Modular power conversion semiconductor device

The present invention relates to a semiconductor device having a modular structure in which a converter and an inverter are integrally included.

Description of the Background Art

As disclosed in, for example, International Publication No. WO 98/10508 (FIG. 15), a semiconductor device has a molecular structure described as follows. The semiconductor device includes a metal substrate, a plurality of wires that are fixed to the metal substrate with an insulating layer therebetween, and power circuitry that is electrically connected to the plurality of wires. The power circuitry includes a plurality of circuit portions (such as a converter circuit portion) that are electrically connected between the plurality of wires. The circuit portions include a plurality of external terminals for external connection that are integral therewith and are bonded to the plurality of wires.

The traditional semiconductor device disclosed in International Publication No. WO 98/10508 (FIG. 15) includes, as the external terminals thereof, AC input terminals R, S, and T and converter output terminals P1 and N of the converter circuit portion. The converter input terminals R, S, and T and the converter output terminals P1 and N are located on the surfaces that face each other with the package therebetween.

In the configuration of the traditional semiconductor device described above, the output terminals P and N of the converter are required to be located on the same surface (on one surface) so as to have the shorter wiring for connection with the external capacitor. The AC input terminals R, S, and T of the converter are required to be located on the same surface (on another surface facing the one surface) on ground of the arrangement of, for example, a noise filter. Consequently, the substrate pattern wiring for the entire circuitry including such semiconductor device is limited. Thus, the substrate has unfortunately been difficult to design flexibly.

The present invention has an object to provide a semiconductor device integrally including a converter and an inverter to facilitate formation of wiring for external connection.

A semiconductor device according to the present invention has a rectangular shape in plan view and integrally includes a converter and an inverter in a sealing resin. The semiconductor device includes a plurality of converter output terminals, a plurality of converter input terminals, and an adjacent external terminal.

The plurality of converter output terminals are terminals for external connection that are electrically connected to the converter and are located on one side of the semiconductor device in plan view. The plurality of converter input terminals are terminals for external connection that are electrically connected to the converter and are located on another side facing the one side in plan view. The adjacent external terminal is a terminal for external connection that is located adjacent to the plurality of converter output terminals on the one side.

The plurality of converter output terminals and the adjacent external terminal are categorized as a first terminal group and the plurality of converter input terminals are categorized as a second terminal group. The first and second terminal groups include an equal number of terminals. The semiconductor device has a terminal group pitch setting in which each of first distances between two terminals in the first terminal group that are adjacent to each other is set to be equal to each of second distances between two terminals in the second terminal group that are adjacent to each other.

The semiconductor device according to the present invention has the terminal group pitch setting described above. Thus, only the internal layout of the converter is mainly changed, to thereby selectively manufacture a first-type semiconductor device and a second-type semiconductor device that have opposite positional relations between the first and second terminal groups on the one side and the other side.

Therefore, one of the first-type and second-type semiconductor devices that facilitates formation of the wiring for electrical connection with, for example, external elements can be selected as appropriate. This is effective in forming, with relative ease, the entire circuitry including the semiconductor device according to the present invention.

These and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

FIG. 1 is a diagram describing a configuration of a composite module according to a first preferred embodiment of the present invention;

FIG. 2 is a diagram describing a configuration of the composite module that is a first-type composite module;

FIG. 3 is a diagram describing a configuration of the composite module that is a second-type composite module;

FIG. 4 is a diagram describing a configuration of the composite module according to a second preferred embodiment of the present invention;

FIG. 5 is a circuit diagram illustrating equivalent circuits in a converter, an inverter, and a brake shown in FIG. 4 ;

FIG. 6 is a diagram describing a configuration of the composite module according to a third preferred embodiment of the present invention;

FIG. 7 is a diagram describing a configuration of the composite module according to a fourth preferred embodiment of the present invention; and

FIG. 8 is a diagram schematically describing a configuration example of an internal layout of the composite module according to the fourth preferred embodiment.

First Preferred Embodiment

FIG. 1 is a diagram describing a configuration of a composite module 1 according to a first preferred embodiment of the present invention. The composite module 1 according to the first preferred embodiment is a semiconductor device that has a rectangular shape in plan view and integrally includes a converter 10 and an inverter 20 in a sealing resin.

As shown in FIG. 1 , converter output terminals 8 P and 8 N (P 1 and N 1 ) for external connection of the converter 10 are located adjacent to each other on a first side (the upper part in FIG. 1 ). An external terminal 18 (adjacent external terminal) for external connection of the composite module 1 is located adjacent to the converter output terminal 8 N. The external terminal 18 may be provided for the converter 10 , for the inverter 20 , or for both the converter 10 and the inverter 20 .

