insulating film 50 a , the inter-layer insulating film 50 b , the gate insulating film 50 c , and the inter-layer insulating film 50 d.

The field plate insulating film 50 a covers the lower surface 30 b and the side surface 30 s of the field plate electrode 30 . For example, the field plate electrode 30 and the drift layer 22 oppose each other with the field plate insulating film 50 a interposed.

The gate insulating film 50 c covers the side surface 40 s of the gate electrode 40 . For example, the gate electrode 40 opposes the drift layer 22 and the guard ring layer 25 with the gate insulating film 50 c interposed.

A thickness W 1 a of the field plate insulating film 50 a is larger than a thickness W 3 of the gate insulating film 50 c . In the region R 2 a 2 of the terminal region R 2 , the maximum value of the thickness W 1 a is larger than the maximum value of the thickness W 3 .

In the example shown in FIG. 6 , the thickness W 1 a is the thickness in the Y-direction of the field plate insulating film 50 a positioned between the field plate electrode 30 and a portion of the drift layer 22 . The thickness W 3 is the thickness in the Y-direction of the gate insulating film 50 c positioned between the gate electrode 40 and a portion of the drift layer 22 and between the gate electrode 40 and a portion of the guard ring layer 25 .

The thickness W 1 a of the field plate insulating film 50 a in the region R 2 a 2 of the terminal region R 2 is substantially the same as the thickness W 1 of the field plate insulating film 50 a in the region R 1 a of the element region R 1 .

The thickness W 3 of the gate insulating film 50 c in the region R 2 a 2 of the terminal region R 2 is thicker than the thickness W 2 of the gate insulating film 50 c in the region R 1 a of the element region R 1 . The maximum value of the thickness W 3 in the region R 2 a 2 is larger than the maximum value of the thickness W 2 in the region R 1 a.

For example, the thickness W 3 is not less than 1.3 times the thickness W 2 .

As shown in FIG. 7 , the semiconductor device 1 includes the substrate 10 , the drift layer 22 , the guard ring layer 25 , the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , the inter-layer insulating film 55 , and the drain electrode 80 in the region R 2 b of the terminal region R 2 .

The insulating film 50 is disposed inside the trench T 1 and includes the field plate insulating film 50 a , the inter-layer insulating film 50 b , the gate insulating film 50 c , and the inter-layer insulating film 50 d.

The field plate insulating film 50 a covers the lower surface 30 b and the side surface 30 s of the field plate electrode 30 . For example, the field plate electrode 30 and the drift layer 22 oppose each other with the field plate insulating film 50 a interposed.

The gate insulating film 50 c covers the side surface 40 s of the gate electrode 40 . For example, the gate electrode 40 opposes the drift layer 22 and the guard ring layer 25 with the gate insulating film 50 c interposed.

A thickness W 1 b of the field plate insulating film 50 a is substantially the same as a thickness W 1 c of the gate insulating film 50 c.

In the example shown in FIG. 7 , the thickness W 1 b is the thickness in the Y-direction of the field plate insulating film 50 a positioned between the field plate electrode 30 and a portion of the drift layer 22 . The thickness W 1 c is the thickness in the Y-direction of the gate insulating film 50 c positioned between the gate electrode 40 and a portion of the drift layer 22 and between the gate electrode 40 and a portion of the guard ring layer 25 .

The thickness W 1 b of the field plate insulating film 50 a in the region R 2 b of the terminal region R 2 is substantially the same as the thickness W 1 of the field plate insulating film 50 a in the region R 1 a of the element region R 1 .

The thickness W 1 c of the gate insulating film 50 c in the region R 2 b of the terminal region R 2 is thicker than the thickness W 3 of the gate insulating film 50 c in the region R 2 a 2 of the terminal region R 2 . The maximum value of the thickness W 1 c in the region R 2 b of the terminal region R 2 is larger than the maximum value of the thickness W 3 in the region R 2 a 2 of the terminal region R 2 .

