Method and system of layout placement based on multilayer gridlines

The present application relates to U.S. patent application Ser. No. 14/051,881, filed on Oct. 11, 2013, titled “STANDARD CELLS FOR PREDETERMINED FUNCTION HAVING DIFFERENT TYPES OF LAYOUT,” and the disclosure of which is incorporated herein by reference in its entirety.

An integrated circuit (IC) is fabricated according to a layout design usable to form a plurality of masks for selectively forming or removing various layers of features, such as active regions, gate electrodes, various layers of isolation structures, and/or various layers of conductive structures. Many fabrication processes are available to increase the spatial resolution of various layers of features and thus allow layout patterns to have a finer spatial resolution requirement in a corresponding layout. Some approaches usable for increasing the spatial resolution include using one or more fabrication processes such as ultraviolet lithography, extreme ultraviolet lithography, electron-beam lithography, and/or multiple-patterning. In many applications, the finest available spatial resolutions of various layers are different.

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a diagram of a portion of a layout design showing standard cell layouts placed based on two sets of grid lines, which extend along a first direction, in accordance with some embodiments.

FIG. 2 is a diagram of a portion of another layout design showing standard cell layouts placed based on two sets of grid lines, which extend along a direction corresponding to the first direction of FIG. 1 , in accordance with some embodiments.

FIG. 3 is a diagram of a portion of yet another layout design showing standard cell layouts placed based on two sets of grid lines, which extend along a second direction, in accordance with some embodiments.

FIG. 4 is a diagram of a portion of yet another layout design showing standard cell layouts placed based on two sets of grid lines, which extend along a direction corresponding to the second direction of FIG. 3 , in accordance with some embodiments.

FIG. 5A is a flow chart of a method of forming a layout design in accordance with some embodiments.

FIG. 5B is a flow chart of another method of forming a layout design in accordance with some embodiments.

FIG. 6 is a block diagram of a system of forming a layout design in accordance with some embodiments.

The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

In the design of an integrated circuit, standard cells having predetermined functions are used. Pre-designed layouts of standard cells are stored in cell libraries. When designing an integrated circuit, the pre-designed layouts of the standard cells are retrieved from the cell libraries and placed into desired locations on an integrated circuit layout design. Routing is then performed to connect the standard cell layouts with each other by layout patterns corresponding to metal tracks. The integrated circuit layout design is thereafter used to manufacture the integrated circuit using a predetermined semiconductor manufacturing process. In some embodiments, a standard cell is a logic gate cell. In some embodiments, a logic gate cell includes an AND, OR, NAND, NOR, XOR, INV, AND-OR-Invert (AOI), OR-AND-Invert (OAI), MUX, Flip-flop, BUFF, Latch, delay, or clock cells.

In accordance with one or more embodiments of this disclosure, in order to accommodate different spatial resolutions of various component layers, a standard cell having a plurality of different standard cell layouts in a cell library. One of the plurality of different standard cell layouts is selected to be placed in a region of a layout design according to a grid line pattern of the region. The grid line pattern refers to various sets of grid lines each correspond to placement of layout patterns of different layout layers. Accordingly, a plurality of standard cell layouts of a same standard cell functionality is available for forming a layout design and thus is usable to avoid synchronizing the line patterns of the sets of grid lines by loosening one or more of the spatial resolutions of the corresponding component layers.

FIG. 1 is a diagram of a portion of a layout design 100 showing standard cell layouts 110 , 120 , and 130 placed based on two sets of grid lines 140 a - 140 j and 150 a - 150 p in accordance with some embodiments. The two sets of grid lines 140 a - 140 j and 150 a - 150 p extend along a direction Y. Three standard cell layouts 110 , 120 , and 130 are depicted in FIG. 1 as an example. In some embodiments, there are more or less than three standard cell layouts in a layout design. Moreover, details of standard cell layouts 110 , 120 , and 130 are simplified in order to facilitate the illustration of the present disclosure.