AC input terminals 7 R, 7 S, and 7 T (R, S, and T) that are the converter input terminals for external connection of the converter 10 are located on a second side (the lower part in FIG. 1 , the side facing the first side).

The plurality of converter output terminals including the converter output terminals 8 P and 8 N and the external terminal 18 are categorized as a first terminal group located on the first side of the composite module 1 and the plurality of converter input terminals including the AC input terminals 7 R, 7 S and 7 T are categorized as a second terminal group located on the second side of the composite module 1 . The number of terminals included in each of the first and second terminal groups is “3.”

The composite module 1 according to the first preferred embodiment has a terminal group pitch setting in which each of formation pitches d 1 (first distances) between two terminals in the first terminal group that are adjacent to each other is set to be equal to each of formation pitches d 2 (second distances) between two terminals in the second terminal group that are adjacent to each other.

Thus, each of the distances between the converter output terminals 8 P and 8 N and between the converter output terminal 8 N and the external terminal 18 is set to the formation pitch d 1 . Each of the distances between the AC input terminals 7 R and 7 S and between the AC input terminals 7 S and 7 T is set to the formation pitch d 2 . The formation pitch d 1 is set to be equal to the formation pitch 2 (d 1 =d 2 ).

FIG. 2 is a diagram describing a configuration of a composite module 1 A that is a first-type composite module. The composite module 1 A is a first aspect of the composite module 1 . As shown in FIG. 2 , the converter 10 and the inverter 20 have, similarly to the composite module 1 shown in FIG. 1 , the composite positional relation in which the converter 10 is located on the left side in plan view. The converter output terminals 8 P and 8 N and the external terminal 18 are located on the first side (the upper side in FIG. 2 ) and the AC input terminals 7 R, 7 S, and 7 T are located on the second side (the lower side in FIG. 2 ). In this case, the composite module 1 A has the terminal group pitch setting described above.

FIG. 3 is a diagram describing a configuration of a composite module 1 B that is a second-type composite module. The composite module 1 B is a second aspect of the composite module 1 . As shown in FIG. 3 , the converter 10 and the inverter 20 that are similar to those in FIG. 2 have the composite positional relation. The AC input terminals 7 R, 7 S, and 7 T are located on the first side (the upper side in FIG. 3 ) and the converter output terminals 8 P and 8 N and the external terminal 18 (adjacent external terminal) are located on the second side (the lower side in FIG. 3 ).

The composite module 1 has the terminal group pitch setting described above. Thus, only the internal layout of the converter 10 is mainly changed, to thereby selectively manufacture the composite module 1 A and the composite module 1 B that have opposite positional relations between the first and second terminal groups on one side and another side.

Therefore, the composite modules 1 A and 1 B can be selectively formed as the composite module 1 with relative ease. Thus, depending on the usage pattern of the composite module 1 , one of the composite modules 1 A and 1 B is selected as appropriate, providing the composite module 1 having a terminal configuration that facilitates formation of the wiring pattern for each substrate structure, such as the arrangement of a P-N capacitor to be located between the converter output terminals 8 P and 8 N and the arrangement of an input filter for the AC input terminals 7 R, 7 S and 7 T.

As described above, one of the composite module 1 A and the composite module 1 B can be selected as appropriate, providing the composite module 1 in which the wiring for electrical connection with, for example, external elements is easily formed for external connection. This is effective in forming the entire circuitry including the composite module 1 (the composite module 1 A or the composite module 1 B) according to this preferred embodiment with relative ease.

Second Preferred Embodiment

FIG. 4 is a diagram describing a configuration of a composite module 2 according to a second preferred embodiment of the present invention. As shown in FIG. 4 , the composite module 2 integrally includes, in addition to the converter 10 and the inverter 20 , a brake 30 embedded in the sealing resin. The configuration except for the brake 30 is similar to that of the composite module 1 according to the first preferred embodiment shown in FIGS. 1 to 3 .

FIG. 5 is a circuit diagram illustrating equivalent circuits in the converter 10 , the inverter 20 , and the brake 30 shown in FIG. 4 .

