Light-guiding cover structure

1. Field of the Invention

The instant disclosure relates to a top cover structure, and more particularly, to a light-guiding cover structure using a plurality of embedded optical fiber cables.

2. Description of Related Art

In the semiconductor fabricating process, some small particles and defects are unavoidable. As the size of devices shrinks and the integration of circuits increases gradually, those small particles or defects affect the property of the integrated circuits more seriously.

For improving the reliability of semiconductor devices, a plurality of tests is performed continuously to find the root cause of the defects or particles. Then, process parameters can be tuned correspondingly to reduce a presence of defects or particles so as to improve the yield and reliability of the semiconductor fabricating process.

One aspect of the instant disclosure relates to a light-guiding cover structure using a plurality of embedded optical fiber cables in order to enhance the aspect of the LED package chip classification system.

One of the embodiments of the instant disclosure provides a light-guiding cover structure, comprising: a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a plurality of light-guiding groups, wherein each light-guiding group includes a plurality of optical fiber cables received in the corresponding receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit.

Another one of the embodiments of the instant disclosure provides a light-guiding cover structure, comprising: a top cover unit and a light-guiding unit. The top cover unit has at least one receiving space formed therein. The light-guiding unit includes a plurality of optical fiber cables received in the at least one receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit.

Therefore, the optical fiber cables received in the corresponding receiving space or in the at least one receiving sapce, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.

To further understand the techniques, means and effects of the instant disclosure applied for achieving the prescribed objectives, the following detailed descriptions and appended drawings are hereby referred, such that, through which, the purposes, features and aspects of the instant disclosure can be thoroughly and concretely appreciated. However, the appended drawings are provided solely for reference and illustration, without any intention to limit the instant disclosure.

FIG. 1A shows a perspective, schematic view of the light-guiding cover structure of the instant disclosure;

FIG. 1B shows a cross-sectional view taken along the section line 1 B- 1 B of FIG. 1A ;

FIG. 1C shows a perspective, schematic view of the top cover unit of the light-guiding cover structure of the instant disclosure;

FIG. 2A shows a perspective, schematic view of the LED package chip classification system of the instant disclosure;

FIG. 2B shows a top, schematic view of the LED package chip classification system of the instant disclosure;

FIG. 2C shows a perspective, schematic view of the first rotation unit or the second rotation unit of the LED package chip classification system of the instant disclosure;

FIG. 2 D(A) shows a lateral, cross-sectional, schematic view of before using the chip test unit to test the LED package chip of the instant disclosure;

FIG. 2 D(B) shows a lateral, cross-sectional, schematic view of when the chip test unit used to test the LED package chip of the instant disclosure;

FIG. 2 D(C) shows a lateral, cross-sectional, schematic view of after using the chip test unit to test the LED package chip of the instant disclosure;

FIG. 2E shows an enlarged view taken on part X of FIG. 2A ;

FIG. 2F shows an enlarged view taken on part Y of FIG. 2A ;

FIG. 2 G(A) shows a lateral, cross-sectional, schematic view of before separating the LED package chip from the first receiving portion or the second receiving portion of the instant disclosure;

FIG. 2 G(B) shows a lateral, cross-sectional, schematic view of after separating the LED package chip from the first receiving portion or the second receiving portion of the instant disclosure; and

FIG. 2H shows a perspective, schematic view of the LED package chip classification system covered by the protection structure of the instant disclosure.

[First Embodiment]

Referring to FIG. 1A to FIG. 1C , where the instant disclosure provides a light-guiding cover structure D, comprising: a top cover unit D 1 and a light-guiding unit D 2 . The top cover unit D 1 has a plurality of receiving spaces D 1000 formed therein. The light-guiding unit D 2 includes a plurality of light-guiding groups D 20 . Each light-guiding group D 20 includes a plurality of optical fiber cables D 200 received in the corresponding receiving space D 1000 , and each optical fiber cable D 200 has two opposite ends (E 1 , E 2 ) exposed from the bottom surface D 100 of the top cover unit D 1 and respectively facing at least one light-emitting device Si (such as a LED) and at least one light-sensing device S 2 (such as light sensor) that both have been disposed under the top cover unit D 1 .