Standard cell layouts 110 , 120 , and 130 correspond to a same standard cell functionality and have the same size. In other words, standard cell layouts 110 , 120 , and 130 correspond to the same circuit from the circuit schematic perspective, have the same cell height and cell width in the layout design, but have different layout patterns. Standard cell layout 110 has cell boundaries 110 a and 110 b extending along direction Y and cell boundaries 110 c and 110 d extending along a direction X. Standard cell layout 110 has layout patterns 112 a - 112 d and 114 a - 114 b . Layout patterns 112 a - 112 d are part of a first layout layer corresponding to fabricating components of a first component layer of the resulting integrated circuit. Layout patterns 114 a - 114 b are part of a second layout layer corresponding to fabricating components of a second component layer of the resulting integrated circuit. In some embodiments, the first component layer and the second component layer each correspond to a different one of the following component layers of the integrated circuit: a gate structure layer; a first conductive layer over the gate structure layer; and a second conductive layer over the first conductive layer.

Standard cell layout 120 has cell boundaries 120 a and 120 b extending along direction Y and cell boundaries 120 c and 120 d extending along a direction X. Standard cell layout 120 has layout patterns 122 a - 122 d corresponding to layout patterns 112 a - 112 d and layout patterns 124 a - 124 b corresponding to layout patterns 114 a and 114 b . Layout patterns 122 a - 122 d are part of the first layout layer, and layout patterns 124 a - 124 b are part of the second layout layer. Moreover, standard cell layout 130 has cell boundaries 130 a and 130 b extending along direction Y and cell boundaries 130 c and 130 d extending along a direction X. Standard cell layout 130 has layout patterns 132 a - 132 d corresponding to layout patterns 112 a - 112 d and layout patterns 134 a - 134 b corresponding to layout patterns 114 a and 114 b . Layout patterns 132 a - 132 d are part of the first layout layer, and layout patterns 134 a - 134 b are part of the second layout layer.

Layout patterns 112 a - 112 d , 122 a - 122 d , and 132 a - 132 d are placed to be aligned with corresponding grid lines 140 a - 140 b . Layout patterns 114 a - 114 b , 124 a - 124 b , and 134 a - 134 b are placed to be aligned with corresponding grid lines 150 c , 150 e , 150 g , 150 i , 1501 , and 150 n . In this disclosure, a layout pattern is aligned with a grid line if a center line of the layout pattern overlaps the grid line. In the embodiment depicted in FIG. 1 , cell boundary 110 b overlaps cell boundary 120 a and grid line 140 d , and layout patterns 112 d and 122 a are thus merged. Also, cell boundary 120 b overlaps cell boundary 130 a and grid line 140 g , and layout patterns 122 d and 132 a are thus merged

The set of gridlines 140 a - 140 j has a line pitch Pt 12 . In some embodiments, line pitch Pt 12 is set to minimize an area of the resulting integrated circuit permitted by a predetermined manufacturing process. In the present disclosure, such line pitch Pt 12 is also referred to as an optimized fine pitch of the first layout layer. The set of gridlines 150 a - 150 p has a line pitch Pt 14 . In some embodiments, line pitch Pt 14 is set to minimize an area of the resulting integrated circuit permitted by the predetermined manufacturing process. In the present disclosure, such line pitch Pt 14 is also referred to as an optimized fine pitch of the second layout layer. A ratio of line pitches Pt 12 to Pt 14 is 3:2.

The region occupied by standard cell layout 110 (which will also be referred to as region 110 ) has a first predetermined type of line pattern of the first set of grid lines 140 a - 140 d with respect to the second set of grid lines 150 b - 150 f . In the embodiment depicted in FIG. 1 , the first predetermined type of line pattern corresponds to four grid lines 140 a - 140 d of the first set of grid lines and five grid lines 150 b - 150 f of the second set of grid lines arranged in a manner such that grid line 140 a overlaps grid line 150 b and the left cell boundary 112 a of region 110 . The region occupied by standard cell layout 130 (which will also be referred to as region 130 ) thus also has the first predetermined type of line pattern, because grid lines 140 g - 140 j of the first set of grid lines and five grid lines 150 k - 150 o of the second set of grid lines arranged in a manner such that grid line 140 g overlaps grid line 150 k and the left cell boundary 132 a of region 130 .

The standard cell layouts 110 and 130 are thus replicas of a first predetermined type of standard cell layout, which has corresponding layout patterns 112 a - 112 d or 132 a - 132 d and 114 a - 114 b or 134 a - 134 b placed based on the first predetermined type of line pattern.

