Printed circuit board used as voice coil, method for manufacturing the same and loudspeaker with the same

The subject matter herein generally relates to a printed circuit board used as a voice coil, a method for manufacturing the printed circuit board, and a loudspeaker with the printed circuit board.

A conventional voice coil has a large thickness. Decreasing the thickness of a voice coil presents challenges.

Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.

FIG. 1 is an isometric view of a printed circuit board in accordance with an exemplary embodiment of the present disclosure.

FIG. 2 is a cross section view of a part of a first electrically connecting region of the printed circuit board of FIG. 1 , taken along line A-A.

FIG. 3 is a cross section view of a second electrically connecting region of the printed circuit board of FIG. 1 , taken along line B-B.

FIG. 4 is a top view of a first circuit structure on a top surface of a first board unit of the printed circuit board of FIG. 1 in accordance with an exemplary embodiment of the present disclosure.

FIG. 5 is a top view of a second circuit structure on a bottom surface of a first board unit of the printed circuit board of FIG. 1 in accordance with an exemplary embodiment of the present disclosure.

FIG. 6 is a top view of a first circuit structure on a top surface of a second board unit of the printed circuit board of FIG. 1 in accordance with an exemplary embodiment of the present disclosure.

FIG. 7 is a top view of a second circuit structure on a bottom surface of a second board unit of the printed circuit board FIG. 1 in accordance with an exemplary embodiment of the present disclosure.

FIG. 8 is a top view of a first circuit structure on a top surface of a third board unit of the printed circuit board FIG. 1 in accordance with an exemplary embodiment of the present disclosure.

FIG. 9 is a top view of a second circuit structure on a bottom surface of a third board unit of the printed circuit board FIG. 1 in accordance with an exemplary embodiment of the present disclosure.

FIG. 10 is a top view of a first circuit structure on a top surface of a fourth board unit of the printed circuit board FIG. 1 in accordance with an exemplary embodiment of the present disclosure.

FIG. 11 is a top view of a second circuit structure on a bottom surface of a fourth board unit of the printed circuit board FIG. 1 in accordance with an exemplary embodiment of the present disclosure.

FIG. 12 is an isometric view of a printed circuit board in accordance with another exemplary embodiment of the present disclosure.

FIG. 13 is a diagram of a first step of a first exemplary embodiment of “stacking N board units” on the printed circuit board of FIG. 1 .

FIG. 14 is a diagram of a second step of the first exemplary embodiment of “stacking N board units” on the printed circuit board of FIG. 1 .

FIG. 15 is a diagram of a first step of a second exemplary embodiment of “stacking N board units” on the printed circuit board of FIG. 1 .

FIG. 16 is a diagram of a second step of the second exemplary embodiment of “stacking N board units” on the printed circuit board of FIG. 1 .

FIG. 17 is an isometric view of a loudspeaker with the printed circuit board of FIG. 1 in accordance with an embodiment of the present disclosure.

FIG. 18 is an isometric view of a loudspeaker with the printed circuit board of FIG. 1 in accordance with a second exemplary embodiment of the present disclosure.

It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.

The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.

A printed circuit board 10 used as a voice coil is disclosed. Referring to FIG. 1 , the printed circuit board 10 comprises N board units 101 stacked over one another, where N□1.

In this exemplary embodiment, the printed circuit board 10 comprises four board units 101 , namely, a first board unit 101 a, a second board unit 101 b, a third board unit 101 c, and a fourth board unit 101 d.

In other exemplary embodiments, the printed circuit board 10 can comprise one board unit 101 , two board units 101 , three board units 101 , five board units 101 or ten board units 101 .

An adhering layer 102 is disposed between each two adjacent board units 101 . The adhering layer 102 can be made of insulating material.

The printed circuit board 10 has a top surface 10 a and a bottom surface 10 b opposite to the top surface 10 a. Each board unit 101 has a first electrically connecting region 103 and a second electrically connecting region 104 (referring to FIGS. 4-11 ).

Referring to FIGS. 2-3 , all of the first electrically connecting regions 103 are stacked over one another. All of the second electrically connecting regions 104 are stacked over one another.

