Method and system for fabricating high junction angle read sensors

FIG. 1 depicts an air-bearing surface (ABS) view of a conventional read apparatus used in magnetic recording technology applications. The conventional read apparatus 10 includes shields 12 and 18 , insulator 14 , magnetic bias structures 16 , and sensor 20 . The read sensor 20 is typically a giant magnetoresistive (GMR) sensor or tunneling magnetoresistive (TMR) sensor. The read sensor 20 includes an antiferromagnetic (AFM) layer 22 , a pinned layer 24 , a nonmagnetic spacer layer 26 , and a free layer 28 . Also shown is a capping layer 30 . In addition, seed layer(s) may be used. The free layer 28 has a magnetization sensitive to an external magnetic field. Thus, the free layer 28 functions as a sensor layer for the magnetoresistive sensor 20 . The read sensor 20 typically has its top narrower than its bottom. Thus, the read sensor 20 has junction angle, a. The junction angle is typically fifty degrees, plus or minus fifteen degrees. The lower junction angles are desirable to reduce or prevent damage to the tunneling barrier layer 26 during fabrication and to account for redeposition that occurs during fabrication. The magnetic bias structures 16 are used to magnetically bias the free layer 28 .

Although the conventional apparatus 10 functions, there are drawbacks. The trend in magnetic recording is to higher areal density recording. A lower track width (TW) is desired for such higher areal densities. In addition, a reduced shield-to-shield spacing (SS) is desired for higher density recording. However, at smaller track widths, the performance of the read sensor 20 may be adversely affected. For example, the volumes of the AFM layer 22 , pinned layer 24 and free layer 28 are reduced at narrow track widths. The free layer 28 reduction in volume is exacerbated by the free layer 28 being narrower than remaining magnetic layers. Thus, the stability of the read sensor 20 and ability of the free layer 28 to function as a sensor layer are impaired. Because a narrow shield-to-shield spacing is also desired and because of the nature of the read sensor 20 , the thickness of the layers 22 , 24 and 28 may be desired to remain thin.

Accordingly, what is needed is a system and method for improving the performance of a magnetic recording read apparatus, particularly at higher areal densities.

FIG. 1 depicts an ABS view of a conventional magnetic recording read apparatus.

FIG. 2 is a flow chart depicting an exemplary embodiment of a method for fabricating a magnetic read apparatus having read sensor with a high junction angle.

FIG. 3 is a flow chart depicting an exemplary embodiment of a method for fabricating a read sensor with a high junction angle.

FIGS. 4-8 depict an exemplary embodiment of a portion of a magnetic recording read apparatus during fabrication.

FIG. 9 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.

FIG. 10 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.

FIG. 11 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.

FIG. 12 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.

FIG. 13 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.

While the various embodiments disclosed are applicable to a variety of data storage devices such as magnetic recording disk drives, solid-state hybrid disk drives, networked storage systems etc., for the sake of illustration the description below will use disk drives as examples.

FIG. 2 is an exemplary embodiment of a method 100 for providing a read apparatus. More specifically, the method 100 is used in providing a read sensor. For simplicity, some steps may be omitted, interleaved, combined, have multiple substeps and/or performed in another order unless otherwise specified. Although described in the context of a single magnetic read apparatus, multiple magnetic read apparatuses may be fabricated at substantially the same time. The method 100 may also be used to fabricate other magnetic recording apparatuses. The method 100 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 100 is described in the context of a disk drive. However, the method may be used in other magnetic storage devices. The method is also described in the context of particular magnetic junctions. In other embodiments, other magnetic junctions may be formed. The method 100 also may start after formation of other portions of the magnetic read apparatus. For example, the method 100 may start after the bottom shield is fabricated.

The layers to form a read sensor stack are deposited, via step 102 . The layers deposited in step 102 depend upon the type of read sensor being formed. For example, step 102 may include depositing a reference layer, depositing a nonmagnetic layer on the reference layer and depositing a free layer on the nonmagnetic layer. The nonmagnetic layer may be a tunneling barrier layer or a conductive layer. The reference layer has its magnetic moment fixed, or pinned in a particular direction. In some embodiments, step 102 also includes depositing a pinning layer, such as an antiferromagnetic layer, adjoining the reference layer. Thus, the layers for a magnetic tunneling junction (MTJ) or spin valve may be deposited in step 102 . In another embodiment, step 102 may include depositing a first free layer, depositing a nonmagnetic layer on the first free layer and depositing a second free layer on the nonmagnetic layer. Thus, a dual free layer magnetic junction may also be fabricated using the method 100 . In other embodiments, other and/or additional layers may be deposited for the magnetic junctions being formed.