The region occupied by standard cell layout 120 (which will also be referred to as region 120 ) has a second predetermined type of line pattern of the first set of grid lines 140 d - 140 g with respect to the second set of grid lines 150 g - 150 k . In the embodiment depicted in FIG. 1 , the second predetermined type of line pattern corresponds to four grid lines 140 d - 140 g of the first set of grid lines and five grid lines 150 g - 150 k of the second set of grid lines arranged in a manner such that grid line 140 g overlaps grid line 150 k and the right cell boundary 122 b of region 120 .

The standard cell layout 120 is thus a replica of a second predetermined type of standard cell layout, which has corresponding layout patterns 122 a - 122 d and 124 a - 124 b placed based on the second predetermined type of line pattern.

In some embodiments, a line pattern of a first set of grid lines with respect to a second set of grid lines within a standard cell region corresponds to one of K 10 different predetermined line patterns. K 10 is an integer equal to or greater than two. K 10 different standard cell layouts corresponding to a same standard cell functionality are designed based on the K 10 different predetermined line patterns. Therefore, if a layout region has a line pattern matching a k 10 -th predetermined line pattern of K 10 predetermined line patterns, a k 10 -th standard cell layout of the K 10 standard cell layouts is placed at the region. The index “k 10 ” is an order index ranging from 1 to K 10 .

In some embodiments, a ratio of the first line pitch, such as line pitch Pt 12 , to the second line pitch, such as line pitch Pt 14 , is M 10 :N 10 , where M 10 and N 10 are positive integers. The number K 10 of different types of line pattern and/or the number K of different type of standard cell layout is determinable based on the equation:

K ⁢ ⁢ 10 = L ⁢ ⁢ 10 M ⁢ ⁢ 10 ,

where L 10 is a least common multiple of M 10 and N 10 . In some embodiments, the standard cell layouts are arranged in a manner such that two cell boundaries of the k 10 -th standard cell layout that extends along direction Y overlap two corresponding grid lines of the first set of grid lines.

In some embodiments, two of the K 10 standard cell layouts are mirror-image counterparts of each other and still counted as two different types of standard cell layout in this disclosure.

FIG. 2 is a diagram of a portion of another layout design 200 showing standard cell layouts 210 , 220 , and 230 placed based on two sets of grid lines 240 and 250 , which extend along direction Y, in accordance with some embodiments. Layout design 200 includes a set of layout patterns 212 , 222 , and 232 corresponding to layout patterns 112 a - 112 d , 122 a - 122 d , and 132 a - 132 d in FIG. 1 . The set of grid lines 240 has a line pitch Pt 22 , and the set of grid lines 250 has a line pitch Pt 24 . The sets of grid lines 240 and 250 and line pitches Pt 22 and Pt 24 correspond to the sets of grid lines 140 a - 140 j and 150 a - 150 p and line pitches Pt 12 and Pt 14 in FIG. 1 . Detailed description of layout patterns 212 , 222 , and 232 , grid lines 240 and 250 , and line pitches Pt 22 and Pt 24 is thus omitted. Layout patterns placed to be aligned with one or more of grid lines 250 are omitted in FIG. 2 to avoid obstructing the illustration of grid lines and standard cell layouts 210 , 220 , and 230 .

Compared with the embodiment in FIG. 1 , standard cell layouts 210 , 220 , and 230 have different sizes. In some embodiments, standard cell layouts 210 , 220 , and 230 correspond to different standard cell functionalities, such as different logical functions or same logical function with different driving capabilities.

In the embodiment depicted in FIG. 2 , a ratio of line pitches Pt 22 to Pt 24 is 3:2. Therefore, the line pattern of the two sets of grid lines 240 and 250 repeats every distance R 20 corresponding to twice the line pitch Pt 22 or thrice the line pitch Pt 24 . Therefore, some of the standard cell layouts usable in layout design 200 are arranged to have cell widths of integer multiple of distance R 20 . For example, standard cell layout 210 has a width W 21 equal to a single distance R 20 ; standard cell layout 220 has a width W 22 equal to the double of distance R 20 ; and standard cell layout 230 has a width W 23 equal to the triple of distance R 20 . The cell widths are measurable along direction X.