For example, the top cover unit D 1 includes a base body D 10 and a plurality of top covers D 11 disposed on the base body D 10 , and each receiving space D 1000 is concaved inwardly from the bottom surface D 110 of the corresponding top cover D 11 and faces the base body D 10 , thus each receiving sapce D 1000 is enclosed as a closed space between the base body D 10 and the top cover D 11 . Each optical fiber cable D 200 can be divided into two end portions D 200 ′ embedded into the base body D 10 and a middle portion D 200 ″ connected between the two end portions D 200 ′ and received in the corresponding receiving space D 1000 . Each optical fiber cable D 200 includes at least one optical fiber core D 2001 and a protection layer D 2002 wrapping around the at least one optical fiber core D 2001 . The at least one optical fiber core D 2001 has two opposite end portions D 2001 ′ exposed from the protection layer D 2002 and embedded into the base body D 10 , and the at least one optical fiber core D 2001 has two opposite end faces (E 1 , E 2 ) exposed from the bottom surface D 100 of the base body D 10 and respectively facing the at least one light-emitting device Si and at least one light-sensing device S 2 . The two opposite end faces (E 1 , E 2 ) of the at least one optical fiber core D 2001 are substantially flushed with the bottom surface D 100 of the base body D 10 . The top cover unit D 1 includes a plurality of fixing elements D 12 embedded into the base body D 10 , and the two opposite end portions D 2001 ′ of the at least one fiber corn D 2001 are respectively fixed by the two corresponding fixing elements D 12 .

Of course, in another embodiment, the top cover unit D 1 has at least one receiving space D 1000 formed therein. The light-guiding unit D 2 including a plurality of optical fiber cables D 200 received in the at least one receiving space D 1000 , and the at least one receiving space D 1000 is concaved inwardly from the bottom surface D 110 of the corresponding top cover D 11 and faces the base body D 10 , thus the at least one receiving space D 1000 is enclosed as a closed space between the base body D 10 and the top cover D 11 . Each optical fiber cable D 200 is divided into two end portions D 200 ′ embedded into the base body D 10 and a middle portion D 200 ″ connected between the two end portions D 200 ′ and received in the at least one receiving space D 1000 .

Referring to FIG. 2A to FIG. 2H , where the top cover unit D 1 is removed provisionally in FIG. 2A to FIG. 2G . The light-guiding cover structure D of the instant disclosure can be applied to a LED package chip classification system as shown in FIG. 2H , and the LED package chip classification system comprises a first rotation unit 1 for transporting a plurality of LED package chips C, a chip test unit 2 , a second rotation unit 3 , a first chip classification unit 4 , and a second chip classification unit 5 .

Referring to FIGS. 2A , 2 B, 2 C, and 2 D, the first rotation unit 1 includes at least one first rotary turntable 11 , a plurality of first receiving portions 12 formed on the first rotary turntable 11 , and a plurality of first suction-exhaust dual-purpose openings 13 respectively disposed in the first receiving portions 12 . Each first receiving portion 12 can selectively receive at least one of the LED package chips C (as shown in FIG. 2B ), and each LED package chip C has a positive electrode pad C 1 and a negative electrode pad C 2 disposed on the bottom side thereof (as shown in FIG. 2D ). For example, the first receiving portions 12 can be arranged as an annular shape. The first receiving portions 12 can be surroundingly formed on the peripheral surface of the at least one first rotary turntable 11 and each first receiving portion 12 has an outward opening, thus each LED packaged chip C can enter the first receiving portion 12 through the outward opening. In addition, the first embodiment of the instant disclosure further comprises a bearing unit A including at least one bearing base A 1 , and the at least one first rotary turntable 11 is disposed on the at least one bearing base A 1 .

Referring to FIGS. 2A , 2 B, and 2 D, the chip test unit 2 includes at least one chip test module 20 adjacent to the first rotation unit 1 for testing each LED package chip C. Nevertheless, a plurality of chip test modules 20 can also be used in the instant disclosure at the same time according to different requirements. In addition, the at least one chip test module 20 includes a power supply element 20 A under the LED package chip C to supply power to the LED package chip C and a chip test element 20 B disposed above the LED package chip C to test each LED package chip C for obtaining the luminescent property of each LED package chip C. For example, the power supply element 20 A may be two conductive pins 200 A for providing a positive power source and a negative power source, and the chip test element 20 B may be a sensor or an analysis instrument for testing the luminescent property (such as brightness) of each LED package chip C.