The read sensor is then defined using steps 104 and 106 . The read sensor could be defined in the track width direction in steps 104 and 106 or in the stripe height direction. The stripe height direction is perpendicular to the ABS. In addition, steps 104 and 106 may define the read sensor such that the read sensor has sides that form junction angles with respect to a bottom of the read sensor. The junction angles are each at least seventy-five degrees and not more than one hundred and five degrees. In some such embodiments, the junction angles may each be at least eighty-five degrees and not more than ninety-five degrees. Junction angles less than ninety degrees may occur for a read sensor having a top smaller than the bottom. Junction angles greater than ninety degrees may occur for a read sensor having a top wider than the bottom. For junction angles described above, the sidewalls need not be straight. For example, for a dual free layer read sensor, the two free layers may be symmetric. In such an embodiment, the middle region of the read sensor may be narrower than the top or the bottom.

A first ion mill on the read sensor stack at a first angle and a first ion mill energy, via step 104 . The first angle is at least five degrees and not more than thirty degrees from a normal to the top surface of the read sensor stack. Thus, the first ion mill is performed relatively close to perpendicular to the surface of the read sensor stack. In some embodiments, the first energy at which the ion mill is performed is relatively high. For example, the ion mill may be performed at a milling energy of at least two hundred electron volts. The first ion mill of step 104 mills through most if not all of the read sensor stack. In some embodiments, enough of the read sensor stack is removed that less than half of the depth of a bottom layer of the read sensor stack remains unmilled. In other embodiments, the read sensor stack may be completely milled through. Thus, the bottom layer of the read sensor stack is milled though in such an embodiment.

A second ion mill is performed at a second angle and a second ion mill energy, via step 106 . The second ion mill energy is less than the first ion mill energy. In contrast, the second angle for the second ion mill is greater than the first angle for the first ion mill. In some embodiments, the second ion mill energy is at least one-fourth of the first ion mill energy and not more than three-fourths of the first ion mill energy. In some embodiments, the second ion mill energy is nominally half of the first ion mill energy. The second angle may be significantly greater than the first angle. For example, in some embodiments the second angle is at least seventy and not more than eighty five degrees from the normal to the top surface. Thus, the second angle is at a glancing angle from the top of the read sensor layers.

In some embodiments, steps 104 and 106 define the read sensor in the track width direction. Thus, the sides of the read sensor that are formed are the sidewalls as viewed from the ABS. In other embodiments, steps 104 and 106 define the read sensor in the stripe height direction. Thus, the back of the read sensor may be formed in steps 104 and 106 . The front/ABS surface of the read sensor is generally formed by lapping. In other embodiments, steps 104 and 106 may define the read sensor in both the stripe height and the track width direction. In such embodiments, steps 104 and 106 might be carried out twice, once for the track width direction and once for the stripe height direction.

An additional ion mill may be performed after step 104 but before step 106 in some embodiments. Such an ion mill may be performed at an energy that is greater than the second energy of step 106 , but may use a larger angle than step 104 . For example, the energy may be substantially the same as used in step 104 but the angle for such an ion mill may be at least sixty-five degrees and not more than eighty-five degrees from normal to the top surface. In other embodiments, this additional ion milling step may be omitted.

Thus, the read sensor may be defined in the stripe height and/or track width directions by steps 104 and 106 . Fabrication of the read apparatus may then be completed, via step 108 . For example, side bias structure(s) may be provided. These side bias structure may be magnetic and are used to magnetically bias the free layer(s). In some embodiments, the side bias structures include side shielding material(s). The side shielding material(s) having at least one of a saturation magnetization exceeding 800 emu/cm 3 and an exchange length of less than five nanometers. In some cases, a rear magnetic bias structure may also be fabricated. A top shield is also generally provided in step 108 . The remainder of the read apparatus, magnetic write apparatus (if any) and data storage device may thus be manufactured.