Thus, for the element region R 1 and the terminal region R 2 , the thicknesses W 1 , W 1 a , and W 1 b of the field plate insulating film 50 a and the thicknesses W 2 , W 3 , and W 1 c of the gate insulating film 50 c satisfy the following relational expression (1).

W 1( W 1 a,W 1 b , and W 1 c )> W 3> W 2  (1)

Because the thicknesses W 2 , W 3 , and W 1 c of the gate insulating film 50 c satisfy Formula (1) recited above, the thickness of the gate insulating film 50 c increases in stages through the terminal region R 2 from the element region R 1 . Thereby, as shown in FIG. 2 , for example, the gate electrode 40 is provided so that a thickness Wg of the gate electrode 40 decreases in stages through the terminal region R 2 from the element region R 1 .

Operations of the semiconductor device 1 will now be described.

In the semiconductor device 1 of the embodiment, a vertical n-channel MOSFET is formed of the semiconductor layer 20 (the drift layer 22 , the base layer 23 , and the source layer 24 ), the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , the contact 60 , the source electrode 70 , and the drain electrode 80 .

For this transistor, when a prescribed voltage is applied to the gate electrode 40 in the state in which a voltage that is positive with respect to the source electrode 70 is applied to the drain electrode 80 , a channel (an inversion layer) is formed in the base layer 23 at the gate insulating film 50 c vicinity; and the semiconductor device 1 is switched to the on-state. Electrons flow from the source electrode 70 through the channel into the drain electrode 80 . That is, an electron current flows from the source layer 24 toward the drift layer 22 .

An example of the connection state of the semiconductor device 1 will now be described.

FIG. 8A and FIG. 8B are circuit diagrams showing connection states of the semiconductor device 1 inside converters. FIG. 8A shows a circuit diagram of an AC-DC converter 100 ; and FIG. 8B shows a circuit diagram of a DC-DC converter 200 .

In the AC-DC converter 100 as shown in FIG. 8A , a semiconductor device 1 A is connected to a control circuit 90 and a transformer 91 . A semiconductor device 1 B is connected to the transformer 91 and a drive circuit 92 . The semiconductor devices 1 A and 1 B are, for example, MOSFETs. A condenser 93 also is connected to the semiconductor device 1 B and the transformer 91 .

In the AC-DC converter 100 , an AC voltage is input, converted, and output as a DC voltage.

In the DC-DC converter 200 as shown in FIG. 8B , a semiconductor device 1 C is provided on the high potential side and is connected to the control circuit 90 and a coil 94 . A semiconductor device 1 D is provided on the low potential side and is connected to the control circuit 90 . The semiconductor device 1 D is connected between the semiconductor device 1 C and the coil 94 . The semiconductor devices 1 C and 1 D are, for example, MOSFETs. The condenser 93 is connected to the coil 94 .

In the DC-DC converter 200 , a DC voltage is input, converted, and output as a DC voltage.

Effects of the embodiment will now be described.

In the semiconductor device 1 according to the embodiment, the gate insulating film 50 c is provided so that the thicknesses W 2 , W 3 , and W 1 c increase in stages through the terminal region R 2 from the element region R 1 . By forming the gate insulating film 50 c in the region R 2 a 2 of the terminal region R 2 to have the thickness W 3 which is thinner than the thickness W 1 c and thicker than the thickness W 2 , the avalanche resistance at turn-off of the semiconductor device 1 can be improved.

Here, to perform the turn-off at a high speed in a semiconductor device such as a MOSFET, etc., there are cases where a reverse-biased voltage is applied to the gate electrode in the off-operation of the switching. When performing the turn-off at a high speed, the breakdown voltage of the region between the source electrode and the drain electrode is affected easily by the components inside the terminal region. For example, when an excessive voltage is applied to the region between the source electrode and the drain electrode, avalanche breakdown occurs; and an electron current and/or a hole current is generated. The electron current and/or the hole current that is generated flows from the guard ring layer into the base layer that has a low potential. That is, a hole current flows from the terminal region into the element region in the case of an n-channel MOSFET; and an electron current flows from the terminal region into the element region in the case of a p-channel field effect transistor.

