Rotation sensor

1. Field of the Invention

The present invention relates to a rotation sensor for detecting rotation of a rotating body, which is used in, for example, an engine or a transmission of an automobile.

2. Description of the Related Art

FIG. 44 is a front sectional view illustrating a related-art rotation sensor 1 disclosed in Japanese Patent Application Laid-open No. 2012-2564 ( FIGS. 1, 2, and 4 to 12 ).

The rotation sensor 1 is inserted into an opening of a housing 10 including a rotary shaft 11 housed therein so as to be mounted to the housing 10 .

A plurality of convex portions 12 made of a ferromagnetic material such as iron are provided on an outer circumferential surface of the rotary shaft 11 as a rotating body such as a connecting shaft connected to a crankshaft of an engine or the crankshaft so as to be arranged at intervals in a circumferential direction of the rotary shaft 11 .

The rotation sensor 1 for detecting rotation of the rotary shaft 11 includes a case 2 , a pair of lead frames 3 X and 3 Y, a magnetic detection section 7 , an internal filling resin 8 , and an exterior resin 9 . The case 2 is provided at a distance from a surface of the convex portion 12 , and includes a bottom surface portion 2 a and a side surface portion 2 b . The side surface portion 2 b defines an internal space having an opening 2 c in cooperation with the bottom surface portion 2 a . One end of each of the lead frames 3 X and 3 Y is inserted into the internal space of the case 2 through the opening 2 c , whereas another end thereof protrudes externally from the case 2 . The magnetic detection section 7 is provided to distal ends of the lead frames 3 X and 3 Y so as to be electrically connected to the lead frames 3 X and 3 Y. The internal filling resin 8 is filled into the internal space of the case 2 . The exterior resin 9 covers the opening 2 c of the case 2 .

A positioning portion 3 Xe of the lead frame 3 X and a positioning portion 3 Ye of the lead frame 3 Y are held in contact with an opening circumferential edge portion 2 d of the case 2 . In this manner, a height position of the magnetic detection section 7 inside the case 2 is determined.

The magnetic detection section 7 includes an in-sensor magnet 5 and an integrated circuit (IC) 4 that is magnetic detection means. The IC 4 includes a detection element such as a hall element and a signal processing circuit.

In the rotation sensor 1 , the IC 4 generates a signal in accordance with a change in magnetic field of the in-sensor magnet 5 by the rotation of the rotary shaft 11 having the convex portions 12 made of the magnetic material.

The above-mentioned rotation sensor 1 is manufactured in the following steps as shown in FIGS. 4 to 10 of Japanese Patent Application Laid-open No. 2012-2654.

First, a lead-frame coupled body including the lead frames 3 X and 3 Y and a coupling portion for connecting the lead frames 3 X and 3 Y to each other is made of a metal plate having a rectangular shape.

Next, the magnetic detection section 7 is provided to an end of the lead-frame coupled body (first step).

Thereafter, the lead-frame coupled body and the magnetic detection section 7 are inserted into the internal space of the case 2 through the opening 2 c of the case 2 (second step).

Thereafter, the internal space of the case 2 is filled with the internal filling resin 8 that is a mold resin (third step).

Next, after the internal filling resin 8 is cured, the coupling portion is removed so as to separate the lead frames 3 X and 3 Y from each other (fourth step).

Finally, a semi-product including the lead frames 3 X and 3 Y and the magnetic detection section 7 that are assembled inside the case 2 is placed inside a die (not shown) for the exterior resin 9 . By molding, a connector housing for external connection and a sensor exterior part are formed on the case 2 , and the opening 2 c of the case 2 is covered with the exterior resin 9 .

In the related-art rotation sensor 1 , the internal space of the case 2 is filled with a large amount of the internal filling resin 8 . A material to be used as the internal filling resin 8 is generally an epoxy resin that is expensive. Thus, there is a problem in that manufacturing costs increase.

Further, in the manufacturing of the rotation sensor 1 , most attention needs to be paid to the arrangement of the magnetic detection section 7 in a predetermined dimensional position. In handling, for inserting the magnetic detection section 7 into the case 2 , the pair of lead frames 3 X and 3 Y or the magnetic detection section 7 is inevitably required to be held. Therefore, particular attention is required to be paid so that the lead frames 3 X and 3 Y are not deformed. Therefore, there is another problem in that workability is low.

