Inventor
Xian-Qin Hu
Inventor
Shenzhen, CN
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits41%
Y10TTechnical subjects covered by former us classification12%
H01LSemiconductor devices7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact3%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
H01PWaveguides3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
C23CCoating metallic material2%
C23FNon-mechanical removal of metallic material from surface2%
PatentTitleYear
10,791,625Method for manufacturing flexible printed circuit board202010,681,824Waterproof circuit board and method for manufacturing the same202010,660,218Method of manufacturing multilayer circuit board202010,653,011Method for manufacturing circuit board202010,653,015Multilayer circuit board and method of manufacturing the same202010,638,606Composite circuit board202010,542,627Method for manufacturing a flexible printed circuit board202010,533,811Heat dissipation device202010,365,430Method for manufacturing high frequency signal transmission structure and high frequency signal transmission structure obtained thereby201910,321,561Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board201910,285,260Flexible printed circuit board and method for manufacturing same201910,278,307Cooling plate and method for manufacturing thereof201910,205,487Wireless power consortium device and method for manufacturing the same201910,159,149Composite circuit board and method of manufacturing the same201810,136,207Printed circuit board used as voice coil, method for manufacturing the same and loudspeaker with the same201810,104,771Method for making a circuit board201810,012,454Heat dissipation device and method for manufacturing same20189,992,858Printed circuit board20189,820,388'Printed circuit board and method for manufacturing same'20179,706,640'Method for manufacturing printed circuit board'20179,693,448'Flexible circuit board and method for making the same'20179,622,340'Flexible circuit board and method for manufacturing same'20179,615,445'Flexible circuit board and method for manufacturing same'20179,485,859'Flexible circuit board and method for manufacturing same'20169,357,631'Flexible printed circuit board and method for making same'20169,288,914'Method of manufacturing a printed circuit board with circuit visible'20169,277,640'Flexible printed circuit board and method for manufacturing same'20169,066,431'Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2018Patents assigned to FUKUI PREC COMPONENT SHENZHEN (7)· patent assignee history
2015–2020Based in Shenzhen, CN· patent location history
2016–2018Patents assigned to ZHEN DING TECH CO LTD (7)· patent assignee history
2017–2019Patents assigned to GARUDA TECH CO LTD (7)· patent assignee history
2017–2020Based in Qinhuangdao, CN· patent location history
2018–2020Patents assigned to AVARY HOLDING SHENZHEN CO LTD (18)· patent assignee history
2018–2020Patents assigned to HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD (17)· patent assignee history
2018–2019Based in Guangdong, CN· patent location history
2020Based in Hebei, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AVARY HOLDING SHENZHEN CO LTD | 18 | 2018–2020 |
| HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD | 17 | 2018–2020 |
| FUKUI PREC COMPONENT SHENZHEN | 7 | 2015–2018 |
| GARUDA TECH CO LTD | 7 | 2017–2019 |
| ZHEN DING TECH CO LTD | 7 | 2016–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shenzhen, CN | 14 | 2015–2020 |
| Qinhuangdao, CN | 9 | 2017–2020 |
| Guangdong, CN | 4 | 2018–2019 |
| Hebei, CN | 1 | 2020 |