In the case where the semiconductor device is the n-channel MOSFET, the potential increases due to the resistance of the base layer when the hole current flows from the guard ring layer into the base layer; therefore, a forward bias voltage is applied to the gate electrode and the gate insulating film. When the reverse-biased voltage is applied to the gate electrode in the off-operation of the switching, there are cases where an excessive electric field is applied to the gate insulating film when the carriers are discharged. In such a case, there is a risk that the gate insulating film may breakdown in the terminal region.

In the semiconductor device 1 according to the embodiment, the thickness of the gate insulating film 50 c is changed to have thicknesses having three stages (e.g., the thicknesses W 2 , W 3 , and W 1 c ) through the terminal region R 2 from the element region R 1 . Thus, by changing the thickness of the gate insulating film 50 c in stages, the electric field that is applied to the gate insulating film 50 c when avalanche breakdown occurs can be relaxed. Thereby, even in the state in which the reverse-biased voltage is applied to the gate electrode at turn-off of the semiconductor device 1 , the avalanche resistance is improved; and the breakdown of the gate insulating film can be suppressed.

Although the thickness of the gate insulating film 50 c is changed to have thicknesses having three stages such as the thicknesses W 2 , W 3 , and W 1 c through the terminal region R 2 from the element region R 1 in the embodiment, it is sufficient to increase the thickness of the gate insulating film 50 c in stages through the terminal region R 2 from the element region R 1 . For example, the thickness of the gate insulating film 50 c may be changed to have thicknesses having four or more stages through the terminal region R 2 from the element region R 1 .

According to the embodiment, a semiconductor device that has a higher breakdown voltage can be provided.

Second Embodiment

FIG. 9 is a plan view showing a semiconductor device according to the embodiment. FIG. 10 , FIG. 11 , and FIG. 12 are cross-sectional views along line A 1 -A 2 , line B 1 -B 2 , and line C 1 -C 2 of FIG. 9 .

As shown in FIG. 9 , the element region R 1 and the terminal region R 2 are provided in the semiconductor device 2 according to the embodiment. The element region R 1 includes the region R 1 a and the region R 1 b ; and the terminal region R 2 includes a region R 2 a and the region R 2 b . The region R 1 a and R 1 b of the element region R 1 and the regions R 2 a and R 2 b of the terminal region R 2 are arranged in order along the X-direction to be adjacent to each other.

The thickness of the gate insulating film 50 c formed in each region of the embodiment differs from that of the first embodiment. Otherwise, a detailed description of the configuration is therefore omitted.

The thickness of the field plate insulating film 50 a is substantially the same in the region R 1 a and R 1 b of the element region R 1 and the regions R 2 a and R 2 b of the terminal region R 2 .

The gate insulating film 50 c has the thickness W 2 in the region R 1 a of the element region R 1 .

In the region R 1 b of the element region R 1 as shown in FIG. 10 , the thickness W 1 a of the field plate insulating film 50 a is thicker than the thickness W 3 of the gate insulating film 50 c . For the gate insulating film 50 c , the thickness W 3 is thicker than the thickness W 2 .

In the region R 2 a of the terminal region R 2 as shown in FIG. 11 , the thickness of the field plate insulating film 50 a is substantially the same as the thickness W 1 a ; and the thickness of the gate insulating film 50 c is substantially the same as the thickness W 3 .

In the region R 2 b of the terminal region R 2 as shown in FIG. 12 , the thickness W 1 b of the field plate insulating film 50 a is substantially the same as the thickness W 1 c of the gate insulating film 50 c . For the gate insulating film 50 c , the thickness W 1 c is thicker than the thickness W 3 .

Thus, in the element region R 1 and the terminal region R 2 , the thicknesses W 1 , W 1 a , and W 1 b of the field plate insulating film 50 a and the thicknesses W 2 , W 3 , and W 1 c of the gate insulating film 50 c satisfy the relational expression (1) described above.