As shown in FIG. 5 , the converter 10 includes diodes D 1 , D 2 , and D 3 and diodes D 4 , D 5 , and D 6 located between the converter output terminals 8 P and 8 N. More particularly, the cathodes of the respective diodes D 1 , D 2 , and D 3 are connected in common to the converter output terminal 8 P, the anodes of the diodes D 1 , D 2 , and D 3 are electrically connected to the cathodes of the diodes D 4 , D 5 , and D 6 , and the anodes of the respective diodes D 4 , D 5 , and D 6 are connected in common to the converter output terminal 8 N. The AC input terminals 7 R, 7 S, and 7 T are located at the intermediate connection points between the anodes of the diodes D 1 , D 2 , and D 3 and the cathodes of the diodes D 4 , D 5 , and D 6 . Alternating current signals of the R phase, the S phase, and the T phase are input to the AC input terminals 7 R, 7 S, and 7 T.

The inverter 20 includes three arm portions being a U-phase circuit 5 U, a V-phase circuit 5 V, and a W-phase circuit 5 W, each forming a unit inverter.

The U-phase circuit 5 U includes IGBTs 11 and 21 and diodes D 11 and D 21 . The V-phase circuit 5 V includes IGBTs 12 and 22 and diodes D 12 and D 22 . The W-phase circuit 5 W includes IGBTs 13 and 23 and diodes D 13 to D 23 .

In the U-phase circuit 5 U, the IGBTs 11 and 21 are connected in series. The diodes D 11 and D 21 having anodes on the emitter side are located between the collector and the emitter of the IGBT 11 and between the collector and the emitter of the IGBT 21 , respectively. In the V-phase circuit 5 V, the IGBTs 12 and 22 are connected in series. The diodes D 12 and D 22 having anodes on the emitter side are located between the collector and the emitter of the IGBT 12 and between the collector and the emitter of the IGBT 22 , respectively. In the W-phase circuit 5 W, the IGBTs 13 and 23 are connected in series. The diodes D 13 and D 23 having anodes on the emitter side are located between the collector and the emitter of the IGBT 13 and between the collector and the emitter of the IGBT 23 , respectively.

Nodes N 11 , N 12 , and N 13 are connected in common to a DC bus terminal 9 P. The node N 11 is the connection point of the collector of the IGBT 11 and the cathode of the diode D 11 in the U-phase circuit 5 U. The node N 12 is the connection point of the collector of the IGBT 12 and the cathode of the diode D 12 in the V-phase circuit 5 V. The node N 13 is the connection point of the collector of the IGBT 13 and the cathode of the diode D 13 in the W-phase circuit 5 W.

Nodes N 21 , N 22 , and N 23 are connected in common to an IGBT emitter terminal 9 N of the brake 30 . The node N 21 is the connection point of the emitter of the IGBT 21 and the anode of the diode D 21 in the U-phase circuit 5 U. The node N 22 is the connection point of the emitter of the IGBT 22 and the anode of the diode D 22 in the V-phase circuit 5 V. The node N 23 is the connection point of the emitter of the IGBT 23 and the anode of the diode D 23 in the W-phase circuit 5 W.

Nodes N 31 , N 32 , and N 33 are connected to intermediate terminals 31 , 32 , and 33 , respectively. The node N 31 is the connection point of the emitter of the IGBT 11 (the anode of the diode D 11 ) and the collector of the IGBT 21 (the cathode of the diode D 21 ) in the U-phase circuit 5 U. The node N 32 is the connection point of the emitter of the IGBT 12 and the collector of the IGBT 22 in the V-phase circuit 5 V. The node N 33 is the connection point of the emitter of the IGBT 13 and the collector of the IGBT 23 in the W-phase circuit 5 W. The intermediate terminals 31 , 32 , and 33 are provided for the U-phase, the V-phase, and the R-phase, respectively.

In the brake 30 , an IGBT 40 has the emitter (electrode) connected to the IGBT emitter terminal 9 N and the collector (electrode) connected to the anode of a diode D 41 and to an IGBT collector terminal 9 B. The cathode of the diode D 41 is connected to the DC bus terminal 9 P.

ICs 51 , 52 , and 53 input control signals to the gates of the IGBTs 11 , 12 , and 13 , respectively. ICs 61 , 62 , and 63 input control signals to the gates of the IGBTs 21 , 22 , and 23 , respectively. IC 71 inputs control signals to the gate of the IGBT 40 .

Referring back to FIG. 4 , the composite module 2 according to the second preferred embodiment has the terminal group pitch setting similarly to the composite module 1 according to the first preferred embodiment. Thus, the composite modules 2 of the first type and the second type (corresponding to the composite module 1 A and 1 B) that have opposite positional relations between the first and second terminal groups on the one side and the other side can be selectively provided with relative ease, producing the effect similar to that of the first preferred embodiment.