Each board unit 101 has a first circuit structure 201 , a base 203 , and a second circuit structure 202 . The first circuit structure 201 , the base 203 , and the second circuit structure 202 are arranged from top to bottom. The first circuit structure 201 is on a top surface of the base 203 , while the second circuit structure 202 is on a bottom surface of the base 203 . The first circuit structure 201 and the second circuit structure 202 can be made of copper.

Starting points K 1 , K 2 , K 3 , and K 4 in the first electrically connecting regions 103 of the first circuit structures 201 of the board units 101 are staggered, and starting points K 5 , K 6 , K 7 , and K 8 in the second electrically connecting regions 104 of the second circuit structures 202 of the board units 101 are staggered.

Ending points Z 1 , Z 2 , Z 3 , and Z 4 in the second electrically connecting regions 104 of the first circuit structures 201 of the board units 101 are staggered, and ending points Z 5 , Z 6 , Z 7 , and Z 8 in the first electrically connecting regions 103 of the second circuit structures 202 of the board units 101 are staggered.

Further, referring to FIGS. 1-3 , a plurality of holes 105 can be defined as through holes extending from the top surface 10 a to the bottom surface 10 b of the printed circuit board 10 . Each hole 105 receives an electrically connecting portion 106 .

The number of the board units is N, the number of the holes is 2N−1. For example, the total number of holes 105 is equal to two times the total number of board units 101 minus one (i.e., 2N−1). N−1 holes are positioned in the first electrically connecting regions 103 , and N holes are positioned in the second electrically connecting regions 104 .

Referring to FIG. 2 , in each two adjacent board units 101 , the first electrically connecting region 103 of the second circuit structure 202 of an upper board unit 101 is electrically connected in series with the first electrically connecting region 103 of the first circuit structure 201 of a lower board unit 101 by one or more of the electrically connecting portions 106 received in one or more of the holes 105 .

In FIG. 2 , the ending point Z 5 is electrically connected to the starting point K 2 by an electrically connecting portion 106 received in a hole 105 ; the ending point Z 6 is electrically connected to the starting point K 3 by another electrically connecting portion 106 received in another hole 105 ; the ending point Z 7 is electrically connected to the starting point K 4 by yet another electrically connecting portion 106 received in yet another hole 105 .

Referring to FIG. 3 , in each board unit 101 , the first circuit structure 201 is electrically connected in series with the second circuit structure 202 in the second electrically connecting region 104 by one or more of the electrically connecting portions 106 received in one or more of the holes 105 .

In at least one exemplary embodiments, the ending point Z 1 is electrically connected to the starting point K 5 by an electrically connecting portion 106 received in a hole 105 ; the ending point Z 2 is electrically connected to the starting point K 6 by another electrically connecting portion 106 received in another hole 105 ; the ending point Z 3 is electrically connected to the starting point K 7 by another electrically connecting portion 106 received in another hole 105 ; the ending point Z 4 is electrically connected to the starting point K 8 by yet another electrically connecting portion 106 received in yet another hole 105 .

Referring to FIGS. 4-11 , each first circuit structure 201 starts in the first electrically connecting region 103 , spirals around and closes to the second electrically connecting region 104 , and ends in the second electrically connecting region 104 . Each second circuit structure 202 starts in the second electrically connecting region 104 , spirals around and away from the second electrically connecting region 104 , and ends in the first electrically connecting region 103 .

Each first circuit structure 201 and second circuit structure 202 spirals around the second electrically connecting region 104 along a clockwise direction or a counterclockwise direction.

Referring to FIG. 1 , the first electrically connecting region 103 of the first circuit structure 201 of the board unit 101 has a starting terminal 301 positioned at the starting point K 1 . Referring to FIG. 11 , the first electrically connecting region 103 of the second circuit structure 202 of the Nth board unit 101 has an ending terminal 302 positioned at the ending point Z 8 .

In this exemplary embodiment, referring to FIGS. 1 and 4-11 , in the first board unit 101 a (as shown in FIGS. 4 and 5 ):

the first circuit structure 201 starts in the starting terminal 301 of the first electrically connecting region 103 positioned at the starting point K 1 , spirals around and closes to the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a first hole 1052 a of the second electrically connecting region 104 positioned at the ending point Z 1 ; the second circuit structure 202 starts in the electrically connecting portion 106 of the first hole 1052 a of the second electrically connecting region 104 positioned at the starting point K 5 , spirals around and away from the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a first hole 1051 a of the first electrically connecting region 103 position at the ending point Z 5 .