In the embodiment, the gate insulating film 50 c is provided so that the thicknesses W 2 , W 3 , and W 1 c increase in stages through the terminal region R 2 from the element region R 1 . That is, the gate insulating film 50 c is provided from the region R 1 b of the element region R 1 to the region R 2 a of the terminal region R 2 to have the thickness W 3 which is thinner than the thickness W 1 c and thicker than the thickness W 2 . In the region R 1 b as shown in FIG. 9 and FIG. 10 , the gate-drain capacitance (Cgd) can be reduced because the thickness W 3 of the gate insulating film 50 c opposing the drift layer 22 which has the drain potential is thick compared to the thickness W 2 of the gate insulating film 50 c of the first embodiment (referring to FIG. 4 ).

Otherwise, the effects of the embodiment are similar to those of the first embodiment described above.

Third Embodiment

FIG. 13 is a plan view showing a semiconductor device according to the embodiment. FIG. 14 and FIG. 15 are cross-sectional views along line A 1 -A 2 and line B 1 -B 2 of FIG. 13 .

As shown in FIG. 13 , the element region R 1 and the terminal region R 2 are provided in the semiconductor device 3 according to the embodiment. The element region R 1 includes the region R 1 a and the region R 1 b ; and the terminal region R 2 includes the region R 2 a 1 , the region R 2 a 2 , a region R 2 b 1 , and a region R 2 b 2 . The region R 1 a and R 1 b of the element region R 1 and the regions R 2 a 1 , R 2 a 2 , R 2 b 1 , and R 2 b 2 of the terminal region R 2 are arranged in order along the X-direction to be adjacent to each other.

The configuration of the element region R 1 and the configurations of the regions R 2 a 1 and R 2 a 2 of the terminal region R 2 in the embodiment are the same as those of the first embodiment. A detailed description of these configurations is therefore omitted.

As shown in FIG. 14 , the semiconductor device 3 includes the substrate 10 , the drift layer 22 , the guard ring layer 25 , the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , the inter-layer insulating film 55 , and the drain electrode 80 in a region R 2 b 1 of the terminal region R 2 .

The thickness W 1 b of the field plate insulating film 50 a is substantially the same as the thickness W 1 c of the gate insulating film 50 c . For the gate insulating film 50 c , the thickness W 1 c is thicker than the thickness W 3 . The thickness W 3 is the thickness of the gate insulating film 50 c in the region R 2 a 2 of the terminal region R 2 .

As shown in FIG. 15 , the semiconductor device 3 includes the substrate 10 , the drift layer 22 , the guard ring layer 25 , a field plate electrode 31 , the insulating film 50 , the inter-layer insulating film 55 , and the drain electrode 80 in a region R 2 b 2 of the terminal region R 2 .

The insulating film 50 is disposed inside the trench T 1 and includes the inter-layer insulating film 50 d and a field plate insulating film 50 e.

The field plate insulating film 50 e covers a lower surface 31 b and a side surface 31 s of the field plate electrode 31 . The field plate electrode 31 opposes the drift layer 22 and the guard ring layer 25 with the field plate insulating film 50 e interposed.

The thickness of the field plate insulating film 50 e is substantially the same as the thickness W 1 b of the field plate insulating film 50 a in the region R 2 b 1 of the terminal region R 2 .

Thus, in the element region R 1 and the terminal region R 2 , the thicknesses W 1 , W 1 a , and W 1 b of the field plate insulating film 50 a and the thicknesses W 2 , W 3 , and W 1 c of the gate insulating film 50 c satisfy the relational expression (1) described above.

In the embodiment, the gate-drain capacitance (Cgd) can be reduced because the field plate electrode 31 is formed in the region R 2 b 1 of the terminal region R 2 which has the drain potential.

Otherwise, the effects of the embodiment are similar to those of the first embodiment described above.

Fourth Embodiment

FIG. 16 is a plan view showing a semiconductor device according to the embodiment. FIG. 17 and FIG. 18 are cross-sectional views along line A 1 -A 2 and line B 1 -B 2 of FIG. 16 .

