LexDanaLexDanabeta
Inventor

Akira Takashima

Inventor
Kawasaki, JP

Overview

101→
Patents
1977–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 101 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10DInorganic electric semiconductor devices15%
H10BElectronic memory devices13%
H01LSemiconductor devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
G11CStatic stores5%
H10NElectric solid-state devices not otherwise provided for4%
A61KPreparations for medical, dental or toiletry purposes3%
C07KPeptides2%
C23CCoating metallic material2%
PatentTitleYear
10,833,098Semiconductor memory device and method for manufacturing the same with increased storage capacity202010,591,314Rotation sensor202010,403,642Semiconductor device201910,088,013Manufacturing method for multi-layered ring20189,935,122Nonvolatile semiconductor memory device having electron scattering and electron accumulation capacities in charge accumulation layer20189,865,809'Nonvolatile resistance change element'20189,631,947'Rotation sensor'20179,536,583'Magnetic memory, spin element, and spin MOS transistor'20179,391,272'Nonvolatile variable resistance element'20169,379,320'Nonvolatile memory device'20169,349,876'Nonvolatile semiconductor memory'20169,230,625'Magnetic memory, spin element, and spin MOS transistor'20169,147,469'Nonvolatile semiconductor memory device including variable resistance element'20159,084,311'Lighting device'20158,992,744'Lanthanoid aluminate film fabrication method'20158,971,106'Nonvolatile semiconductor memory device including variable resistance element'20158,854,874'Nonvolatile semiconductor memory device including variable resistance element'20148,835,896'Nonvolatile variable resistance element'20148,810,043'Semiconductor device'20148,779,498'Nonvolatile semiconductor memory device'20148,779,503'Nonvolatile semiconductor memory'20148,772,751'Variable resistance semiconductor memory device'20148,764,223'Lighting device'20148,754,467'Semiconductor device, and method for manufacturing semiconductor device'20148,664,632'Memory device'20148,569,823'Semiconductor device and manufacturing method thereof'20138,558,301'Semiconductor device, and method for manufacturing semiconductor device'20138,482,053'Nonvolatile semiconductor memory device with high-K insulating film'20138,355,275'Resistance change memory'20138,331,137'Nonvolatile semiconductor memory device'20128,216,934'Semiconductor device suitable for a stacked structure'20128,193,577'Nonvolatile semiconductor memory device'20128,112,872'Method of manufacturing a coil component'20128,076,785'Semiconductor device'20118,012,315'Lanthanoid aluminate film fabrication method'20117,986,016'Semiconductor device and associated manufacturing methodology for decreasing thermal instability between an insulating layer and a substrate'20117,956,405'Semiconductor storage element and manufacturing method thereof'20117,902,588'Nonvolatile semiconductor memory device and method for manufacturing the same'20117,884,459'Semiconductor device suitable for a stacked structure'20117,863,695'Complementary MISFET semiconductor device having an atomic density ratio aluminum/lanthanum (Al/La) in the gate insulating layer of PMIS is larger than that of the NMIS'20117,842,996'Memory cell of nonvolatile semiconductor memory'20107,821,059'Semiconductor device and method for manufacturing a semiconductor device'20107,804,128'Nonvolatile semiconductor memory device'20107,755,136'Nonvolatile semiconductor memory device and method of manufacturing the same'20107,736,446'Method for manufacturing a lanthanum oxide compound'20107,718,490'Nonvolatile semiconductor storage device and manufacturing method therefor'20107,518,178'Semiconductor memory device'20097,515,028'Coil component'20097,489,006'Nonvolatile semiconductor storage device and manufacturing method therefor'20097,348,644'Semiconductor device and method of manufacturing semiconductor device'20087,300,838'Semiconductor device and method of manufacturing semiconductor device'20077,138,723'Deformable semiconductor device'20067,129,039'Unique dendritic cell-associated C-type lectins, dectin-1 and dectin-2; compositions and uses thereof'20067,071,171'Unique dendritic cell-associated c-type lectins, dectin-1 and dectin-2 compositions and uses thereof'20067,067,254'Diagnosis