In the second board unit 101 b (as shown in FIGS. 6 and 7 ):

the first circuit structure 201 starts in the first hole 1051 a of the first electrically connecting region 103 positioned at the starting point K 2 , spirals around and closes to the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a second hole 1052 b of the second electrically connecting region 104 positioned at the ending point Z 2 ; the second circuit structure 202 starts in the electrically connecting portion 106 of the second hole 1052 b of the second electrically connecting region 104 positioned at the starting point K 6 , spirals around and away from the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a second hole 1051 b of the first electrically connecting region 103 position at the ending point Z 6 .

In the third board unit 101 c (as shown in FIGS. 8 and 9 ):

the first circuit structure 201 starts in the second hole 1051 b of the first electrically connecting region 103 positioned at the starting point K 3 , spirals around and closes to the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a third hole 1052 c of the second electrically connecting region 104 positioned at the ending point Z 3 ; the second circuit structure 202 starts in the electrically connecting portion 106 of the third hole 1052 c of the second electrically connecting region 104 positioned at the starting point K 7 , spirals around and away from the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a third hole 1051 c of the first electrically connecting region 103 position at the ending point Z 7 .

In the fourth board unit 101 d (as shown in FIGS. 10 and 11 ):

the first circuit structure 201 starts in the third hole 1051 c of the first electrically connecting region 103 positioned at the starting point K 4 , spirals around and closes to the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a fifth hole 1052 d of the second electrically connecting region 104 positioned at the ending point Z 4 ; the second circuit structure 202 starts in the electrically connecting portion 106 of the fifth hole 1052 d of the second electrically connecting region 104 positioned at the starting point K 8 , spirals around and away from the second electrically connecting region 104 along a counterclockwise direction, and ends in the ending terminal 302 of the first electrically connecting region 103 position at the ending point Z 8 .

Further, a plurality of pads 108 can be formed around the holes 105 of the printed circuit board 10 .

The printed circuit board 10 has an extending terminal 303 and an electrically connecting hole (not shown). The extending terminal 303 can be formed on the top surface 10 a of the printed circuit board 10 and positioned at the first electrically connecting region 103 . The electrically connecting hole is defined through the top surface 10 a and the bottom surface 10 b of the printed circuit board 10 and is electrically connecting between the ending terminal 302 and the extending terminal 303 .

The printed circuit board 10 also has a receiving channel 107 formed through the top surface 10 a and the bottom surface 10 b of the printed circuit board 10 .

Each first circuit structure 201 starts in the first electrically connecting region 103 , spirals around and closes to the second electrically connecting region 104 and the receiving channel 107 , and ends in the second electrically connecting region 104 . Each second circuit structure 202 starts in the second electrically connecting region 104 , spirals around and away from the second electrically connecting region 104 and the receiving channel 107 , and ends in the first electrically connecting region 103 .

In at least one exemplary embodiment, referring to FIGS. 1-11 , the first electrically connecting regions 103 and the second electrically connecting regions 104 are positioned on opposite sides of the receiving channel 107 .

In another exemplary embodiment, referring to FIG. 12 , the first electrically connecting regions 103 and the second electrically connecting regions 104 are positioned on one side of the receiving channel 107 .

A method for manufacturing a printed circuit board 10 comprises:

providing N board units 101 , where N≥1, each board unit 101 having a first electrically connecting region 103 and a second electrically connecting region 104 , each board unit 101 having a first circuit structure 201 , a base 203 , and a second circuit structure 202 arranged from top to bottom, each first circuit structure 201 starting in the first electrically connecting region 103 , spiraling around and closing to the second electrically connecting region 104 , and ending in the first electrically connecting region 103 , each second circuit structure 202 starting in the second electrically connecting region 104 , spiraling around and away from the second electrically connecting region 104 , and ending in the first electrically connecting region 103 ; stacking the N board units 101 , the first electrically connecting regions 103 being stacked over one another, and the second electrically connecting regions 104 being stacked over one another; starting points K 1 , K 2 , K 3 , and K 4 in the first electrically connecting regions 103 of the first circuit structures 201 of the board units 101 being staggered, and starting points K 5 , K 6 , K 7 , and K 8 in the second electrically connecting regions 104 of the second circuit structures 202 of the board units 101 being staggered, ending points Z 1 , Z 2 , Z 3 , and Z 4 in the second electrically connecting regions 104 of the first circuit structures 201 of the board units 101 being staggered, and ending points Z 5 , Z 6 , Z 7 , and Z 8 in the first electrically connecting regions 103 of the second circuit structures 202 of the board units 101 being staggered; and in each board unit 101 , electrically connecting in series the first circuit structure 201 and the second circuit structure 202 in the second electrically connecting region 104 , in each two adjacent board unit 101 , electrically connecting in series the first electrically connecting region 103 of the second circuit structure 202 of an upper board unit 101 and the first electrically connecting region 103 of the first circuit structure 201 of a lower board unit 101 .

In the “providing N board units 101 , where N≥1, each board unit 101 having a first electrically connecting region 103 and a second electrically connecting region 104 , each board unit 101 having a first circuit structure 201 , a base 203 , and a second circuit structure 202 arranged from top to bottom, each first circuit structure 201 starting in the first electrically connecting region 103 , spiraling around and closing to the second electrically connecting region 104 , and ending in the first electrically connecting region 103 , each second circuit structure 202 starting in the second electrically connecting region 104 , spiraling around and away from the second electrically connecting region 104 , and ending in the first electrically connecting region 103 ”, the first circuit structures 201 and the second circuit structures 202 can be made of copper.

In this exemplary embodiment, referring to FIGS. 4-11 , each first circuit structure 201 starts in the first electrically connecting region 103 , spirals around and closes to the second electrically connecting region 104 along a counterclockwise direction, and ends in the second electrically connecting region 104 . Each second circuit structure 202 starts in the second electrically connecting region 104 , spirals around and away from the second electrically connecting region 104 along a counterclockwise direction, and ends in the first electrically connecting region 103 . In other exemplary embodiments (not shown), each first circuit structure 201 can start in the first electrically connecting region 103 , spiral around and close to the second electrically connecting region 104 along a clockwise direction, and end in the second electrically connecting region 104 . Each second circuit structure 202 can start in the second electrically connecting region 104 , spiral around and keep away from the second electrically connecting region 104 along a clockwise direction, and end in the first electrically connecting region 103 .

In the “stacking the N board units 101 , the first electrically connecting regions 103 being stacked over one another, and the second electrically connecting regions 104 being stacked over one another”, an adhering layer 102 can be disposed between each two adjacent board units 101 . The adhering layer 102 can be made of insulating material.

The N board units 101 can be four board units 101 .

Referring to FIGS. 13-16 , for illustration purposes, in the first board unit 101 a, a plane in which the first circuit structure 201 is located is marked as a first surface L 1 , a plane in which the second circuit structure 202 is located is marked as a second surface L 2 , and the first surface L 1 is opposite to the second surface L 2 . In the second board unit 101 b, a plane in which the first circuit structure 201 is located is marked as a third surface L 3 , a plane in which the second circuit structure 202 is located is marked as a fourth surface L 4 , and the third surface L 3 is opposite to the fourth surface L 4 . In the third board unit 101 c, a plane in which the first circuit structure 201 is located is marked as a fifth surface L 5 , a plane in which the second circuit structure 202 is located is marked as a sixth surface L 6 , and the fifth surface L 5 is opposite to the sixth surface L 6 . In the fourth board unit 101 d, a plane in which the first circuit structure 201 is located is marked as a seventh surface L 7 , a plane in which the second circuit structure 202 is located is marked as an eighth surface L 8 , and the seventh surface L 7 is opposite to the eighth surface L 8 .

A first exemplary embodiment of “stacking the N board unit 101 ” is as follows.