In some embodiments, a ratio of the first line pitch, such as line pitch Pt 22 , to the second line pitch, such as line pitch Pt 24 , is M 20 :N 20 , where M 20 and N 20 are positive integers. Some of the standard cell layouts have cell widths being integer multiples of distance R 20 . Distance R 20 is determinable based on the equation:

R ⁢ ⁢ 20 = L ⁢ ⁢ 20 M ⁢ ⁢ 20 · Pt ⁢ ⁢ 22 ,

where L 20 is a least common multiple of M 20 and N 20 .

In some embodiments, the first component layer and the second component layer each correspond to a different one of the following component layers of the integrated circuit: a fin structure layer for FinFETs; a first conductive layer over the fin structure layer; and a second conductive layer over the first conductive layer.

FIG. 3 is a diagram of a portion of yet another layout design 300 showing standard cell layouts 310 , 320 , and 330 placed based on two sets of grid lines 340 and 350 , which extend along a direction X, in accordance with some embodiments. FIG. 3 depicts an embodiment similar to the embodiment of FIG. 1 except the relevant grid lines being along a different direction.

Layout design 300 includes a set of layout patterns 312 , 322 , and 332 corresponding to fabricating a third component layer of the integrated circuit and a set of layout patterns 314 , 324 , and 334 corresponding to fabricating a fourth component layer of the integrated circuit. Layout patterns 312 , 322 , and 332 are placed to be aligned with corresponding grid lines of the set of grid lines 340 . Layout patterns 314 , 324 , and 334 are placed to be aligned with corresponding grid lines of the set of grid lines 350 . The set of grid lines 340 has a line pitch Pt 32 , and the set of grid lines 350 has a line pitch Pt 34 . In some embodiments, the third component layer and the fourth component layer each correspond to a different one of the following component layers of the integrated circuit: a fin structure layer for FinFETs; a first conductive layer over the fin structure layer; and a second conductive layer over the first conductive layer.

Compared with grid lines 140 a - 140 j and 150 a - 150 p in FIG. 1 , grid lines 340 and 350 extend along direction X rather than direction Y. A ratio of line pitches Pt 32 to Pt 34 is 3:2. The region occupied by standard cell layout 310 and standard cell layout 330 has a third predetermined type of line pattern of the set of grid lines 340 with respect to the set of grid lines 350 in a manner similar to the first predetermined type of line pattern advanced above in conjunction with FIG. 1 . The standard cell layouts 310 and 330 are thus replicas of a third predetermined type of standard cell layout. The region occupied by standard cell layout 320 has a fourth predetermined type of line pattern of the set of grid lines 340 with respect to the set of grid lines 350 in a manner similar to the second predetermined type of line pattern advanced above in conjunction with FIG. 1 . The standard cell layout 320 is thus a replica of a fourth predetermined type of standard cell layout.

In some embodiments, a line pattern of a third set of grid lines with respect to a fourth set of grid lines within a standard cell region corresponds to one of K 30 different predetermined line patterns. K 30 is an integer equal to or greater than two. K 30 different standard cell layouts corresponding to a same standard cell functionality are designed based on the K 30 different predetermined line patterns. Therefore, if a layout region has a line pattern matching a k 30 -th predetermined line pattern of K 30 predetermined line patterns, a k 30 -th standard cell layout of the K 30 standard cell layouts is placed at the region. The index “k 30 ” is an order index ranging from 1 to K 30 .

In some embodiments, a ratio of the third line pitch, such as line pitch Pt 32 , to the fourth line pitch, such as line pitch Pt 34 , is M 30 :N 30 , where M 30 and N 30 are positive integers. The number K 30 of different types of line pattern and/or the number K 30 of different type of standard cell layout is determinable based on the equation:

K ⁢ ⁢ 30 = L ⁢ ⁢ 30 M ⁢ ⁢ 30 ,

where L 30 is a least common multiple of M 30 and N 30 . In some embodiments, the standard cell layouts are arranged in a manner such that two cell boundaries of the k 30 -th standard cell layout that extends along direction X overlap two corresponding grid lines of the third set of grid lines.