As shown in FIG. 16 , the element region R 1 and the terminal region R 2 are provided in the semiconductor device 4 according to the embodiment. The element region R 1 includes the region R 1 a and the region R 1 b ; and the terminal region R 2 includes the region R 2 a , the region R 2 b 1 , and the region R 2 b 2 . The region R 1 a and R 1 b of the element region R 1 and the regions R 2 a , R 2 b 1 , and R 2 b 2 of the terminal region R 2 are arranged in order along the X-direction to be adjacent to each other.

The configuration of the element region R 1 and the configuration of the region R 2 a of the terminal region R 2 of the embodiment are the same as those of the second embodiment.

A detailed description of these configurations is therefore omitted.

In the region R 2 b 1 of the terminal region R 2 as shown in FIG. 17 , the thickness W 1 b of the field plate insulating film 50 a is substantially the same as the thickness W 1 c of the gate insulating film 50 c . For the gate insulating film 50 c , the thickness W 1 c is thicker than the thickness W 3 . The thickness W 3 is the thickness of the gate insulating film 50 c in the region R 1 b of the element region R 1 .

As shown in FIG. 18 , the thickness of the field plate insulating film 50 e in the region R 2 b 2 of the terminal region R 2 is substantially the same as the thickness W 1 b of the field plate insulating film 50 a in the region R 2 b 1 of the terminal region R 2 .

Thus, in the element region R 1 and the terminal region R 2 , the thicknesses W 1 , W 1 a , and W 1 b of the field plate insulating film 50 a and the thicknesses W 2 , W 3 , and W 1 c of the gate insulating film 50 c satisfy the relational expression (1) described above.

In the embodiment, the gate-drain capacitance (Cgd) can be reduced because the field plate electrode 31 is formed in the region R 2 b 2 of the terminal region R 2 which has the drain potential.

Otherwise, the effects of the embodiment are similar to those of the second embodiment described above.

Fifth Embodiment

FIG. 19 is a plan view showing a semiconductor device according to the embodiment. FIG. 20 , FIG. 21 , FIG. 22 , and FIG. 23 are cross-sectional views along line A 1 -A 2 , line B 1 -B 2 , line C 1 -C 2 , and line D 1 -D 2 of FIG. 19 .

As shown in FIG. 19 , the element region R 1 and the terminal region R 2 are provided in the semiconductor device 5 according to the embodiment. The element region R 1 includes the region R 1 a and the region R 1 b ; and the terminal region R 2 includes the region R 2 a and the region R 2 b . The region R 1 a and R 1 b of the element region R 1 and the regions R 2 a and R 2 b of the terminal region R 2 are arranged in order along the X-direction to be adjacent to each other.

As shown in FIG. 20 , the semiconductor device 5 includes the substrate 10 , the semiconductor layer 20 , the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , the contact 60 , the source electrode 70 , and the drain electrode 80 in the region R 1 a of the element region R 1 .

For the insulating film 50 , the thickness W 1 of the field plate insulating film 50 a is thicker than the thickness W 2 of the gate insulating film 50 c.

As shown in FIG. 21 , the semiconductor device 5 includes the substrate 10 , the drift layer 22 , the guard ring layer 25 , the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , the contact 60 , the source electrode 70 , and the drain electrode 80 in the region R 1 b of the element region R 1 .

For the insulating film 50 , the thickness W 1 a of the field plate insulating film 50 a is thicker than the thickness W 3 of the gate insulating film 50 c.

The thickness W 1 a of the field plate insulating film 50 a in the region R 1 b of the element region R 1 is substantially the same as the thickness W 1 of the field plate insulating film 50 a in the region R 1 a of the element region R 1 . The thickness W 3 of the gate insulating film 50 c in the region R 1 b of the element region R 1 is thicker than the thickness W 2 of the gate insulating film 50 c in the region R 1 a of the element region R 1 .

As shown in FIG. 22 , the semiconductor device 5 includes the substrate 10 , the drift layer 22 , the guard ring layer 25 , the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , the inter-layer insulating film 55 , and the drain electrode 80 in the region R 2 a of the terminal region R 2 .