The present invention has been made to solve the problems described above, and has an object to provide a rotation sensor capable of reducing manufacturing costs and improving workability.

According to one embodiment of the present invention, there is provided a rotation sensor for detecting rotation of a rotating body, including:

a case including:

a bottom surface portion provided at a distance from a surface of the rotating body; and a side surface portion connected to the bottom surface portion so as to define a hollow internal space in cooperation with the bottom surface portion,

the case having an opening spatially connected to the hollow internal space, which is formed in the side surface portion on a side opposite to the bottom surface portion;

a plurality of lead frames respectively having distal ends inserted into the case through the opening;

a magnetic detection section provided to the distal ends of the plurality of lead frames arranged in parallel, for detecting a change in magnetic field of a magnetic body provided to the rotating body;

a spacer provided between the plurality of lead frames and the side surface portion so as to be held in contact with an internal wall surface of the side surface portion; and

an internal filling resin for filling a space portion of the hollow internal space except for the spacer, the magnetic detection section, and the plurality of lead frames.

According to the rotation sensor of the one embodiment of the present invention, the spacer is provided between the lead frame and the side surface portion so as to be held in contact with the inner wall surface of the side surface portion of the case. Therefore, the amount of use of the expensive internal filling resin can be reduced, thereby reducing the manufacturing costs.

Further, when inserting the magnetic detection section into the case, the magnetic detection section is inserted into the case with the lead frames being fixed to the spacer. As a result, deformation of the lead frames is reduced so as to improve the workability.

FIG. 1 is a front sectional view illustrating the rotation sensor according to a first embodiment of the present invention.

FIG. 2 is a sectional view of FIG. 1 , as viewed in a direction of the arrow II.

FIG. 3 is a front sectional view illustrating a rotation sensor according to a second embodiment of the present invention.

FIG. 4 is a sectional view of FIG. 3 , as viewed in a direction of the arrow IV.

FIG. 5 is a front sectional view illustrating a rotation sensor according to a third embodiment of the present invention.

FIG. 6 is a sectional view of FIG. 5 , as viewed in a direction of the arrow VI.

FIG. 7 is a front sectional view illustrating a rotation sensor according to a fourth embodiment of the present invention.

FIG. 8 is a sectional view of FIG. 7 , as viewed in a direction of the arrow VIII.

FIG. 9 is a front sectional view illustrating a rotation sensor according to a fifth embodiment of the present invention.

FIG. 10 is a sectional view of FIG. 9 , as viewed in a direction of the arrow X.

FIG. 11 is a front sectional view illustrating a rotation sensor according to a sixth embodiment of the present invention.

FIG. 12 is a sectional view of FIG. 11 , as viewed in a direction of the arrow XII.

FIG. 13 is a front sectional view illustrating a rotation sensor according to a seventh embodiment of the present invention.

FIG. 14 is a sectional view of FIG. 13 , as viewed in a direction of the arrow XIV.

FIG. 15 is a front sectional view illustrating a rotation sensor according to an eighth embodiment of the present invention.

FIG. 16 is a sectional view of FIG. 15 , as viewed in a direction of the arrow XVI.

FIG. 17 is a front sectional view illustrating a rotation sensor 1 according to a ninth embodiment of the present invention.

FIG. 18 is a sectional view of FIG. 17 as viewed in a direction of the arrow XVIII.

FIG. 19 is a sectional view taken along the line A-A in FIG. 17 , as viewed in a direction of the arrows.

FIG. 20 is a front sectional view illustrating a rotation sensor according to a tenth embodiment of the present invention.

FIG. 21 is a sectional view of FIG. 20 , as viewed in a direction of the arrow XXI.

FIG. 22 is a side sectional view illustrating a modification of a rotation sensor according to a tenth embodiment of the present invention.

FIG. 23 is a front sectional view illustrating a rotation sensor according to an eleventh embodiment of the present invention.

FIG. 24 is a sectional view of FIG. 23 as viewed in a direction of the arrow XXIV.

FIG. 25 is a sectional view taken along the line B-B in FIG. 23 , as viewed in a direction of the arrows.

FIG. 26 is a sectional view taken along the line C-C in FIG. 24 , as viewed in a direction of the arrows.