Referring to FIG. 13 , the first surface L 1 , the fourth surface L 4 , the fifth surface L 5 and the eighth surface L 8 are arranged from left to right and face upward. The first surface L 1 and the eighth surface L 8 are respectively folded backwardly along a first folding line X 1 and a third folding line X 2 . The second surface L 2 faces the third surface L 3 , and the sixth surface L 6 faces the seventh surface L 7 . Then, referring to FIG. 14 , the fourth surface L 4 and fifth surface L 5 are arranged from left to right and face upward. The fourth surface L 4 and the fifth surface L 5 are folded backwardly along a second folding line X 3 , and the fourth surface L 4 faces the fifth surface L 5 .

A second exemplary embodiment of “stacking the N board unit 101 ” is as follows.

Referring to FIG. 15 , the second surface L 2 , the seventh surface L 7 , the sixth surface L 6 and the third surface L 3 are arranged from left to right and face upward. The seventh surface L 7 and the sixth surface L 6 are folded forwardly along a fourth folding line X 4 . The second surface L 2 faces the third surface L 3 , and the sixth surface L 6 faces the seventh surface L 7 . Then, referring to FIG. 16 , the fourth surface L 4 and fifth surface L 5 are arranged from left to right and face upward. The fourth surface L 4 and the fifth surface L 5 are folded backwardly along a fifth folding line X 5 , and the fourth surface L 4 faces the fifth surface L 5 .

Further, a plurality of adhering layers 102 can be adhered between the second surface L 2 and the third surface L 3 , between the fourth surface L 4 and the fifth surface L 5 , and between the sixth surface L 6 and the seventh surface L 7 .

In the “starting points K 1 , K 2 , K 3 , and K 4 in the first electrically connecting regions 103 of the first circuit structures 201 of the board units 101 being staggered, and starting points K 5 , K 6 , K 7 , and K 8 in the second electrically connecting regions 104 of the second circuit structures 202 of the board units 101 being staggered, ending points Z 1 , Z 2 , Z 3 , and Z 4 in the second electrically connecting regions 104 of the first circuit structures 201 of the board units 101 being staggered, and ending points Z 5 , Z 6 , Z 7 , and Z 8 in the first electrically connecting regions 103 of the second circuit structures 202 of the board units 101 being staggered”, referring to FIGS. 1 and 4 , the first circuit structure 201 of the first board unit 101 a starts in the starting point K 1 . Referring to FIGS. 2 and 6 , the first circuit structure 201 of the second board unit 101 b starts in the starting point K 2 . Referring to FIGS. 2 and 8 , the first circuit structure 201 of the third board unit 101 c starts in starting point K 3 . Referring to FIGS. 2 and 10 , the first circuit structure 201 of the fourth board unit 101 d starts in starting point K 4 . Referring to FIGS. 3 and 5 , the second circuit structure 202 of the first board unit 101 a starts in starting point K 5 . Referring to FIGS. 3 and 7 , the second circuit structure 202 of the second board unit 101 b starts in starting point K 6 . Referring to FIGS. 3 and 9 , the second circuit structure 202 of the third board unit 101 c starts in starting point K 7 . Referring to FIGS. 3 and 11 , the second circuit structure 202 of the fourth board unit 101 d starts in starting point K 8 .

Referring to FIGS. 3 and 4 , the first circuit structure 201 of the first board unit 101 a ends in the ending point Z 1 . Referring to FIGS. 3 and 6 , the first circuit structure 201 of the second board unit 101 b ends in the ending point Z 2 . Referring to FIGS. 3 and 8 , the first circuit structure 201 of the third board unit 101 c ends in the ending point Z 3 . Referring to FIGS. 3 and 10 , the first circuit structure 201 of the fourth board unit 101 d ends in the ending point Z 4 . Referring to FIGS. 2 and 5 , the second circuit structure 202 of the first board unit 101 a ends in the ending point Z 5 . Referring to FIGS. 2 and 7 , the second circuit structure 202 of the second board unit 101 b ends in the ending point Z 6 . Referring to FIGS. 2 and 9 , the second circuit structure 202 of the third board unit 101 c ends in the ending point Z 7 . Referring to FIGS. 2 and 11 , the second circuit structure 202 of the fourth board unit 101 d ends in the ending point Z 8 .