The thickness of the field plate insulating film 50 a in the region R 2 a of the terminal region R 2 is substantially the same as the thickness W 1 a of the field plate insulating film 50 a in the region R 1 b of the element region R 1 . The thickness of the gate insulating film 50 c in the region R 2 a of the terminal region R 2 is substantially the same as the thickness W 3 of the gate insulating film 50 c in the region R 1 b of the element region R 1 .

The thickness in a Z-direction of the inter-layer insulating film 50 d is substantially the same as the thickness W 3 .

As shown in FIG. 23 , the semiconductor device 5 includes the substrate 10 , the drift layer 22 , the guard ring layer 25 , the field plate electrode 30 , the gate electrode 40 , the insulating film 50 , the inter-layer insulating film 55 , and the drain electrode 80 in the region R 2 b of the terminal region R 2 .

The thickness W 1 b of the field plate insulating film 50 a is substantially the same as the thickness W 1 c of the gate insulating film 50 c.

The thickness W 1 b of the field plate insulating film 50 a in the region R 2 b of the terminal region R 2 is substantially the same as the thickness W 1 of the field plate insulating film 50 a in the region R 1 a of the element region R 1 . The thickness W 1 c of the gate insulating film 50 c in the region R 2 b of the terminal region R 2 is thicker than the thickness W 3 of the gate insulating film 50 c in the region R 1 b of the element region R 1 .

Thus, in the element region R 1 and the terminal region R 2 , the thicknesses W 1 , W 1 a , and W 1 b of the field plate insulating film 50 a and the thicknesses W 2 , W 3 , and W 1 c of the gate insulating film 50 c satisfy the relational expression (1) described above.

In the embodiment as shown in FIG. 19 and FIG. 22 , the gate electrode 40 is formed at the contact 61 vicinity inside the terminal region R 2 by patterning a conductive film; and the inter-layer insulating film 50 d that has the thickness W 3 that is thicker than the thickness W 2 is formed between the gate electrode 40 and the guard ring layer 25 . Thereby, the electric field concentration at the corner vicinity of the trench T 1 can be relaxed; therefore, the decrease of the breakdown voltage of the insulating film 50 at the corner vicinity of the trench T 1 can be suppressed.

Otherwise, the effects of the embodiment are similar to those of the first embodiment described above.

Sixth Embodiment

FIG. 24 is a plan view showing a semiconductor device according to the embodiment. FIG. 25 and FIG. 26 are cross-sectional views along line A 1 -A 2 and line B 1 -B 2 of FIG. 24 .

As shown in FIG. 24 , the element region R 1 and the terminal region R 2 are provided in the semiconductor device 6 according to the embodiment. The element region R 1 includes the region R 1 a and the region R 1 b ; and the terminal region R 2 includes the region R 2 a , the region R 2 b 1 , and the region R 2 b 2 . The region R 1 a and R 1 b of the element region R 1 and the regions R 2 a , R 2 b 1 , and R 2 b 2 of the terminal region R 2 are arranged in order along the X-direction to be adjacent to each other.

In the embodiment, the configuration of the element region R 1 and the configuration of the region R 2 a of the terminal region R 2 are the same as those of the fifth embodiment. A detailed description of these configurations is therefore omitted.

In the region R 2 b 1 of the terminal region R 2 as shown in FIG. 25 , the thickness W 1 b of the field plate insulating film 50 a is substantially the same as the thickness W 1 c of the gate insulating film 50 c . For the gate insulating film 50 c , the thickness W 1 c is thicker than the thickness W 3 . The thickness W 3 is the thickness of the gate insulating film 50 c in the region R 1 b of the element region R 1 .

As shown in FIG. 26 , the thickness of the field plate insulating film 50 e in the region R 2 b 2 of the terminal region R 2 is substantially the same as the thickness W 1 b of the field plate insulating film 50 a in the region R 2 b 1 of the terminal region R 2 .