FIG. 27 is an explanatory view explaining a first step of manufacturing process of a rotation sensor according to a ninth embodiment ( FIG. 17 ) of the present invention.

FIG. 28 is a sectional view of FIG. 27 as viewed in a direction of the arrow XXVIII.

FIG. 29 is an explanatory view explaining a next step (a second step) of manufacturing process of a rotation sensor shown in FIG. 27 .

FIG. 30 is a sectional view of FIG. 29 as viewed in a direction of the arrow

XXX.

FIG. 31 is an explanatory view explaining a next step (a second step) of manufacturing process of a rotation sensor shown in FIG. 27 .

FIG. 32 is a sectional view of FIG. 31 as viewed in the direction of the arrow XXXII.

FIG. 33 is an explanatory view explaining a procedure assembling a spacer to a lead-frame in a second step.

FIG. 34 is an explanatory view explaining a procedure assembling a spacer to a lead-frame in a second step.

FIG. 35 is an explanatory view explaining a procedure assembling a spacer to a lead-frame in a second step.

FIG. 36 is an explanatory view explaining a procedure assembling a spacer to a lead-frame in a second step.

FIG. 37 is an explanatory view explaining a procedure assembling a spacer to a lead-frame in a second step.

FIG. 38 is a sectional view of FIG. 37 as viewed in a direction of the arrow XXXVIII.

FIG. 39 is an explanatory view explaining a next step (a third step) of manufacturing process of a rotation sensor shown in FIG. 29 .

FIG. 40 is an explanatory view explaining a third step.

FIG. 41 is a sectional view of FIG. 40 as viewed in a direction of the arrow XLI.

FIG. 42 is an explanatory view explaining a next step (a forth step) of manufacturing process of a rotation sensor shown in FIG. 39 .

FIG. 43 is a sectional view of FIG. 42 as viewed in a direction of the arrow XLIII.

FIG. 44 is a front sectional view illustrating a related-art rotation sensor.

Now, a rotation sensor 1 according to each of embodiments of the present invention is described. In the drawings including FIG. 44 illustrating the related art, the same or corresponding members and parts are denoted by the same reference symbols for description.

First Embodiment

FIG. 1 is a front sectional view illustrating the rotation sensor 1 according to a first embodiment of the present invention, and FIG. 2 is a sectional view of FIG. 1 , as viewed in a direction of the arrow II.

In the rotation sensor 1 of the first embodiment, a magnetic detection section 7 is entirely covered with an internal filling resin 8 in an internal space of a case 2 with a closed end, which has a circular sectional shape. Above the magnetic detection section 7 , a spacer 13 is provided on one side of the pair of lead frames 3 X and 3 Y. The pair of lead frames 3 X and 3 Y is covered with an exterior resin 9 on another side.

The case 2 , the exterior resin 9 , and the spacer 13 are made of a polyphenylenesulfide (PPS) resin or a polybutylene terephthalate (PBT) resin. The internal filling resin 8 is an epoxy resin.

The remaining configuration is the same as that of the related-art rotation sensor 1 illustrated in FIG. 44 .

In the rotation sensor 1 according to the first embodiment, the lead frames 3 X and 3 Y are interposed between the spacer 13 and the exterior resin 9 . As compared with the related-art rotation sensor 1 in which the internal filling resin 8 is provided around the lead frames 3 X and 3 Y, the amount of the internal filling resin 8 can be significantly reduced.

As a result, the amount of use of the internal filling resin 8 that is an expensive epoxy resin can be significantly reduced. Thus, manufacturing costs can be lowered.

Further, when inserting the magnetic detection section 7 into the case 2 , the magnetic detection section 7 is inserted into the case 2 with the lead frames 3 X and 3 Y being fixed to the spacer 13 . As a result, deformation of the lead frames 3 X and 3 Y is reduced to improve workability.

Second Embodiment

FIG. 3 is a front sectional view illustrating a rotation sensor 1 according to a second embodiment of the present invention, and FIG. 4 is a sectional view of FIG. 3 , as viewed in a direction of the arrow IV.

The rotation sensor 1 of the second embodiments includes three lead frames 3 X, 3 Y, and 3 Z. Among the three lead frames 3 X, 3 Y, and 3 Z, a positioning portion 3 Xe of the lead frame 3 X and a positioning portion 3 Ye of the lead frame 3 Y are held in contact with an opening circumferential edge portion 2 d of the case 2 . As a result, a height position of the magnetic detection section 7 inside the case 2 is determined.