Referring to FIG. 1 , the first electrically connecting region 103 of the first circuit structure 201 of the board unit 101 can have a starting terminal 301 positioned at starting point K 1 . Referring to FIG. 11 , the first electrically connecting region 103 of the second circuit structure 202 of the Nth board unit 101 can have an ending terminal 302 positioned at ending point Z 8 .

In the “in each board unit 101 , electrically connecting in series the first circuit structure 201 and the second circuit structure 202 in the second electrically connecting region 104 , in each two adjacent board unit 101 , electrically connecting in series the first electrically connecting region 103 of the second circuit structure 202 of an upper board unit 101 and the first electrically connecting region 103 of the first circuit structure 201 of a lower board unit 101 ”, a plurality of holes 105 can be defined through the top surface 10 a and the bottom surface 10 b of the printed circuit board 10 . Each hole 105 receives an electrically connecting portion 106 . The electrically connecting portions 106 can be received in the holes 105 by electroplating. The electrically connecting portions 106 can be made of copper.

The number of the board units is N, the number of the holes is 2N−1. For example, the total number of holes 105 is equal to two times the total number of board units 101 minus one (i.e., 2N−1). N−1 holes are positioned in the first electrically connecting regions 103 , and N holes are positioned in the second electrically connecting regions 104 .

Referring to FIG. 2 , the ending points Z 5 is electrically connected to the starting points K 2 by the electrically connecting portion received in the hole 105 ; the ending points Z 6 is electrically connected to the starting points K 3 by the electrically connecting portion received in the hole 105 ; the ending points Z 7 is electrically connected to the starting points K 4 by the electrically connecting portion received in the hole 105 .

Referring to FIG. 3 , the ending point Z 1 is electrically connected to the starting point K 5 by the electrically connecting portion received in the hole 105 ; the ending point Z 2 is electrically connected to the starting point K 6 by the electrically connecting portion received in the hole 105 ; the ending point Z 3 is electrically connected to the starting point K 7 by the electrically connecting portion received in the hole 105 ; the ending point Z 4 is electrically connected to the starting point K 8 by the electrically connecting portion received in the hole 105 .

In this exemplary embodiment, referring to FIGS. 1 and 4-11 , the printed circuit board 10 comprises four board units 101 . The four board units 101 respectively are a first board unit 101 a, a second board unit 101 b, a third board unit 101 c, and a fourth board unit 101 d.

In the first board unit 101 a, the first circuit structure 201 starts in the starting terminal 301 of the first electrically connecting region 103 positioned at the starting point K 1 , spirals around and closes to the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a first hole 1052 a of the second electrically connecting region 104 positioned at the ending point Z 1 . The second circuit structure 202 starts in the electrically connecting portion 106 of the first hole 1052 a of the second electrically connecting region 104 positioned at the starting point K 5 , spirals around and away from the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a first hole 1051 a of the first electrically connecting region 103 position at the ending point Z 5 .

In the second board unit 101 b, the first circuit structure 201 starts in the first hole 1051 a of the first electrically connecting region 103 positioned at the starting point K 2 , spirals around and closes to the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a second hole 1052 b of the second electrically connecting region 104 positioned at the ending point Z 2 . The second circuit structure 202 starts in the electrically connecting portion 106 of the second hole 1052 b of the second electrically connecting region 104 positioned at the starting point K 6 , spirals around and away from the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a second hole 1051 b of the first electrically connecting region 103 position at the ending point Z 6 .

In the third board unit 101 c, the first circuit structure 201 starts in the second hole 1051 b of the first electrically connecting region 103 positioned at the starting point K 3 , spirals around and closes to the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a third hole 1052 c of the second electrically connecting region 104 positioned at the ending point Z 3 . The second circuit structure 202 starts in the electrically connecting portion 106 of the third hole 1052 c of the second electrically connecting region 104 positioned at the starting point K 7 , spirals around and away from the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a third hole 1051 c of the first electrically connecting region 103 positioned at the ending point Z 7 .