The method 100 may be used to fabricate a read sensor having substantially vertical sides in the track width and/or stripe height direction. The read sensor may also have a small track width. For example, the track width may be as low as five nanometers or less. Because the sidewalls have large junction angles, the free layer volume may be increased at lower track widths. Thus, the magnetic behavior of the read sensor may be closer to that desired. In addition, steps 104 and 106 , particularly step 106 may be used to remove redeposition and/or damaged regions from the sides of the magnetic junction being formed. Because of the lower energy used, this removal can be achieved without causing additional damage to the read sensor. As a result, a read sensor having large junction angles and improved performance may be reliably fabricated.

FIG. 3 is another exemplary embodiment of a method 110 for defining a read sensor in a magnetic read apparatus. For simplicity, some steps may be omitted, interleaved, combined, have multiple substeps and/or performed in another order unless otherwise specified. FIGS. 4-8 depict an exemplary embodiment of a magnetic read apparatus 200 during fabrication using the method 110 . For clarity FIGS. 4-8 are not to scale. FIGS. 4-8 may also be either all ABS location views (views as seen from the plane that will become the ABS) or apex views. If FIGS. 4-8 are considered ABS location views, the method 110 defines the read sensor in the track width direction. If FIGS. 4-8 are considered to be apex views, the read sensor is defined in the stripe height direction using the method 110 . Although described in the context of the magnetic read apparatus 200 , the method 110 may be used in fabricating other read sensors. Referring to FIGS. 4-8 , the method 110 is described in the context of providing a single read apparatus 200 for a magnetic recording disk drive. The method 110 may be used to fabricate multiple magnetic readers at substantially the same time. The method 110 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 110 also may start after formation of other portions of the magnetic read apparatus. For example, the method 110 may start after the shield and layers for the read sensor stack have been deposited.

The read sensor stack is milled at a first angle and a first ion mill energy, via step 112 . FIG. 4 depicts the read apparatus 200 before step 112 starts. Thus, a shield 202 and read sensor stack 210 is shown. Also depicted is mask 204 used to define the read sensor. The read sensor stack 210 may include multiple layers. For example, the layers for a magnetic tunneling junction, spin valve, dual free layer sensor or other read sensor may be present in the read sensor stack 210 . FIG. 5 depicts the read apparatus 200 during step 112 . The direction of the ions used in the first ion mill are shown by arrows. The ion mill of step 112 is performed at a first angle, α 1 . The first angle is at least five degrees and not more than thirty degrees from a normal to the top surface of the read sensor stack. In some embodiments, the first angle is not more than twenty degrees from normal to the surface. In some embodiments, the first ion mill energy at which may be performed at a milling energy of at least two hundred electron volts. In other embodiments, other energies may be used. The first ion mill of step 112 mills through most if not all of the read sensor stack 210 . Thus, as can be seen in FIG. 5 , the read sensor 210 has been mostly milled through. The dashed line in the read sensor stack 210 of FIG. 5 indicates the top surface of the bottom layer in the read sensor stack 210 . Thus, less than half of the depth of the bottom layer of the read sensor stack 210 is unmilled. Although not shown in FIG. 5 , the read sensor stack 210 may be completely milled through. Also shown in FIG. 5 is redeposition 212 . The redeposition 212 resides at least on the mask 204 used in defining the read sensor.

A second, intermediate ion mill is performed, via step 114 . Such an ion mill may be performed at an energy that is not more than the first ion mill energy of step 112 , but may use a larger angle than step 112 . For example, the second ion mill energy may be substantially the same as used in step 112 . In other embodiments, the second energy is less than that used in the first ion mill. FIG. 6 depicts the read apparatus 200 during step 114 . The direction of the ions used in the second ion mill are shown by arrows. As can be seen in FIG. 6 , the second ion mill is performed at a second angle α 2 from the normal to the top surface of the read sensor stack 210 . The second angle is significantly larger than the first angle. In the embodiment shown, the second angle is at least sixty-five degrees and not more than eighty-five degrees from normal to the top surface. In other embodiments, this second angle may be at least seventy-five degrees. Thus, as can be seen in FIG. 6 , the redeposition 212 has been removed. However, a damage/redeposition layer 214 has been formed on the sides of the sensor stack 210 .