The lead frames 3 X, 3 Y, and 3 Z are interposed between spacers 13 X and 13 Y so as to be opposed to each other. Each of the spacers 13 X and 13 Y has a semi-cylindrical shape obtained by cutting a cylinder along an axial direction. Each of the spacers 13 X and 13 Y is held in surface contact with an inner wall surface of a side surface portion 2 b of the case 2 .

Also in the rotation sensor 1 of the second embodiment, the amount of the internal filling resin 8 can be reduced. As a result, the manufacturing costs are reduced.

Further, when inserting the magnetic detection section 7 into the case 2 , the magnetic detection section 7 is inserted into the case 2 so that the lead frames 3 X, 3 Y, and 3 Z are interposed between the spacers 13 X and 13 Y. As a result, as compared with the rotation sensor 1 of the first embodiment, the deformation of the lead frames 3 X, 3 Y, and 3 Z is further reduced to further improve the workability.

Third Embodiment

FIG. 5 is a front sectional view illustrating a rotation sensor 1 according to a third embodiment of the present invention, and FIG. 6 is a sectional view of FIG. 5 , as viewed in a direction of the arrow VI.

In the rotation sensor 1 of the third embodiment, the opening circumferential edge portion 2 d of the case 2 , with which the positioning portion 3 Xe of the lead frame 3 X and the positioning portion 3 Ye of the lead frame 3 Y in the height direction are held in contact, is provided closer to a bottom surface portion 2 a than an opening 2 c of the case 2 , as compared with the rotation sensors 1 of the first and second embodiments.

Therefore, at the time when the magnetic detection section 7 is buried with the internal filling resin 8 inside the case 2 , a dimension E (not shown) from a contact surface between the opening circumferential edge portion 2 d of the case 2 and the positioning portions 3 Xe and 3 Ye to an integrated circuit (IC) 4 of the magnetic detection section 7 mounted to the lead frames 3 X, 3 Y, and 3 Z is determined with high accuracy.

Specifically, an insertion depth dimension of the lead frames 3 X, 3 Y, and 3 Z and the magnetic detection section 7 (IC 4 ) in the case 2 is kept to the predetermined dimension by the positioning portions 3 Xe and 3 Ye. In this state, the lead frames 3 X, 3 Y, and 3 Z and the magnetic detection section 7 are fixed with the internal filling resin 8 .

Fourth Embodiment

FIG. 7 is a front sectional view illustrating a rotation sensor 1 according to a fourth embodiment of the present invention, and FIG. 8 is a sectional view of FIG. 7 , as viewed in a direction of the arrow VIII.

The rotation sensor 1 of the fourth embodiment, fitting means for fitting the spacer 13 and the magnetic detection section 7 to each other is provided to the spacer 13 and the magnetic detection section 7 .

The fitting means includes a fitting portion 7 X formed on the magnetic detection section 7 and a magnetic detection section supporting portion 13 a having a convex shape to be fitted into the fitting portion 7 X.

The remaining configuration is the same as that of the rotation sensor 1 of the third embodiment.

In the rotation sensor 1 of the fourth embodiment, the spacer 13 supports the magnetic detection section 7 together with the lead frames 3 X, 3 Y, and 3 Z by the fitting of the magnetic detection section supporting portion 13 a of the spacer 13 into the fitting portion 7 X. Thus, the deformation of the lead frames 3 X, 3 Y, and 3 Z is further reduced when the magnetic detection section 7 is inserted into the case 2 . As a result, the magnetic detection section 7 is installed in a predetermined position with high accuracy.

Fifth Embodiment

FIG. 9 is a front sectional view illustrating a rotation sensor 1 according to a fifth embodiment of the present invention, and FIG. 10 is a sectional view of FIG. 9 , as viewed in a direction of the arrow X.

In the rotation sensor 1 of the fifth embodiment, ribs 13 b are provided on a plane portion of the spacer 13 having a semi-circular sectional shape so as to be located close to the magnetic detection section 7 . The ribs 13 b having distal ends extend into gaps between the adjacent lead frames 3 X, 3 Y, and 3 Z.