Thus, in the element region R 1 and the terminal region R 2 , the thicknesses W 1 , W 1 a , and W 1 b of the field plate insulating film 50 a and the thicknesses W 2 , W 3 , and W 1 c of the gate insulating film 50 c satisfy the relational expression (1) described above.

In the embodiment, the gate-drain capacitance (Cgd) can be reduced because the field plate electrode 31 is formed in the region R 2 b 1 of the terminal region R 2 which has the drain potential.

Otherwise, the effects of the embodiment are similar to those of the fifth embodiment described above.

Seventh Embodiment

FIG. 27 is a plan view showing a semiconductor device according to the embodiment. FIG. 28 , FIG. 29 , and FIG. 30 are cross-sectional views along line A 1 -A 2 , line B 1 -B 2 , and line C 1 -C 2 of FIG. 27 .

As shown in FIG. 27 , the element region R 1 and the terminal region R 2 are provided in the semiconductor device 7 according to the embodiment. The element region R 1 includes the region R 1 a and the region R 1 b . The terminal region R 2 and the region R 1 a and R 1 b of the element region R 1 are arranged in order along the X-direction to be adjacent to each other.

As shown in FIG. 28 , the semiconductor device 7 includes the substrate 10 , the semiconductor layer 20 , the gate electrode 40 , a gate insulating film 50 c 1 , the contact 60 , the source electrode 70 , and the drain electrode 80 in the region R 1 a of the element region R 1 . The semiconductor layer 20 includes the drift layer 22 , the base layer 23 , and the source layer 24 .

The multiple trenches T 1 that are arranged along the Y-direction are formed inside the semiconductor layer 20 ; and the gate electrode 40 is disposed inside each of the trenches T 1 . That is, the semiconductor device 7 of the embodiment is a MOSFET having a trench gate structure.

In the region R 1 a of the element region R 1 , a gate insulating film 50 c 1 has the thickness W 2 .

As shown in FIG. 29 , the semiconductor device 7 includes the substrate 10 , the drift layer 22 , the base layer 23 , the gate electrode 40 , the gate insulating film 50 c 1 , the contact 60 , the source electrode 70 , and the drain electrode 80 in the region R 1 b of the element region R 1 .

In the region R 1 b of the element region R 1 , the gate insulating film 50 c 1 has the thickness W 3 . The thickness W 3 is thicker than the thickness W 2 .

As shown in FIG. 30 , the semiconductor device 7 includes the substrate 10 , the drift layer 22 , the base layer 23 , the gate electrode 40 , the gate insulating film 50 c 1 , the inter-layer insulating film 55 , and the drain electrode 80 in the terminal region R 2 .

The thickness of the gate insulating film 50 c 1 in the terminal region R 2 is substantially the same as the thickness W 3 of the gate insulating film 50 c 1 in the region R 1 b of the element region R 1 .

In the embodiment, the gate insulating film 50 c 1 is provided so that the thicknesses W 2 and W 3 increase in stages through the terminal region R 2 from the element region R 1 . That is, in the terminal region R 2 and the region R 1 b of the element region R 1 , the gate insulating film 50 c 1 is provided to have the thickness W 3 that is thicker than the thickness W 2 .

Although the thickness of the gate insulating film 50 c 1 is changed to have thicknesses having two stages such as the thicknesses W 2 and W 3 through the terminal region R 2 from the element region R 1 , it is sufficient to increase in stages through the terminal region R 2 from the element region R 1 . For example, the thickness of the gate insulating film 50 c 1 may be changed to have thicknesses having three or more stages through the terminal region R 2 from the element region R 1 .

Otherwise, the effects of the embodiment are similar to those of the first embodiment described above.

As described above, although the case is described as an example where the semiconductor devices according to the embodiments are vertical power MOSFETs, the semiconductor devices according to the embodiments are not limited to vertical power MOSFETs. For example, the semiconductor devices according to the embodiments may be vertical IGBTs or lateral power MOSFETs. Also, the polarity may be the n-channel type or the p-channel type.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modification as would fall within the scope and spirit of the inventions.