A third ion mill is performed at a third angle and a third ion mill energy, via step 116 . The third ion mill energy is less than the first ion mill energy and less than the second ion mill energy. In some embodiments, the third ion mill energy is at least one-fourth of the first ion mill energy and not more than three-fourths of the first ion mill energy. In some embodiments, the third ion mill energy is nominally half of the first ion mill energy. FIG. 7 depicts the read apparatus 200 during step 116 . The direction of the ions used in the third ion mill are shown by arrows. Thus, the ion mill is at a third angle, α 3 . The third angle for this ion mill is greater than the first angle for the first ion mill. In some embodiments the third angle is at least seventy and not more than eighty five degrees from the normal to the top surface of the read sensor stack. Because of the angle and energy used in step 116 , the damage layer 214 has been removed. Additional damage due to the third ion mill is minimal or nonexistent because of the low energy and high angle used. Further, the read sensor 210 has been defined. The sides of the read sensor 210 form junction angles θ 1 and θ 2 with the bottom. In some embodiments, θ 1 and θ 2 are substantially equal. Further, the junction angles are close to ninety degrees. In some embodiments, the junction angles are each at least seventy-five degrees and not more than one hundred and five degrees. In some such embodiments, the junction angles may each be at least eighty-five degrees and not more than ninety-five degrees.

FIG. 8 depicts the read apparatus after conclusion of the method 110 . In addition, additional structures are shown. The read apparatus 200 includes the read sensor 210 having junction angles θ 1 and θ 2 , side layers 220 , top shield 230 and optional insulating layers 232 . Other structures (not shown) such as capping and/or seed layers, additional sensors, and/or leads might be included. If FIG. 8 shows an ABS view, the side layers 220 might be side magnetic bias structures. If FIG. 8 is an apex view (e.g. prior to lapping), then the side layers 220 may be nonmagnetic insulating refill layers and/or rear bias structures.

Thus, the read sensor 210 may be defined in the stripe height and/or track width directions using the method 110 . The read sensor 210 has substantially vertical sides in the track width and/or stripe height direction. The read sensor may also have a small track width. For example, the track width may be as low as five nanometers or less. Because the sidewalls have large junction angles, θ 1 and θ 2 , the free layer volume may be increased at lower track widths. Thus, the magnetic behavior of the read sensor 210 may be closer to that desired. In addition, the method 110 removes redeposition and/or damaged regions from the sides of the read sensor 210 being formed. Because of the lower energy used, this can be achieved without causing additional damage to the read sensor 210 . As a result, a read sensor 210 having improved performance may be achieved.

FIG. 9 depicts an ABS view of an exemplary embodiment of a portion of a magnetic read apparatus 300 . For clarity, FIG. 9 is not to scale. The read apparatus 300 may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 300 may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 300 may be part of another data storage device. Further, only a portion of the components of the read apparatus 300 are depicted. The view shown in FIG. 9 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. Thus, the read apparatus 300 may be analogous to the read apparatus 200 .

The read apparatus 300 includes shields 302 and 304 , read sensor 310 , capping layer 318 and soft magnetic bias structures 320 . The shield-to-shield spacing is SS, while the track width is TW. The shields 302 and 304 are shown as monolithic shields, which include only a single layer. However, other structures are possible for the shields 302 and 304 .

The read sensor 310 may include multiple layers. For example, the layers for a magnetic tunneling junction, spin valve, dual free layer sensor or other read sensor may be present in the read sensor stack 310 . The read sensor 310 has a bottom in proximity to (and shown as adjoining) the shield 302 , a top in proximity to (and shown as adjoining) the capping layer 318 or shield 304 and sides. The sides form junction angles θ 1 and θ 2 with the bottom of the read sensor 310 . The junction angles are each at least seventy-five degrees and not more than one hundred and five degrees. In some embodiments, the junction angles are each at least eighty-five degrees and not more than ninety-five degrees. In the embodiment depicted in FIG. 9 , the junction angles are less than ninety degrees. This configuration results in the top of the read sensor 310 being narrower than the bottom in the cross-track direction. However, larger junction angles are possible. For junction angle(s) of ninety degree, the sides of the read sensor 310 are substantially vertical. Thus, the top of the read sensor 310 may have the same width as the bottom of the read sensor 310 . In other embodiments, in which the junction angle(s) are greater than ninety degrees, the top of the read sensor 310 may be wider than the bottom of the read sensor 310 in the cross-track direction. For junction angles described above, the sidewalls need not be straight. For example, for a dual free layer read sensor, the two free layers may be symmetric. In such an embodiment, the middle region of the read sensor may be narrower than the top or the bottom.