The remaining configuration is the same as that of the rotation sensor 1 of the fourth embodiment.

In the rotation sensor 1 of the fifth embodiment, the ribs 13 b are provided in the gaps between the adjacent lead frames 3 X, 3 Y, and 3 Z. Thus, the ribs 13 b function as partition walls so that electrical short-circuit is prevented from occurring between the lead frames 3 X, 3 Y, and 3 Z when the lead frames 3 X, 3 Y, and 3 Z are deformed.

Sixth Embodiment

FIG. 11 is a front sectional view illustrating a rotation sensor 1 according to a sixth embodiment of the present invention, and FIG. 12 is a sectional view of FIG. 11 , as viewed in a direction of the arrow XII.

In the rotation sensor 1 of the sixth embodiment, positioning pins 13 c are provided to a plane portion of the spacer 13 having a semi-circular sectional shape. Positioning pins 13 c are provided so as to interpose the lead frames 3 X, 3 Y, and 3 Z and be held in contact with both end surfaces of the lead frames 3 X, 3 Y, and 3 Z, respectively.

The remaining configuration is the same as that of the rotation sensor 1 of the fourth embodiment.

In the case of the rotation sensor 1 of the sixth embodiment, the electrical short-circuit can be prevented from occurring between the lead frames 3 X, 3 Y, and 3 Z by the positioning pins 13 c when the lead frames 3 X, 3 Y, and 3 Z are deformed, as in the case of the rotation sensor 1 of the fifth embodiment.

Seventh Embodiment

FIG. 13 is a front sectional view illustrating a rotation sensor 1 according to a seventh embodiment of the present invention, and FIG. 14 is a sectional view of FIG. 13 , as viewed in a direction of the arrow XIV.

In the rotation sensor 1 of the seventh embodiment, positioning holes 3 Xf, 3 Zf, and 3 Yf are respectively formed in the lead frames 3 X, 3 Y, and 3 Z. Positioning pins 13 d are provided to a plane portion of the spacer 13 having a semi-circular sectional shape so as to be respectively opposed to the positioning holes 3 Xf, 3 Zf, and 3 Yz.

The remaining configuration is the same as that of the rotation sensor 1 of the fourth embodiment.

According to the rotation sensor 1 of the seventh embodiment, the positioning pins 13 d are pressed into the positioning holes 3 Xf, 3 Zf, and 3 Yf of the lead frames 3 X, 3 Y, and 3 Z, thereby integrating the lead frames 3 X, 3 Y, and 3 Z with the spacer 13 . As a result, the deformation of the lead frames 3 X, 3 Y, and 3 Z is reduced when the magnetic detection section 7 is inserted into the case 2 . As a result, the magnetic detection section 7 is installed in a predetermined position with higher accuracy.

Eighth Embodiment

FIG. 15 is a front sectional view illustrating a rotation sensor 1 according to an eighth embodiment of the present invention, and FIG. 16 is a sectional view of FIG. 15 , as viewed in a direction of the arrow XVI.

In the rotation sensor 1 of the eighth embodiment, the lead frames 3 X, 3 Y, and 3 Z are interposed between the spacers 13 X and 13 Y. Each of the spacers 13 X and 13 Y has a semi-cylindrical shape obtained by cutting a cylinder along the axial direction. The spacers 13 X and 13 Y are held in surface contact with the inner wall surface of the side surface portion 2 b of the case 2 , which has a circular sectional shape.

Three positioning pins 13 Xd are provided to the spacer 13 X. Positioning holes 13 Yd are formed in the spacer 13 Y so as to be opposed to the positioning pins 13 Xd.

The positioning holes 3 Xf, 3 Yf, and 3 Zf are respectively formed through the lead frames 3 X, 3 Y, and 3 Z.

When the lead frames 3 X, 3 Y, and 3 Z are interposed between the spacers 13 X and 13 Y, the positioning pins 13 Xd of the spacer 13 X are respectively fitted into the positioning holes 13 Yd of the spacer 13 Y through the positioning holes 3 Xf, 3 Yf, and 3 Zf of the lead frames 3 X, 3 Y, and 3 Z.

The remaining configuration is the same as that of the rotation sensor 1 of the fourth embodiment.

In the rotation sensor 1 of the eighth embodiment, the lead frames 3 X, 3 Y, and 3 Z are interposed between the spacers 13 X and 13 Y and are integrated with the spacers 13 X and 13 Y.