FIG. 4 is a diagram of a portion of yet another layout design 400 showing standard cell layouts 410 , 420 , and 430 placed based on two sets of grid lines 440 and 450 , which extend along direction X, in accordance with some embodiments. FIG. 4 depicts an embodiment similar to the embodiment of FIG. 2 except the grid lines being along a different direction.

Layout design 400 includes a set of layout patterns 412 , 422 , and 432 corresponding to layout patterns 312 , 322 , and 332 in FIG. 3 . The set of grid lines 440 has a line pitch Pt 42 , and the set of grid lines 450 has a line pitch Pt 44 . The sets of grid lines 440 and 450 and line pitches Pt 42 and Pt 44 correspond to the sets of grid lines 340 and 350 and line pitches Pt 32 and Pt 34 in FIG. 3 . Detailed description of layout patterns 412 , 422 , and 432 , grid lines 440 and 450 , and line pitches Pt 42 and Pt 44 is thus omitted. Layout patterns placed to be aligned with one or more of grid lines 350 are omitted in FIG. 3 to avoid obstructing the illustration of grid lines and standard cell layouts 410 , 420 , and 430 .

Compared with the embodiment in FIG. 3 , standard cell layouts 410 , 420 , and 430 have different sizes. In some embodiments, standard cell layouts 410 , 420 , and 430 correspond to different standard cell functionalities, such as different logical functions or same logical function with different driving capabilities.

In the embodiment depicted in FIG. 4 , a ratio of line pitches Pt 42 to Pt 44 is 3:2. Therefore, the line pattern of the two sets of grid lines 440 and 450 repeats every distance R 40 corresponding to twice the line pitch Pt 42 or thrice the line pitch Pt 44 . Therefore, some of the standard cell layouts usable in layout design 400 are arranged to have cell heights of integer multiple of distance R 40 . For example, standard cell layout 410 has a height H 21 equal to a single distance R 40 ; standard cell layout 420 has a height H 22 equal to the double of distance R 40 ; and standard cell layout 430 has a height H 23 equal to the triple of distance R 40 . The cell widths are measurable along direction Y.

In some embodiments, a ratio of the first line pitch, such as line pitch Pt 42 , to the second line pitch, such as line pitch Pt 44 , is M 40 :N 40 , where M 40 and N 40 are positive integers. Some of the standard cell layouts have cell heights being integer multiples of distance R 40 . Distance R 40 is determinable based on the equation:

R ⁢ ⁢ 40 = L ⁢ ⁢ 40 M ⁢ ⁢ 40 · Pt ⁢ ⁢ 42 ,

where L 40 is a least common multiple of M 40 and N 40 .

FIG. 5A is a flow chart of a method 500 A of forming a layout design, in accordance with some embodiments. It is understood that additional operations may be performed before, during, and/or after the method 500 A depicted in FIG. 5A , and that some other processes may only be briefly described herein. In some embodiments, the method 500 A is usable to form layout designs, such as layout design 100 and/or 300 in FIGS. 1 and 3 .

The method begins with operation 510 , where a line pattern of a first set of grid lines with respect to a second set of grid lines within a region of the layout design is identified. For example, a region corresponding to standard cell layout 110 or 120 in FIG. 1 or standard cell layout 310 or 320 in FIG. 3 are analyzed to determine a line pattern of grid lines 140 a - 140 j versus grid lines 150 a - 150 p or grid lines 340 versus grid lines 350 .

As illustrated in conjunction with FIGS. 1 and 3 , the first set of grid lines, such as grid lines 140 a - 140 j extending along a direction Y or grid lines 340 extending along a direction X, corresponds to placement of a first set of layout patterns of a first layout layer of the layout design. The second set of grid lines, such as grid lines 150 a - 150 p extending along direction Y or grid lines 350 extending along direction X, corresponds to placement of a second set of layout patterns of a second layout layer of the layout design. The region of the layout design is sized to fit one of K different standard cell layouts corresponding to a same standard cell functionality. K is an integer equal to or greater than two and corresponds to K 10 in FIG. 1 or K 30 in FIG. 3 .

