Inventor

Shinya Nakagawa

Inventor
Tokyo, JP

Overview

43→
Patents
1987–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Kprimary
G01KMeasuring temperature8%
H01LSemiconductor devices8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%
G03GElectrography5%
G06FElectric digital data processing5%
LOC135%
A61BDiagnosis4%
B81BMicrostructural devices or systems, e.g. micromechanical devices4%
H01RElectrically-conductive connections4%
PatentTitleYear
10,564,046Internal temperature measuring apparatus and temperature difference measuring module202010,551,252Internal temperature measuring apparatus and sensor package202010,488,268Temperature difference measuring apparatus201910,474,051Carrier for developer of electrostatic latent image, two-component developer, replenishing developer, image forming apparatus, and toner stored unit201910,451,490Sensor package201910,343,733Additional protective cover for a crawler traveling body and method for assembling same201910,290,780Method for manufacturing light-emitting device201910,254,674Carrier for developer of electrostatic latent image, developer, and image forming apparatus201910,229,867Power semiconductor device201910,190,921Internal temperature measurement device201910,186,978Modular power conversion semiconductor device201910,181,784Power supply system and image forming apparatus201910,175,120Internal temperature measurement method and internal temperature measurement device201910,060,803MEMS internal temperature sensor having thin film thermopile201810,025,214Carrier, developing agent, image forming apparatus, image forming method, replenishment toner, and process cartridge2018D0783550'Power semiconductor device'2017D0777124'Power semiconductor device'2017D0772182'Power semiconductor device'2016D0770994'Power semiconductor device'20169,337,599'Carbon brush for fuel pump and method for manufacturing same'20169,324,685'Semiconductor device and method of manufacturing the same'20169,230,891'Semiconductor device'20169,024,504'Carbon commutator and a method for production thereof'20159,015,308'Multilayer distributed processing system'20158,643,026'Semiconductor module'20148,321,602'Device management apparatus, device management method and device management program'20128,086,175'Field device search system'20117,999,965'Information management apparatus, information output system, portable terminal, and information outputting method'20117,933,234'Guide apparatus, guide system, and guide method'20117,808,085'Semiconductor device and mold for resin-molding semiconductor device'20107,586,230'Brush, commutator, and commutator device'20097,561,295'Information management apparatus, information output system, portable terminal, and information outputting method'20097,340,450'Data search system and data search method using a global unique identifier'20087,254,269'Character recognition system'20077,233,955'System and method for searching and retrieving information regarding related goods and services'20077,113,897'Apparatus and method for text segmentation based on coherent units'20065,923,429'Apparatus for monitoring in-situ the thickness of a film during film deposition and a method thereof'19995,432,608'Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same'19955,260,771'Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same'19935,094,539'Method of making semiconductor integrated circuit, pattern detecting method, and system for semiconductor alignment and reduced stepping exposure for use in same'19925,025,284'Exposure method and exposure apparatus'19914,974,018'Exposure method and exposure apparatus'19904,699,505'Exposure method and exposure apparatus'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–1995Patents assigned to HITACHI LTD (6)· patent assignee history
1992–1995Based in Tachikawa, JP· patent location history
2006–2011Patents assigned to HEWLETT PACKARD CO (6)· patent assignee history
2006–2011Based in Mitaka, JP· patent location history
2007–2019Based in Tokyo, JP· patent location history
2010–2019Patents assigned to MITSUBISHI ELECTRIC CORP (10)· patent assignee history
2011–2019Patents assigned to NAKAGAWA SHINYA (9)· patent assignee history
2018–2020Patents assigned to OMRON TATEISI ELECTRONICS CO (7)· patent assignee history
2018–2019Based in Shizuoka, JP· patent location history
2019–2020Based in Omihachiman, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI ELECTRIC CORP102010–2019
NAKAGAWA SHINYAself92011–2019
OMRON TATEISI ELECTRONICS CO72018–2020
HEWLETT PACKARD CO62006–2011
HITACHI LTD61987–1995
Locations
LocationPatentsSpan
Tokyo, JP142007–2019
Omihachiman, JP52019–2020
Mitaka, JP52006–2011
Shizuoka, JP32018–2019
Tachikawa, JP31992–1995