Therefore, as illustrated in FIG. 27 , the lead frames 3 X, 3 Y, and 3 Z are formed by cutting coupling portions 3 Za of a lead-frame coupled body 3 ZZ. The coupling portions 3 Za can be cut in the integrated state described above.

Specifically, in an assembly step for the rotation sensor 1 , when the lead frames 3 X, 3 Y, and 3 Z are assembled to the spacer 13 X, the lead frames 3 X, 3 Y, and 3 Z connected through the coupling portions 3 Za are first assembled to the spacer 13 X as a single component. Thereafter, the coupling portions 3 Za are cut. In this manner, productivity is significantly improved.

Further, a semi-product, in which the lead frames 3 X, 3 Y, and 3 Z are interposed between the spacers 13 X and 13 Y so as to integrate the lead frames 3 X, 3 Y, and 3 Z, the spacers 13 X and 13 Y, and the magnetic detection section 7 with each other, can be handled as a single component. Thus, handling properties are improved in assembly. At the same time, the deformation of the lead frames 3 X, 3 Y, and 3 Z is reduced. As a result, the magnetic detection section 7 is installed in a predetermined position with higher accuracy.

Ninth Embodiment

FIG. 17 is a front sectional view illustrating a rotation sensor 1 according to a ninth embodiment of the present invention, FIG. 18 is a sectional view of FIG. 17 as viewed in a direction of the arrow XVIII, and FIG. 19 is a sectional view taken along the line A-A in FIG. 17 , as viewed in a direction of the arrows.

In the rotation sensor 1 of the ninth embodiment, spacer concave-side fitting portions 13 XeL and 13 XeR are formed on the spacer 13 X. Spacer convex-side fitting portions 13 YeL and 13 YeR to be fitted into the spacer convex-side fitting portions 13 XeL and 13 XeR are formed on the spacer 13 Y.

The letter “L” in the reference symbols 13 XeL, 13 XeR, 13 YeL, and 13 YeR indicates the spacer concave-side fitting portion and the spacer convex-side fitting portion that are provided on the left in FIG. 19 , whereas the letter “R” indicates the spacer concave-side fitting portion and the spacer convex-side fitting portion that are provided on the right.

A lead-frame interposing portion 3 Xg, which is provided on the side closer to the adjacent lead frame 3 Z so as to project toward the spacer 13 X, is formed on the lead frame 3 X. A lead-frame interposing portion 3 Yg, which is provided on the side closer to the adjacent lead frame 3 Z so as to project toward the spacer 13 X, is formed on the lead frame 3 Y. Lead-frame interposing portions 3 Zgx and 3 Zgy are formed on the spacer 3 Z so as to project toward the spacer 13 X. The lead-frame interposing portion 3 Zgx is provided on the side closer to the adjacent lead frame 3 X, whereas the lead-frame interposing portion 3 Zgy is provided on the side closer to the adjacent lead frame 3 Y.

When the lead frames 3 X, 3 Y, and 3 Z are interposed between the spacers 13 X and 13 Y, the spacer convex-side fitting portions 13 YeL and 13 YeR are fitted into the spacer concave-side fitting portions 13 XeL and 13 XeR through the lead-frame interposing portions 3 Xg, 3 Yg, 3 Zgx, and 3 Zgy. In this manner, the lead frames 3 X, 3 Y, and 3 Z are integrated with the spacers 13 X and 13 Y.

The remaining configuration is the same as that of the rotation sensor 1 of the fourth embodiment.

In an x-direction in FIG. 19 , the following expression is satisfied for dimensions of the spacer concave-side fitting portion 13 XeL, the lead-frame interposing portion 3 Xg, the spacer convex-side fitting portion 13 YeL, and the lead-frame interposing portion 3 Zgx.

13 XeL≧ 3 Xg+ 13 YeL+ 3 ZgX

Further, similarly, the following expression is satisfied for dimensions of the spacer concave-side fitting portion 13 XeR, the lead-frame interposing portion 3 Yg, the spacer concave-side fitting portion 13 XeR, and the lead-frame interposing portion 3 Zgy.