The first set of grid lines has a first line pitch Pt 12 or Pt 32 , and the second set of grid lines has a second line pitch Pt 32 or Pt 34 . As illustrated in conjunction with FIGS. 1 and 3 , a ratio of the first line pitch to the second line pitch is set to be M:N, where M and N are positive integers. Therefore, value K is determinable according to the equation:

K = L M ,

where L is a least common multiple of M and N. In some embodiments, the first pitch is greater than the second pitch, and thus M is greater than N. In some embodiments, M and N correspond to M 10 and N 10 illustrated in conjunction with FIG. 1 or M 30 and N 30 illustrated in conjunction with FIG. 3 .

In some embodiments, the K predetermined line patterns includes a common placement for the first set of grid lines having and K different placements for the second set of grid lines. For example, the placement of grid lines 140 a - 140 j in standard cell layout 110 and 120 and 130 are all the same, but the placement of grid lines 150 b - 150 o in standard cell layout 110 and 120 and 130 corresponds to two different arrangements, where standard cell layouts 110 and 130 has a first type of arrangement, and standard cell layout 120 has the other type of arrangement.

The method proceeds to operation 520 , where a k-th standard cell layout of the K standard cell layouts is placed at the region of the layout design if the line pattern is determined to match a k-th predetermined line pattern of K predetermined line patterns. The index “k” is an order index ranging from 1 to K. In some embodiments, the number K and the order index “k” correspond to K 10 and k 10 illustrated in conjunction with FIG. 1 or K 30 and k 30 illustrated in conjunction with FIG. 3 . In some embodiments, K is determinable based on the equation:

K = L M ,

where L is a least common multiple of M and N.

In the resulting integrated circuit manufactured according to the layout design generated based on method 500 A, the first set of components at the first component layer are aligned with the first set of grid lines and having center-to-center pitch corresponding to line pitch of the first set of grid lines. Also, in the resulting integrated circuit, the second set of components at the second component layer are aligned with the second set of grid lines and having center-to-center pitch corresponding to line pitch of the second set of grid lines. In some embodiments, K different standard cell layouts corresponding to the same functionality are used, and thus the resulting integrated circuit includes at least K standard cells corresponding to the K different standard cell layouts. In some embodiments, the K different standard cells have a common placement for the first set of grid lines and K different placements for the second set of grid lines.

FIG. 5B is a flow chart of another method 500 B of forming a layout design, in accordance with some embodiments. It is understood that additional operations may be performed before, during, and/or after the method 500 B depicted in FIG. 5B , and that some other processes may only be briefly described herein. In some embodiments, the method 500 B is usable to form layout designs, such as layout design 200 and/or 400 in FIGS. 2 and 4 .

The method begins with operation 530 , where a line pattern of a first set of grid lines with respect to a second set of grid lines within a region of the layout design is identified. For example, a region corresponding to standard cell layout 210 , 220 , or 230 in FIG. 2 or standard cell layout 410 , 420 , or 430 in FIG. 4 are analyzed to determine a line pattern of grid lines 240 versus grid lines 250 or grid lines 440 versus grid lines 450 . In some embodiments, it is identified in operation 530 that a ratio of the first line pitch, such as pitch Pt 22 or Pt 42 , to the second line pitch, such as pitch Pt 24 or Pt 44 , is M:N, where M and N correspond to M 20 and N 20 illustrated in conjunction with FIG. 2 or M 40 and N 40 illustrated in conjunction with FIG. 4 .

The method proceeds to operation 540 , where a plurality of standard cell layouta is placed at the region of the layout design. The plurality of standard cell layouts has different cell widths measurable along a second direction or different cell heights measurable along the second direction. In some embodiments, the plurality of standard cell layouts corresponds to standard cell layouts 210 , 220 , or 230 in FIG. 2 or 410, 420, and 430 in FIG. 4 . The cell widths or the cell heights of the plurality of standard cell layouts are integer multiples of R determinable based on the equation:

R = L M · Pt ,

where L is a least common multiple of M and N, and Pt is the first line pitch.

In the resulting integrated circuit manufactured according to the layout design generated based on method 500 B, the first set of components at the first component layer are aligned with the first set of grid lines and having center-to-center pitch corresponding to line pitch of the first set of grid lines. Also, in the resulting integrated circuit, the second set of components at the second component layer are aligned with the second set of grid lines and having center-to-center pitch corresponding to line pitch of the second set of grid lines.