Also shown are side magnetic bias structures 320 and nonmagnetic layers 306 . The nonmagnetic layers 306 may be insulating if current is driven through the read sensor 310 perpendicular to plane (in the down track direction). The magnetic bias structures 320 include a side shielding material that has a saturation magnetization and an exchange length. In some embodiments, the saturation magnetization of the side shielding material is greater than 800 emu/cm 3 . In other embodiments, the exchange length of the side shielding material is less than five nanometers. In some embodiments, both the saturation magnetization of the side shielding material is greater than 800 emu/cm 3 and the exchange length of the side shielding material is less than five nanometers. This may be achieved by selection of side shielding materials. For example, nanomagnets such as small clusters of Co or Fe particles in an insulating or oxide matrix, such as Hf oxide, may have the reduced exchange length described above. Other materials such as Co, Fe, a CoFe alloy such as Co 90 Fe 10 and/or NiFeX, where X is a material such as Cr and/or Ta, may also be used. Other materials having the saturation magnetization and exchange length described above may also be used.

The side magnetic bias structures 320 may consist of only the side shielding material. In some such embodiments, multiple different side shielding materials having the saturation magnetization greater than 800 emu/cm 3 and/or the exchange length less than five nanometers may be used. In other embodiments, the side shielding material may be incorporated in another manner. For example, the side magnetic bias structures 320 may include one or more layers of the side shielding material as well as other magnetic or nonmagnetic layers. In such embodiments, the layers of side shielding materials may be ferromagnetically or antiferromagnetically aligned.

The magnetic read apparatus 300 may have improved performance. The large junction angles θ 1 and θ 2 may allow for improved performance of the read sensor 310 . For example, stability and/or other magnetic properties may be improved. Further, the high junction angle read sensor 310 may be reliably fabricated using the method 100 and/or 110 . The side magnetic bias structures 320 may also provide improved side shielding. In particular, the combination of the (nearly) vertical sidewalls of the read sensor 310 and the side shielding material discussed above may improve the cross-track resolution. It is noted that the side shielding material described above has a lower exchange length and larger magnetization than is typically selected for side shields. Thus, the improvement in the cross-track resolution for the magnetic read apparatus 300 may be considered surprising.

FIG. 10 depicts an ABS view of an exemplary embodiment of a read apparatus 300 ′. For clarity, FIG. 10 is not to scale. The read apparatus 300 ′ may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 300 ′ may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 300 ′ may be part of another data storage device. Further, only a portion of the components of the read apparatus 300 ′ are depicted. The view shown in FIG. 10 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. The head of which the read apparatus 300 ′ is a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read apparatus 300 ′ corresponds to the read apparatus 300 . Consequently, analogous components are labeled similarly. The read apparatus 300 ′ includes shields 302 and 304 , read sensor 310 , capping layer 318 , nonmagnetic layer 306 and soft magnetic bias structures 320 ′ that are analogous to the shields 302 and 304 , read sensor 310 , capping layer 318 , nonmagnetic layer 306 and soft magnetic bias structures 320 , respectively.

The magnetic bias structures 320 ′ include magnetic bias layers 330 and 350 and nonmagnetic layer 340 . In some embodiments, the magnetic moments of the magnetic bias layers 330 and 350 are antiferromagnetically aligned. In other embodiments, the magnetic moments of the magnetic bias layers 330 and 350 are ferromagnetically aligned. One or both of the magnetic bias layers 330 and 350 include the side shielding material that has the saturation magnetization greater than 800 emu/cm 3 and/or the exchange length less than five nanometers. The side shielding material(s) may be selected from the material(s) described above. In some embodiments, only the magnetic layers 330 are formed of the side shielding material(s). In other embodiments, only the magnetic layers 350 are formed of the side shielding material(s). In still other embodiments both of the magnetic layers 330 and 350 include the side shielding material(s).