13 XeR≧ 3 Yg+ 13 XeR+ 3 Zgy

According to the rotation sensor 1 of the ninth embodiment, a semi-product, in which the lead frames 3 X, 3 Y, and 3 Z are interposed between the spacers 13 X and 13 Y so as to integrate the lead frames 3 X, 3 Y, and 3 Z, the spacers 13 X and 13 Y, and the magnetic detection section 7 with each other, can be handled as a single component as in the case of the rotation sensor 1 of the eighth embodiment. Thus, the handling properties are improved in assembly. At the same time, the deformation of the lead frames 3 X, 3 Y, and 3 Z is reduced. As a result, the magnetic detection section 7 is installed in a predetermined position with higher accuracy.

Further, after the lead frames 3 X, 3 Y, and 3 Z are assembled to the spacer 13 X or 13 Y in a state in which the adjacent lead frames 3 X, 3 Y, and 3 Z are connected in advance through connecting portions (not shown) for the lead-frame interposing portions 3 Xg, 3 Zgx, 3 Zgy, and 3 Yg as a single component, the connecting portions are cut. In this manner, the productivity can also be improved.

Tenth Embodiment

FIG. 20 is a front sectional view illustrating a rotation sensor 1 according to a tenth embodiment of the present invention, and FIG. 21 is a sectional view of FIG. 20 , as viewed in a direction of the arrow XXI.

In the rotation sensor 1 of the tenth embodiment, positional alignment portions for positional alignment between the case 2 and the spacer 13 Y are provided between the case 2 and the spacer 13 Y.

The positional alignment portions include a positional alignment convex portion 13 Yf and a positional alignment concave portion 2 j . The positional alignment convex portion 13 Yf is provided to a portion of an upper outer circumferential portion of the spacer 13 Y so as to project radially outward. The positional alignment concave portion 2 j , into which the positional alignment convex portion 13 Yf is fitted, is formed on the side surface portion 2 b of the case 2 .

The remaining configuration is the same as that of the rotation sensor 1 of the ninth embodiment.

According to the rotation sensor 1 of this embodiment, even when the inner wall of the case 2 has a cylindrical shape and the lead frames 3 X, 3 Y, and 3 Z are located in the center of the case 2 , a direction of assembly of the magnetic detection section 7 is automatically determined by fitting the positional alignment convex portion 13 Yf into the positional alignment concave portion 2 j of the case 2 when the semi-product, in which the lead frames 3 X, 3 Y, and 3 Z are interposed between the spacers 13 X and 13 Y so as to be integrated with each other, is assembled into the case 2 .

Alternatively, as illustrated in FIG. 22 , the positional alignment convex portion 2 j may be formed on the case 2 , while the positional alignment concave portion 13 Yf, into which the positional alignment convex portion 2 j is to be fitted, may be formed on the spacer 13 Y.

Eleventh Embodiment

FIG. 23 is a front sectional view illustrating a rotation sensor 1 according to an eleventh embodiment of the present invention, FIG. 24 is a sectional view of FIG. 23 as viewed in a direction of the arrow XXIV, FIG. 25 is a sectional view taken along the line B-B in FIG. 23 , as viewed in a direction of the arrows, and FIG. 26 is a sectional view taken along the line C-C in FIG. 24 , as viewed in a direction of the arrows.

In the rotation sensor 1 of the eleventh embodiment, the magnetic detection section 7 has a “D”-like sectional shape and includes a cut portion 7 a . The case 2 includes a cut portion 2 k so as to correspond to the shape of the magnetic detection section 7 .

The remaining configuration is the same as that of the rotation sensor 1 of the ninth embodiment.

According to the rotation sensor 1 of the eleventh embodiment, the magnetic detection section 7 has an asymmetrical shape having directionality. The case 2 also has an asymmetrical shape so as to correspond to the shape of the magnetic detection section 7 . Therefore, when the magnetic detection section 7 is mounted into the case 2 , a direction of assembly is defined.

Further, in an assembly step for the rotation sensor 1 , when the case 2 in which the semi-product is housed is placed inside a die for forming the exterior resin 9 , the direction of assembly of the case 2 can be defined by visual observation. Thus, the workability is improved.

Next, first to fourth steps for manufacturing the rotation sensor 1 of the ninth embodiment, which is illustrated in FIGS. 17 to 19 , are described in order.