For method 500 A and 500 B, in some embodiments, the first component layer and the second component layer each correspond to a different one of the following component layers of the integrated circuit: a gate structure layer; a first conductive layer over the gate structure layer; and a second conductive layer over the first conductive layer.

For method 500 A and 500 B, in some embodiments, the first component layer and the second component layer each correspond to a different one of the following component layers of the integrated circuit: a fin structure layer for FinFETs; a first conductive layer over the fin structure layer; and a second conductive layer over the first conductive layer.

FIG. 6 is a functional block diagram of a system 600 of forming a layout design in accordance with some embodiments. System 600 is usable for implementing one or more operations of the method 500 A and method 500 B disclosed in FIGS. 5A and 5B , and further explained in conjunction with FIGS. 1-4 .

System 600 includes a first computer system 610 , a second computer system 620 , a networked storage device 630 , and a network 640 connecting the first computer system 610 , the second computer system 620 , and the networked storage device 630 . In some embodiments, one or more of the second computer system 620 , the storage device 630 , and the network 640 are omitted.

The first computer system 610 includes a hardware processor 612 communicatively coupled with a non-transitory, computer readable storage medium 614 encoded with, i.e., storing, a set of instructions 614 a , a layout design 614 b , or any intermediate data 614 c for executing the set of instructions 614 a . The processor 612 is electrically and communicatively coupled with the computer readable storage medium 614 . The processor 612 is configured to execute the set of instructions 614 a encoded in the computer readable storage medium 614 in order to cause the computer 610 to be usable as a layout designing tool for performing a method 500 A as described in conjunction with FIG. 5A and/or for performing a method 500 B as described in conjunction with FIG. 5B .

In some embodiments, the set of instructions 614 a , the layout design 614 b , or the intermediate data 614 c are stored in a non-transitory storage medium other than storage medium 614 . In some embodiments, some or all of the set of instructions 614 a , the layout design 614 b , or the intermediate data 614 c are stored in a non-transitory storage medium in networked storage device 630 or second computer system 620 . In such case, some or all of the set of instructions 614 a , the layout design 614 b , or the intermediate data 614 c stored outside computer 610 is accessible by the processor 612 through the network 640 .

In some embodiments, the processor 612 is a central processing unit (CPU), a multi-processor, a distributed processing system, an application specific integrated circuit (ASIC), and/or a suitable processing unit.

In some embodiments, the computer readable storage medium 614 is an electronic, magnetic, optical, electromagnetic, infrared, and/or a semiconductor system (or apparatus or device). For example, the computer readable storage medium 614 includes a semiconductor or solid-state memory, a magnetic tape, a removable computer diskette, a random access memory (RAM), a read-only memory (ROM), a rigid magnetic disk, and/or an optical disk. In some embodiments using optical disks, the computer readable storage medium 614 includes a compact disk-read only memory (CD-ROM), a compact disk-read/write (CD-R/W), and/or a digital video disc (DVD).

The computer system 610 includes, in at least some embodiments, an input/output interface 616 and a display unit 617 . The input/output interface 616 is coupled to the processor 612 and allows the circuit designer to manipulate the first computer system 610 . In at least some embodiments, the display unit 617 displays the status of executing the set of instructions 614 a and, in at least some embodiments, provides a Graphical User Interface (GUI). In at least some embodiments, the display unit 617 displays the status of executing the set of instructions 614 a in a real time manner. In at least some embodiments, the input/output interface 616 and the display 617 allow an operator to operate the computer system 610 in an interactive manner.

In at least some embodiments, the computer system 600 also includes a network interface 618 coupled to the processor 612 . The network interface 618 allows the computer system 610 to communicate with the network 640 , to which one or more other computer systems are connected. The network interface includes wireless network interfaces such as BLUETOOTH, WIFI, WIMAX, GPRS, or WCDMA; or wired network interface such as ETHERNET, USB, or IEEE-1394.