The test method of the at least one chip test module 20 is shown in FIG. 2D from (A) to (C). Before using the at least one chip test module 20 to test the LED package chip C as shown in the step (A) of FIG. 2D , the LED package chip C is disposed is received in the corresponding first receiving portion 12 of the first rotation unit 1 and above the power supply element 20 A. When the at least one chip test module 20 is used to test the LED package chip C as shown in the step (B) of FIG. 2D , the two conductive pins 200 A of the power supply element 20 A are moved upwardly (as the direction of the arrow shown in the step (B) of FIG. 2D ) at the same time to pass through the openings A 10 of the bearing base A 1 and the two conductive pins 200 A respectively electrically contact the positive electrode pad C 1 and the negative electrode pad C 2 of the LED package chip C. After using the at least one chip test module 20 to test the LED package chip C as shown in the step (C) of FIG. 2D , the two conductive pins 200 A of the power supply element 20 A are moved downwardly (as the direction of the arrow shown in the step (C) of FIG. 2D ) to go back the original position as shown in the step (A) of FIG. 2D at the same time.

Referring to FIGS. 2A , 2 B, and 2 C, the shape of the second rotation unit 3 is the same as that of the first rotation unit 1 , and the second rotation unit 3 is adjacent to the first rotation unit 1 . The second rotation unit 3 includes at least one second rotary turntable 31 , a plurality of second receiving portions 32 formed on the second rotary turntable 31 , and a plurality of second suction-exhaust dual-purpose openings 33 respectively disposed in the second receiving portions 32 . Each second receiving portion 32 can selectively receive at least one of the LED package chips C transmitted from the first rotation unit 1 . For example, the second receiving portions 32 can be arranged as an annular shape. The second receiving portions 32 can be surroundingly formed on the peripheral surface of the at least one second rotary turntable 31 and each second receiving portion 32 has an outward opening, thus each LED packaged chip C transmitted from the first rotation unit 1 can enter the second receiving portion 32 through the outward opening. In addition, the first rotary turntable 11 and the second rotary turntable 31 can be disposed on the bearing base A 1 at the same time. The bearing base A 1 can also be divided into two separated bases (not shown), and the first rotary turntable 11 and the second rotary turntable 31 can be respectively disposed on the two separated bases (not shown).

Referring to FIGS. 2A , 2 B, and 2 E, the first chip classification unit 4 includes a plurality of first chip classification modules 40 adjacent to the first rotation unit 1 for classifying the LED package chips C that have been tested by the at least one chip test module 20 , and the first chip classification modules 40 surround the at least one first rotary turntable 11 . In addition, each first chip classification module 40 includes a first passing portion 40 A and a first accommodating portion 40 B communicated with the first passing portion 40 A, and the first passing portion 40 A and the first accommodating portion 40 B of each first chip classification module 40 are mated with each other to receive the LED package chips C with the same luminescent property. For example, the first passing portion 40 A may be a first passing inclined plane communicated with the first receiving portion 12 , the first accommodating portion 40 B may be a first accommodating opening communicated with the first passing inclined plane, and the first passing inclined plane (the first passing portion 40 A) is gradually and downwardly inclined from the first receiving portion 12 to the first accommodating opening (the first accommodating portion 40 B).

Referring to FIGS. 2A , 2 B, and 2 F, the second chip classification unit 5 includes a plurality of second chip classification modules 50 adjacent to the second rotation unit 3 for classifying the LED package chips C that have been tested by the at least one chip test module 20 , and the second chip classification modules 50 surround the at least one second rotary turntable 31 . In addition, each second chip classification module 50 includes a second passing portion 50 A and a second accommodating portion 50 B communicated with the second passing portion 50 A, and the second passing portion 50 A and the second accommodating portion 50 B of each second chip classification module 50 are mated with each other to receive the LED package chips C with the same luminescent property. For example, the second passing portion 50 A may be a second passing inclined plane communicated with the second receiving portion 32 , the second accommodating portion 50 B may be a second accommodating opening communicated with the second passing inclined plane, and the second passing inclined plane (the second passing portion 50 A) is gradually and downwardly inclined from the second receiving portion 32 to the second accommodating opening (the second accommodating portion 50 B).

Referring to FIGS. 2A and 2B , the first embodiment of the instant disclosure further comprises a transportation unit 6 including at least one transportation element 60 adjacent to the first rotary turntable 11 for sequentially transporting each LED package chip C to the corresponding first receiving portion 12 .