In addition, the composite module 2 according to the second preferred embodiment includes the brake 30 embedded therein. The brake 30 produces the effect of suppressing an increase in voltage caused by the energy generated during regenerative operation of the motor. More particularly, the IGBT 40 is turned on during regenerative operation of the motor, so that the increase in voltage described above can be suppressed.

Third Preferred Embodiment

FIG. 6 is a diagram describing a configuration of a composite module 3 according to a third preferred embodiment of the present invention. As shown in FIG. 6 , similarly to the composite module 2 according to the second preferred embodiment, the composite module 3 integrally includes, in addition to the converter 10 and the inverter 20 , the brake 30 embedded in the sealing resin.

The composite module 3 includes, as the external terminal 18 , the IGBT emitter terminal 9 N that is electrically connected to the emitter of the IGBT 40 . The IGBT emitter terminal 9 N is located adjacent to the converter output terminal 8 N on one main-surface side having the converter output terminals 8 P and 8 N provided thereon. The IGBT emitter terminal 9 N is located, as the external terminal 18 , at the formation pitch d 1 away from the converter output terminal 8 N, thereby being categorized as the first terminal group together with the converter output terminals 8 P and 8 N. The configuration except for the above is similar to that of the composite module 2 according to the second preferred embodiment shown in FIGS. 4 and 5 , and a description thereof is omitted as appropriate.

Similarly to the composite module 1 according to the first preferred embodiment, the composite module 3 according to the third preferred embodiment has the terminal group pitch setting. Therefore, the composite modules 3 of the first type and the second type (corresponding to the composite modules 1 A and 1 B) that have opposite positional relations between the first and second terminal groups on the one side and the other side can be selectively provided with relative ease, producing the effect similar to that of the first preferred embodiment.

In addition, the composite module 3 according to the third preferred embodiment includes the brake 30 embedded in the sealing resin. Similarly to the composite module 2 according to the second preferred embodiment, the brake 30 produces the effect of suppressing an increase in voltage caused by the energy generated during regenerative operation of the motor.

In the composite module 3 according to the third preferred embodiment, the IGBT emitter terminal 9 N categorized as the first terminal group is located adjacent to the converter output terminal 8 N, thereby being electrically connected through the external wiring among the IGBT emitter terminal 9 N and the converter output terminals 8 P and 8 N without crossing other wiring patterns. This facilitates the layout for routing the wiring patterns in the entire circuitry including the composite module 3 , whereby the design load can be reduced.

Moreover, the composite module 3 has the terminal configuration in which the wiring patterns can be easily drawn, reducing the routing distance of the wiring patterns for the substrate design. Consequently, the entire circuitry including the composite module 3 can be miniaturized and the yields can be improved.

Furthermore, the reduction in the routing distance of the wiring patterns suppresses power consumption, whereby energy saving can be achieved.

Fourth Preferred Embodiment

FIG. 7 is a diagram describing a configuration of a composite module 4 according to a fourth preferred embodiment of the present invention. As shown in FIG. 7 , similarly, to the composite module 2 according to the second preferred embodiment, the composite module 4 includes, in addition to the converter 10 and the inverter 20 , the brake 30 embedded in the sealing resin.

Similarly to the composite module 3 according to the third preferred embodiment, the composite module 4 includes, as the external terminal 18 , the IGBT emitter terminal 9 N formed adjacent to the converter output terminal 8 N on the one main-surface side having the converter output terminals 8 P and 8 N provided thereon.

The composite module 4 is electrically connected to the collector of the IGBT 40 . The IGBT collector terminal 9 B and the DC bus terminal 9 P (power source terminal) are adjacently located at a formation pitch d 3 away from each other on another main-surface side having the AC input terminals 7 R, 7 S, and 7 T provided thereon. The IGBT collector terminal 9 B is located adjacent to the AC input terminal 7 T at a formation pitch d 4 away therefrom. The formation pitches d 3 and d 4 may be set to be equal to or different from the formation pitch d 1 . The configuration except for the above is similar to that of the composite module 3 according to the third preferred embodiment shown in FIG. 6 .

Similarly to the composite module 1 according to the first preferred embodiment, the composite module 4 according to the fourth preferred embodiment has the terminal group pitch setting, thereby producing the effect similar to that of the first preferred embodiment.