and treatment of inflammation and hyperactive immune conditions'20067,053,455'Semiconductor device and method of manufacturing semiconductor device'20067,049,692'Stacked semiconductor device'20066,972,487'Multi chip package structure having a plurality of semiconductor chips mounted in the same package'20056,960,827'Semiconductor device and manufacturing method thereof'20056,952,961'Air flow rate measuring device'20056,937,010'Magnetic detector'20056,923,965'Modulators of polysaccharides and uses thereof'20056,869,819'Recognition method of a mark provided on a semiconductor device'20056,852,696'Inhibitors of glycosaminoglycans'20056,812,066'Semiconductor device having an interconnecting post formed on an interposer within a sealing resin'20046,781,241'Semiconductor device and manufacturing method thereof'20046,777,799'Stacked semiconductor device and method of producing the same'20046,740,970'Semiconductor device with stack of semiconductor chips'20046,653,285'Modulators of polysaccharides and uses thereof'20036,621,169'Stacked semiconductor device and method of producing the same'20036,528,348'Semiconductor device having protruding electrodes higher than a sealed portion'20036,489,676'Semiconductor device having an interconnecting post formed on an interposer within a sealing resin'20026,472,746'Semiconductor device having bonding wires serving as external connection terminals'20026,457,633'Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls'20026,404,062'Semiconductor device and structure and method for mounting the same'20026,388,333'Semiconductor device having protruding electrodes higher than a sealed portion'20026,383,842'Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom'20026,281,571'Semiconductor device having an external connection electrode extending through a through hole formed in a substrate'20016,166,433'Resin molded semiconductor device and method of manufacturing semiconductor package'20006,160,313'Semiconductor device having an insulating substrate'20006,046,158'Unique dendritic cell-associated C-type lectins, dectin-1 and dectin-2; compositions and uses thereof'20005,970,161'Speaker system for a video monitor and a video monitor equipped with a speaker system'19995,834,831'Semiconductor device with improved heat dissipation efficiency'19985,821,613'Semiconductor device in which semiconductor chip has bottom surface with reduced level of organic compounds relatively to other sufaces thereof'19985,801,439'Semiconductor device and semiconductor device unit for a stack arrangement'19985,760,471'Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package'1998D0387360'Backhoe'1997D0383469'Backhoe'19975,648,681'Semiconductor device having a supporting lead to support a bypass lead portion'19975,476,012'Air flow sensor with swirl generator'19955,447,888'Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins'1995D0341535'Letter opener'19934,984,466'Semiconductor pressure sensor'19914,961,371'Hydraulic circuit for a backhoe'1990D0309313'Backhoe'19904,771,855'Backhoe vehicle'19884,735,494'Zoom lens control system and method for zooming control'19884,728,251'Complete swivel type backhoe vehicle'19884,695,893'Automatic focusing apparatus'19874,564,796'Driving circuit for a stepping motor'19864,005,243'Freely machinable aluminum alloy'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988–1997Based in Sakai, JP· patent location history
1991–2020Patents assigned to MITSUBISHI ELECTRIC CORP (6)· patent assignee history
1995–2006Patents assigned to FUJITSU LTD (26)· patent assignee history
1995–2014Based in Kawasaki, JP· patent location history
2000–2006Patents assigned to UNIV TEXAS (7)· patent assignee history
2005–2020Based in Tokyo, JP· patent location history
2006–2017Patents assigned to TOSHIBA KK (37)· patent assignee history
2006–2008Based in Sagamihara, JP· patent location history
2009–2020Based in Fuchu, JP· patent location history
2011–2016Patents assigned to TAKASHIMA AKIRA (15)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK372006–2017
FUJITSU LTD261995–2006
TAKASHIMA AKIRAself152011–2016
UNIV TEXAS72000–2006
MITSUBISHI ELECTRIC CORP61991–2020
Locations
LocationPatentsSpan
Kawasaki, JP301995–2014
Fuchu, JP282009–2020
Tokyo, JP152005–2020
Sakai, JP61988–1997
Sagamihara, JP32006–2008