In the fourth board unit 101 d, the first circuit structure 201 starts in the third hole 1051 c of the first electrically connecting region 103 positioned at the starting point K 4 , spirals around and closes to the second electrically connecting region 104 along a counterclockwise direction, and ends in the electrically connecting portion 106 of a fifth hole 1052 d of the second electrically connecting region 104 positioned at the ending point Z 4 . The second circuit structure 202 starts in the electrically connecting portion 106 of the fifth hole 1052 d of the second electrically connecting region 104 positioned at the starting point K 8 , spirals around and away from the second electrically connecting region 104 along a counterclockwise direction, and ends in the ending terminal 302 of the first electrically connecting region 103 positioned at the ending point Z 8 .

The method for manufacturing the printed circuit board 10 can further comprise: forming a receiving channel 107 through the top surface 10 a and bottom surface 10 b of the printed circuit board 10 .

Each first circuit structure 201 starts in the first electrically connecting region 103 , spirals around and closes to the second electrically connecting region 104 and the receiving channel 107 , and ends in the second electrically connecting region 104 . Each second circuit structure 202 starts in the second electrically connecting region 104 , spirals around and away from the second electrically connecting region 104 and the receiving channel 107 , and ends in the first electrically connecting region 103 .

In at least one exemplary embodiment, referring to FIGS. 1-11 , the first electrically connecting regions 103 and the second electrically connecting regions 104 are positioned at opposite sides of the receiving channel 107 .

In another exemplary embodiment, referring to FIG. 12 , the first electrically connecting regions 103 and the second electrically connecting regions 104 are positioned at one side of the receiving channel 107 .

A loudspeaker with the printed circuit board 10 is also disclosed.

Referring to FIG. 17 , FIG. 17 is an isometric view of a loudspeaker 80 with the printed circuit board 10 in accordance with an exemplary embodiment of the present disclosure.

The printed circuit board 10 has a receiving channel 107 formed through the top surface 10 a and the bottom surface 10 b of the printed circuit board 10 .

Each first circuit structure 201 starts in the first electrically connecting region 103 , spirals around and closes to the second electrically connecting region 104 and the receiving channel 107 , and ends in the second electrically connecting region 104 . Each second circuit structure 202 starts in the second electrically connecting region 104 , spirals around and away from the second electrically connecting region 104 and the receiving channel 107 , and ends in the first electrically connecting region 103 .

The loudspeaker 80 also comprises a magnetic core 801 received in the receiving channel 107 of the printed circuit board 10 . The magnetic core 801 is used for providing a first magnetic field. The printed circuit board 10 is surrounded by the first magnetic field. When the printed circuit board 10 is powered, electrical current spirals around the second electrically connecting regions 104 and the receiving channel 107 along a clockwise direction or a counterclockwise direction for generating a second magnetic field. An acting force is generated between the first magnetic field and the second magnetic field, and a displacement is generated between the magnetic core 801 and the printed circuit board 10 for driving other components of the loudspeaker 80 to make a sound.

Referring to FIG. 18 , FIG. 18 is an isometric view of a loudspeaker 90 with the printed circuit board 10 in accordance with an exemplary embodiment of the present disclosure.

The printed circuit board 10 of the loudspeaker 90 does not have the receiving channel 107 .

The loudspeaker 90 comprises a first magnet 901 and a second magnet 902 . The printed circuit board 10 is positioned between the first magnet 901 and the second magnet 902 . The first magnet 901 faces the top surface 10 a of the printed circuit board 10 , and the second magnet 902 faces the bottom surface 10 b of the printed circuit board 10 . A first distance C 1 is between the first magnet 901 and the top surface 10 a of the printed circuit board 10 . A second distance C 2 is between the second magnet 902 and the bottom surface 10 b of the printed circuit board 10 . The first distance C 1 may or may not be equal to second distance C 2 . The first magnet 901 and the second magnet 902 are used for providing a first magnetic field. The printed circuit board 10 is around in the first magnetic field. When the printed circuit board 10 is powered, electrical current spirals around the second electrically connecting regions 104 along a clockwise direction or a counterclockwise direction for generating a second magnetic field. An acting force is generated between the first magnetic field and the second magnetic field, and the printed circuit board 10 moves between the first magnet 901 and the second magnet 902 for driving other component of the loudspeaker 90 to make a sound.

It is to be understood, even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only; changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.