In addition, the composite module 4 according to the fourth preferred embodiment includes the brake 30 embedded therein, producing the effect similar to that of the composite module 2 according to the second preferred embodiment. The IGBT emitter terminal 9 N is located adjacent to the converter output terminal 8 N, producing the effect similar to that of the third preferred embodiment.

In the composite module 4 according to the fourth preferred embodiment, the IGBT collector terminal 9 B is located adjacent to the DC bus terminal 9 P (power source terminal), thereby allowing, for example, a resistance to be provided in the external wiring between the IGBT collector terminal 9 B and the DC bus terminal 9 P without crossing other wiring patterns. This facilitates the layout for routing the wiring patterns in the entire circuitry including the composite module 4 , whereby the design load can be reduced.

<Internal Layout Configuration>

FIG. 8 is a diagram schematically describing a configuration example of the internal layout (a mounted example) of the composite module 4 . With reference to FIG. 8 , the following describes the layout configuration inside the composite module 4 .

As shown in FIG. 8 , to form the converter 10 , leads 101 to 105 are provided and die pads 201 , 203 , 204 , and 205 are included as part of the lead 101 , 103 , 104 , and 105 , respectively. The back-surface electrodes (cathodes) of the diodes D 1 , D 2 , and D 3 are die-bonded on the die pad 201 . The back-surface electrodes (cathodes) of the diodes D 4 , D 5 , and D 6 are die-bonded on the die pads 203 , 204 , and 205 , respectively.

The front-surface electrodes (anodes) of the diodes D 1 , D 2 , and D 3 are electrically connected to the die pads 203 , 204 , and 205 through bonding wires BW and the front-surface electrodes (anodes) of the diodes D 4 , D 5 , and D 6 are electrically connected in common to the lead 102 through the bonding wires BW. The tip portion of the lead 101 is the converter output terminal 8 P. The tip portion of the lead 102 is the converter output terminal 8 N. The tip portions of the leads 103 , 104 , and 105 are the AC input terminals 7 R, 7 S, and 7 T, respectively.

To form part of the inverter 20 and the brake 30 , leads 120 to 126 are provided and die pads 220 , 221 , 222 , and 223 are included as part of the leads 120 , 121 , 122 , and 123 , respectively.

The back-surface electrodes (collectors) of the IGBTs 11 , 12 , and 13 and the back-surface electrodes (cathodes) of the diodes D 11 , D 12 , D 13 , and D 41 are die-bonded on the die pad 220 . The front-surface electrodes (gate portions) of the IGBTs 11 , 12 , and 13 are electrically connected to an IC 60 through the bonding wires BW. The front-surface electrodes (emitter portions) of the IGBTs 11 , 12 , and 13 are electrically connected to the front-surface electrodes (anodes) of the diodes D 11 , D 12 , and D 13 through the bonding wires BW. The front-surface electrodes of the diodes D 11 , D 12 , and D 13 are electrically connected to the leads 121 , 122 , and 123 through the bonding wires BW.

The back-surface electrodes (collectors) of the IGBTs 21 , 22 , and 23 and the back-surface electrodes (cathodes) of the diodes D 21 , D 22 , and D 23 are die-bonded on the die pads 221 , 222 , and 223 , respectively. The front-surface electrodes (gate portions) of the IGBTs 21 , 22 , and 23 are electrically connected to an IC 50 through the bonding wires BW. The front-surface electrodes (emitter portions) of the IGBTs 21 , 22 , and 23 are electrically connected to the front-surface electrodes (anodes) of the diodes D 21 , D 22 , and D 23 through the bonding wires BW. The front-surface electrodes of the diodes D 21 , D 22 , and D 23 are electrically connected to the leads 124 , 125 , and 126 through the bonding wires BW. The tip portion of the lead 120 is the DC bus terminal 9 P.

To form the brake 30 , leads 111 and 112 are provided and a die pad 212 is included as part of the lead 112 .

The back-surface electrode (collector) of the IGBT 40 is die-bonded on the die pad 212 . The front-surface electrode (gate portion) of the IGBT 40 is electrically connected to the IC 71 through the bonding wire BW. The front-surface electrode (emitter portion) of the IGBT 40 is electrically connected to the lead 111 through the bonding wire BW. The front-surface electrode (anode) of the diode D 41 located on the die pad 220 is electrically connected to the lead 112 .

The tip portion of the lead 111 is the IGBT emitter terminal 9 N (the external terminal 18 ) and the tip portion of the lead 112 is the IGBT collector terminal 9 B.