In accordance with one embodiment, a method of forming a layout design for fabricating an integrated circuit is disclosed. The method includes identifying a line pattern of a first set of grid lines with respect to a second set of grid lines within a region of the layout design; and placing a k-th standard cell layout of the K standard cell layouts at the region of the layout design if the line pattern is determined to match a k-th predetermined line pattern of K predetermined line patterns. K is an integer equal to or greater than two, and k is an order index ranging from 1 to K. The region of the layout design is sized to fit one of K different standard cell layouts corresponding to a same standard cell functionality. The first set of grid lines extends along a first direction and corresponding to placement of a first set of layout patterns of a first layout layer of the layout design. The second set of grid lines extends along the first direction and corresponding to placement of a second set of layout patterns of a second layout layer of the layout design. The first set of grid lines has a first line pitch, and the second set of grid lines has a second line pitch different from the first line pitch. At least one of the above operations is performed by a hardware processor.

In accordance with one embodiment, a method of forming a layout design for fabricating an integrated circuit is disclosed. The method includes identifying a line pattern of a first set of grid lines with respect to a second set of grid lines within a region of the layout design; and placing a plurality of standard cell layouts at the region of the layout design. The first set of grid lines extends along a first direction and corresponding to placement of a first set of layout patterns of a first layout layer of the layout design. The second set of grid lines extends along the first direction and corresponding to placement of a second set of layout patterns of a second layout layer of the layout design. The first set of grid lines has a first line pitch, and the second set of grid lines has a second line pitch different from the first line pitch. The plurality of standard cell layouts has different cell widths measurable along a second direction or has different cell heights measurable along the second direction. A ratio of the first line pitch to the second line pitch is M:N, M and N being positive integers. The cell widths or the cell heights of the plurality of standard cell layouts are integer multiples of R.

R = L M · Pt ,

where L is a least common multiple of M and N, and Pt is the first line pitch.

In accordance with another embodiment, a system of forming a layout design includes a non-transitory storage medium encoded with a set of instructions; and a hardware processor communicatively coupled with the non-transitory storage medium and configured to execute the set of instruction. The set of instruction is configured to cause the processor to identify a line pattern of a first set of grid lines with respect to a second set of grid lines within a region of a layout design, and to place a k-th standard cell layout of the K standard cell layouts at the region of the layout design if the line pattern is determined to match a k-th predetermined line pattern of K predetermined line patterns. K is an integer equal to or greater than two, and k is an order index ranging from 1 to K. The region of the layout design is sized to fit one of K different standard cell layouts corresponding to a same standard cell functionality. The first set of grid lines extends along a first direction and corresponding to placement of a first set of layout patterns of a first layout layer of the layout design. The second set of grid lines extends along the first direction and corresponding to placement of a second set of layout patterns of a second layout layer of the layout design. The first set of grid lines has a first line pitch, and the second set of grid lines has a second line pitch different from the first line pitch.

In accordance with another embodiment, a system of forming a layout design includes a non-transitory storage medium encoded with a set of instructions; and a hardware processor communicatively coupled with the non-transitory storage medium and configured to execute the set of instruction. The set of instruction is configured to cause the processor to identify a line pattern of a first set of grid lines with respect to a second set of grid lines within a region of a layout design, and to place a plurality of standard cell layouts at the region of the layout design. The first set of grid lines extends along a first direction and corresponding to placement of a first set of layout patterns of a first layout layer of the layout design. The second set of grid lines extends along the first direction and corresponding to placement of a second set of layout patterns of a second layout layer of the layout design. The first set of grid lines has a first line pitch, and the second set of grid lines has a second line pitch different from the first line pitch. The plurality of standard cell layouts has different cell widths measurable along a second direction or has different cell heights measurable along the second direction. A ratio of the first line pitch to the second line pitch is M:N, M and N being positive integers. The cell widths or the cell heights of the plurality of standard cell layouts are integer multiples of R.

R = L M · Pt ,

where L is a least common multiple of M and N, and Pt is the first line pitch.

In accordance with another embodiment, an integrated circuit includes K different standard cells corresponding to a same standard cell functionality, where K is a integer equal to or greater than two. A k-th standard cell of the K different standard cells includes a first set of components at a first component layer extending along a first direction; and a second set of components at a second component layer extending along the first direction. Index k is an order index ranging from 1 to K. The first set of components is aligned with one or more of a first set of grid lines, where the first set of grid lines has a first line pitch. The second set of components is aligned with one or more of a second set of grid lines, where the second set of grid lines has a second line pitch different from the first line pitch. The K different standard cells have a same placement for the first set of grid lines. The K different standard cells have K different placements for the second set of grid lines.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.