The steps until the completion of the magnetic detection section 7 , which is connected to an end of the lead-frame coupled body 3 ZZ made of a metal plate having a rectangular shape, are described in Japanese Patent Application Laid-open No. 2012-2564 referring to FIGS. 4 to 7 , and therefore the description thereof is herein omitted.

First Step

FIG. 27 is a front view illustrating the lead-frame coupled body 3 ZZ and the magnetic detection section 7 in the first step, and FIG. 28 is a sectional view of FIG. 27 as viewed in a direction of the arrow XXVIII.

In this step, the lead frames 3 X, 3 Y, and 3 Z are components of the lead-frame coupled body 3 ZZ in which the lead frames 3 X, 3 Y, and 3 Z are connected by the coupling portions 3 Za (at two positions). The magnetic detection section 7 is connected to the end of the lead-frame coupled body 3 ZZ.

Second Step

FIG. 29 is a front view illustrating the lead-frame coupled body 3 ZZ, the magnetic detection section 7 , and the spacer 13 X in the second step, and FIG. 30 is a sectional view of FIG. 29 as viewed in a direction of the arrow XXX.

The lead-frame interposing portions 3 Xg, 3 Zgx, 3 Yg, and 3 Zgy, which project from the lead-frame coupled body 3 ZZ, are fitted into the two spacer concave-side fitting portions 13 XeL and 13 XeR provided to the spacer 13 X so as to temporarily fix the lead-frame coupled body 3 ZZ.

The two coupling portions 3 Za of the lead-frame coupled body 3 ZZ illustrated in FIG. 31 are cut (cut off).

The cutting may be performed after the spacer 13 Y is assembled to the spacer 13 X.

Next, as illustrated in FIG. 32 that is a sectional view of FIG. 31 as viewed in the direction of the arrow XXXII, the spacer 13 Y is assembled to the lead frames 3 X, 3 Y, and 3 Z.

Next, referring to FIGS. 33 to 36 , a state of assembly of fitting portions of the spacers 13 X and 13 Y and the lead frames 3 X, 3 Y, and 3 Z is sequentially described.

FIG. 33 illustrates fitting portions of the spacer 13 X, the lead-frame coupled body 3 ZZ, and the spacer 13 Y.

FIG. 34 illustrates a state in which the spacer 13 X and the lead-frame coupled body 3 ZZ are fitted to each other so as to complete the temporary assembly.

FIG. 35 illustrates a subsequent state in which the spacer 13 Y is being assembled to the lead-frame coupled body 3 ZZ. FIG. 36 illustrates a state in which the assembly of the spacer 13 X, the lead-frame coupled body 3 ZZ, and the spacer 13 Y is completed.

FIG. 37 is a front view illustrating a state in which the coupling portions 3 Za are removed after the assembly of the spacer 13 X, the lead-frame coupled body 3 ZZ, and the spacer 13 Y is completed. FIG. 38 is a sectional view of FIG. 37 as viewed in a direction of the arrow XXXVIII.

Third Step

Next, as illustrated in FIG. 39 , the internal filling resin 8 that is a mold resin is filled into the internal space of the case 2 .

Next, as illustrated in FIG. 40 and FIG. 41 that is a sectional view of FIG. 40 as viewed in a direction of the arrow XLI, the semi-product is inserted into the case 2 . The positioning portions 3 Xe and 3 Ye are brought into contact with the opening circumferential edge portion 2 d of the case 2 . In a state in which the magnetic detection section 7 is housed in a predetermined position inside the case 2 , the internal filing resin 8 is cured.

For the removal of the coupling portions 3 Za from the lead-frame coupled body 3 ZZ, the coupling portions 3 Za can be removed in the third step. However, the cutting is already completed in the second step as described above. Therefore, the cutting work for the coupling portions 3 Za in a position deeper than the opening 2 c of the case 2 is not required.

Fourth Step

Next, as illustrated in FIG. 42 and FIG. 43 that is a sectional view of FIG. 42 as viewed from a direction of the arrow XLIII, the case 2 including the semi-product housed therein is placed inside a die (not shown) for the exterior resin 9 . Then, by molding, a connector housing for external connection and a sensor exterior part are formed on the case 2 . The opening 2 c side of the case 2 is covered with the exterior resin 9 .

Through the first to fourth steps described above, the rotation sensor 1 of the ninth embodiment is manufactured.