The magnetic read apparatus 300 ′ may have improved performance analogous to that of the magnetic read apparatus 200 and/or 300 . The large junction angles θ 1 and θ 2 may allow for improved performance of the read sensor 310 . Further, the high junction angle read sensor 310 may be reliably fabricated using the method 100 and/or 110 . The side magnetic bias structures 320 ′, particularly in combination with the large junction angle read sensor 310 , may also provide improved side shielding. The side shielding material described above has a lower exchange length and larger magnetization than is typically selected for side shields. Thus, the improvement in the cross-track resolution for the magnetic read apparatus 300 ′ may be considered surprising.

FIG. 11 depicts an ABS view of an exemplary embodiment of a read apparatus 300 ″. For clarity, FIG. 11 is not to scale. The read apparatus 300 ″ may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 300 ″ may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 300 ″ may be part of another data storage device. Further, only a portion of the components of the read apparatus 300 ″ are depicted. The view shown in FIG. 11 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. The head of which the read apparatus 300 ″ is a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read apparatus 300 ″ corresponds to the read apparatus 300 and/or 300 ′. Consequently, analogous components are labeled similarly. The read apparatus 300 ″ includes shields 302 and 304 , read sensor 310 , capping layer 318 , nonmagnetic layer 306 and soft magnetic bias structures 320 ″ that are analogous to the shields 302 and 304 , read sensor 310 , capping layer 318 , nonmagnetic layer 306 and soft magnetic bias structures 320 / 320 ′, respectively.

The magnetic bias structures 320 ″ include magnetic bias layers 330 ′ and 350 ′. In the embodiment shown, the magnetic bias layers 330 ′ and 350 ′ adjoin (share an interface). However, in alternate embodiments, a nonmagnetic layer analogous to the nonmagnetic layer 340 may be included. In some embodiments, the magnetic moments of the magnetic bias layers 330 ′ and 350 ′ are ferromagnetically aligned. One or both of the magnetic bias layers 330 ′ and 350 ′ include the side shielding material that has the saturation magnetization greater than 800 emu/cm 3 and/or the exchange length less than five nanometers. The side shielding material(s) may be selected from the material(s) described above. In some embodiments, only the magnetic layers 330 ′ are formed of the side shielding material(s). Because a portion of the magnetic bias layers 330 ′ are closer to the read sensor 310 than the magnetic bias layers 350 ′, it may be preferred to use the above-described side shielding materials in at least the magnetic bias layer 330 ′. In other embodiments, only the magnetic layers 350 ′ are formed of the side shielding material(s). In still other embodiments both of the magnetic layers 330 ′ and 350 ′ include the side shielding material(s).

The magnetic read apparatus 300 ″ may have improved performance analogous to that of the magnetic read apparatus 200 , 300 and/or 300 ′. The large junction angles θ 1 and θ 2 may allow for improved performance of the read sensor 310 . Further, the high junction angle read sensor 310 may be reliably fabricated using the method 100 and/or 110 . The side magnetic bias structures 320 ″, particularly in combination with the large junction angle read sensor 310 , may also provide improved side shielding. The side shielding material described above has a lower exchange length and larger magnetization than is typically selected for side shields. Thus, the improvement in the cross-track resolution for the magnetic read apparatus 300 ″ may be considered surprising.

FIG. 12 depicts an ABS view of an exemplary embodiment of a read apparatus 400 . For clarity, FIG. 12 is not to scale. The read apparatus 400 may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 400 may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 400 may be part of another data storage device. Further, only a portion of the components of the read apparatus 400 are depicted. The view shown in FIG. 12 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. The head of which the read apparatus 400 is a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read apparatus 400 may correspond to the read apparatuses 200 , 300 , 300 ′ and/or 300 ″. Consequently, analogous components are labeled similarly. The read apparatus 400 includes shields 402 and 404 , read sensor 410 , capping layer 418 , nonmagnetic layer 406 and magnetic bias structures 420 that are analogous to the shields 302 and 304 , read sensor 310 , capping layer 318 , nonmagnetic layer 306 and soft magnetic bias structures 320 / 320 ′/ 320 ″, respectively.