Referring to FIGS. 2A , 2 B, and 2 G, the first embodiment of the instant disclosure further comprises a chip position detection unit 7 including a light emitting element 70 A (such as the optical fiber cable D 200 ) disposed above the first receiving portion 12 and adjacent to the at least one transportation element 60 and a chip position detection element 70 B (such as the light-sensing device S 2 ) disposed under the first receiving portion 12 and corresponding to the light emitting element 70 A. In addition, light beams L generated by the light emitting element 70 A can be selectively projected onto the top surface C 100 of the LED package chip C (as shown in the step (A) of FIG. 2G ) or transmitted to the chip position detection element 70 B through a through hole All penetrating through the at least one bearing base A 1 and disposed under the first receiving portion 12 (as shown in the step (B) of FIG. 2G ), in order to judge whether the LED package chip C is transmitted from the at least one transportation element 60 to the first receiving portion 12 . For example, the first suction-exhaust dual-purpose opening 13 can provide induced air flows to suck the LED package chip C from the at least one transportation element 60 to the first receiving portion 12 .

Referring to FIGS. 2A , 2 B, 2 E, and 2 G, the first embodiment of the instant disclosure further comprises a first chip breakaway detection unit 8 including a plurality of first light emitting elements 80 A (such as the optical fiber cable D 200 ) respectively disposed above the different first receiving portions 12 and adjacent to the different first chip classification modules 40 and a plurality of first chip breakaway detection elements 80 B (such as the light-sensing device S 2 ) respectively disposed under the different first receiving portions 12 and corresponding to the first light emitting elements 80 A. In addition, light beams L generated by each first light emitting element 80 A can be selectively projected onto the top surface C 100 of the LED package chip C (as shown in the step (A) of FIG. 2G ) or transmitted to the first chip breakaway detection element 80 B through a through hole All penetrating through the at least one bearing base A 1 and disposed under the first receiving portion 12 (as shown in the step (B) of FIG. 2G ), in order to judge whether the LED package chip C is transmitted from the first receiving portion 12 to the first chip classification module 40 or the second receiving portion 32 . For example, the first suction-exhaust dual-purpose opening 13 can provide exhaust stream to separate the LED package chip C from the first receiving portion 12 .

Referring to FIGS. 2A , 2 B, 2 F, and 2 G, the first embodiment of the instant disclosure further comprises a second chip breakaway detection unit 9 including a plurality of second light emitting elements 90 A (such as the optical fiber cable D 200 ) respectively disposed above the different second receiving portions 32 and adjacent to the different second chip classification modules 50 and a plurality of second chip breakaway detection elements 90 B (such as the light-sensing device S 2 ) respectively disposed under the different second receiving portions 32 and corresponding to the second light emitting elements 90 A. In addition, light beams L generated by each second light emitting element 90 A can be selectively projected onto the top surface C 100 of the LED package chip C (as shown in the step (A) of FIG. 2G ) or transmitted to the second chip breakaway detection element 90 B through a through hole A 10 penetrating through the at least one bearing base A 1 and disposed under the second receiving portion 32 (as shown in the step (B) of FIG. 2G ), in order to judge whether the LED package chip C is transmitted from the first receiving portion 12 to the second receiving portion 32 or judge whether the LED package chip C is transmitted from the second receiving portion 32 to the second chip classification module 50 . For example, the second suction-exhaust dual-purpose opening 33 can provide exhaust stream to separate the LED package chip C from the second receiving portion 32 .

Referring to FIGS. 2A and 2B , the first embodiment of the instant disclosure further comprises a bridge connection unit B including at least one bridge connection element B 1 disposed between the first rotation unit 1 and the second rotation unit 3 , and each LED package chip C can be transmitted from the first receiving portion 12 to the second receiving portion 32 through the at least one bridge connection element B 1 .

In conclusion, the optical fiber cables received in the corresponding receiving space or in the at least one receiving sapce, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.

The above-mentioned descriptions merely represent the preferred embodiments of the instant disclosure, without any intention or ability to limit the scope of the instant disclosure which is fully described only within the following claims Various equivalent changes, alterations or modifications based on the claims of instant disclosure are all, consequently, viewed as being embraced by the scope of the instant disclosure.