The entirety except for the tip portions of the leads 101 to 105 , 111 , 112 , and 120 to 126 and the tip portions of lead groups 131 to 133 , which are described later, are resin-sealed with a sealing resin 80 . Thus, the most parts of the leads 101 to 105 , 111 , 112 , and 120 to 126 including the diodes D 1 to D 6 , D 11 to D 13 , D 21 to D 23 , and D 40 and the IGBTs 11 to 13 , 21 to 23 , and 40 and the most parts of the lead groups 131 to 133 are resin-sealed with the sealing resin 80 , thereby providing the composite module 4 integrally including the converter 10 , the inverter 20 , and the brake 30 in the sealing resin 80 .

The die pads 201 , 203 to 205 , 212 , and 220 to 223 are formed on an insulating sheet 81 .

The IC 50 , the IC 60 , and the IC 71 are die-bonded on a die pad 250 . The IC 50 includes the ICs 51 , 52 , and 53 shown in FIG. 5 . The IC 60 includes the ICs 61 , 62 , and 63 shown in FIG. 5 . The lead group 131 related to the IC 71 , the lead group 132 related to the IC 60 , and the lead group 133 related to the IC 50 are respectively provided. Diodes D 51 , D 52 , and D 53 serve as the diodes to bootstrap the IC 60 . The IC 50 , the IC 60 , and the IC 71 bear little relevance to the present invention, and the detailed description of, for example, each part and the connection relationship thereof are omitted.

In such layout configuration, the tip portions of the leads 101 , 102 , and 111 are adjacently located at the formation pitch d 1 away from each other and the tip portions of the lead 103 , 104 , and 105 are adjacently located at the formation pitch d 2 (=d 1 ) away from each other as described in the first preferred embodiment (the third preferred embodiment).

In addition, the tip portions of the lead 112 and the lead 120 are adjacently located at the formation pitch d 3 away from each other and the tip portions of the lead 112 and the lead 105 are adjacently located at the formation pitch d 4 away from each other as described in the fourth preferred embodiment.

The internal layout configuration shown in FIG. 8 has the composite positional relation in which the converter 10 is located on the left side, providing the first-type composite module (corresponding to the composite module 1 A shown in FIG. 2 ) that is a first aspect of the composite module 4 shown in FIG. 7 .

The following describes the case in which the second-type composite module (corresponding to the composite module 1 B shown in FIG. 3 ) that is a second aspect of the composite module 4 shown in FIGS. 7 and 8 is provided.

In this case, the layout configuration of the inverter 20 and the brake 30 (the lead 112 (the die pad 212 ), the leads 120 to 126 (the die pads 220 to 223 ), the IGBTs 11 to 13 , 21 to 23 , and 40 , and the diodes D 11 to D 13 , D 21 to D 23 , and D 41 ) except for the lead 111 can be unchanged from the layout configuration shown in FIG. 8 .

The second-type composite module 4 can be manufactured by slightly changing the shapes of the leads 101 to 105 (the die pads 201 , and 203 to 205 ) or by changing the vertical arrangement thereof, in other words, by mainly changing solely the internal layout only of the converter 10 .

The composite module 4 has the terminal group pitch setting described above. Thus, only the internal layout of the converter 10 is mainly changed, to thereby selectively manufacture the first-type composite module 4 (see FIGS. 7 and 2 ) and the second-type composite module 4 (see FIG. 3 ) that have opposite positional relations between the first and second terminal groups on the one side and the other side. Similarly to the composite module 4 , the composite modules 1 , 2 , and 3 according to the first, second, and third preferred embodiments can be selectively formed into the first-type and second-type composite modules with relative ease.

<Modification>

According to modifications of the first, second, third, and fourth preferred embodiments, the IGBTs 11 to 13 and 21 to 23 that are the power elements in the inverter 20 of the composite modules 1 , 2 , 3 and 4 are formed of SiC and the IGBT 40 that is the power element in the brake 30 of the composite modules 2 , 3 , and 4 is formed of SiC.

The composite modules according to such modifications include the IGBTs 11 to 13 , 21 to 23 , and 40 that are formed of SiC, to thereby reduce the size of the module while keeping the terminal arrangement of the external terminals. This is effective in miniaturizing each of the composite modules 1 , 2 , 3 , and 4 .

In the present invention, the above preferred embodiments can be arbitrarily combined, or each preferred embodiment can be appropriately varied or omitted within the scope of the invention.

While the invention has been shown and described in detail, the foregoing description is in all aspects illustrative and not restrictive. It is therefore understood that numerous modifications and variations can be devised without departing from the scope of the invention.