The magnetic bias structures 420 may be monolithic, as shown in FIG. 12 . Alternatively, the magnetic bias structures 420 or may include multiple layers, for example as shown in FIGS. 10 and 11 . The magnetic read apparatus 400 also includes sensor 410 . In the embodiment shown, the read sensor 410 includes an antiferromagnetic (AFM) layer 411 , a reference layer 412 adjoining the AFM layer 411 , a nonmagnetic spacer layer 414 and a free layer 416 . The nonmagnetic spacer layer 414 may be a tunneling barrier layer, a conductive nonmagnetic layer or another analogous layer. The free layer 416 and reference layer 412 are magnetic and may include one or more sublayers. Similarly, the AFM layer 411 may be a multilayer or a single layer.

The magnetic read apparatus 400 may have improved performance analogous to that of the magnetic read apparatus 200 , 300 , 300 ′ and/or 300 ″. The large junction angles θ 1 and θ 2 may allow for improved performance of the read sensor 410 . For example, the free layer 416 may have a larger volume and an attendant improvement in magnetic properties. The high junction angle read sensor 410 may be reliably fabricated using the method 100 and/or 110 . The side magnetic bias structures 420 , particularly in combination with the large junction angle read sensor 410 , may also provide improved side shielding for the reasons discussed above. Thus, performance of the read apparatus 400 may be enhanced.

FIG. 13 depicts an ABS view of an exemplary embodiment of a read apparatus 400 ′. For clarity, FIG. 13 is not to scale. The read apparatus 400 ′ may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 400 ′ may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 400 ′ may be part of another data storage device. Further, only a portion of the components of the read apparatus 400 ′ are depicted. The view shown in FIG. 13 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. The head of which the read apparatus 400 ′ is a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read apparatus 400 ′ may correspond to the read apparatuses 200 , 300 , 300 ′, 300 ″ and/or 400 . Consequently, analogous components are labeled similarly. The read apparatus 400 ′ includes shields 402 and 404 , read sensor 410 ′, capping layer 418 , nonmagnetic layer 406 and magnetic bias structures 420 that are analogous to the shields 402 and 404 , read sensor 410 , capping layer 418 , nonmagnetic layer 406 and soft magnetic bias structures 420 , respectively.

The magnetic bias structures 420 may be monolithic, as shown in FIG. 13 . Alternatively, the magnetic bias structures 420 or may include multiple layers, for example as shown in FIGS. 10 and 11 . The magnetic read apparatus 400 ′ also includes sensor 410 ′. In the embodiment shown, the read sensor 410 ′ is a dual free layer read sensor. Thus, the read sensor 410 ′ includes a first free layer 416 A, a nonmagnetic spacer layer 414 and a second free layer 416 B. The nonmagnetic spacer layer 414 may be a tunneling barrier layer, a conductive nonmagnetic layer or another analogous layer. The free layers 416 A and 416 B are magnetic and may include one or more sublayers. The magnetic layers 416 A and 416 B may be desired to be biased in a scissor mode. Thus, the magnetic read apparatus 400 ′ may include a rear magnetic bias structure (not shown in FIG. 13 ). In such an embodiment, the read sensor 410 ′ is between the rear bias structure and the ABS. Although depicted as straight, the sidewalls for the read sensor 410 ′ need not be. For example, the two free layers 416 A and 416 B may be symmetric. In such an embodiment, the middle region of the read sensor 410 ′ may be narrower than the top or the bottom.

The magnetic read apparatus 400 ′ may have improved performance analogous to that of the magnetic read apparatus 200 , 300 , 300 ′, 300 ″ and/or 400 . The large junction angles θ 1 and θ 2 may allow for improved performance of the read sensor 410 ′. For example, the free layers 416 A and 416 B may have a larger volume and an attendant improvement in magnetic properties. The high junction angle read sensor 410 ′ may be reliably fabricated using the method 100 and/or 110 . The side magnetic bias structures 420 , particularly in combination with the large junction angle read sensor 410 ′, may also provide improved side shielding for the reasons discussed above. Thus, performance of the read apparatus 400 ′ may be enhanced.

Using the methods 100 and/or 110 , the apparatuses 200 , 300 , 300 ′, 300 ″, 400 and/or 400 ′ may be fabricated. Thus, the benefits of one or more of the apparatuses 200 , 300 , 300 ′, 300 ″, 400 , and/or 400 ′ may be achieved. In particular, the formation of the read sensors and the configuration of the magnetic bias structures may improve reading and side shielding. The benefits of the methods 100 and 110 and one or more of the read apparatuses 200 , 300 , 300 ′, 300 ″, 400 and/or 400 ′ may be attained.