LexDanaLexDanabeta
Inventor

Bily Wang

Inventor
Hsinchu, TW

Overview

103→
Patents
1999–2015
Patent span
Electricity
Primary field (CPC H)

Patents· 103 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H10HInorganic light-emitting semiconductor devices having potential barriers15%
F21KNon-electric light sources using luminescence7%
H05KPrinted circuits6%
LOC136%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted5%
G02BOptical elements, systems or apparatus4%
F21VFunctional features or details of lighting devices or systems thereof4%
G01RMeasuring electric variables4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
9,029,725'Packaged chip detection and classification device'20158,873,920'Light-guiding cover structure'20148,748,209'Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same'20148,710,387'LED package chip classification system'20148,686,310'Packaged chip detection and classification device'20148,623,680'LED chip package structure using sedimentation and method for making the same'20148,556,463'Simple detachable illumination structure and lamp tube'20138,555,492'Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach'20138,525,524'Multi-track detection system for detecting the appearance of electronic elements'20138,519,458'Light-emitting element detection and classification device'20138,421,884'GPS device with a display function and method for using the same'20138,398,275'Lamp head assembly and lighting lamp tube'20138,263,876'Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same'20128,198,800'LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same'2012D0660259'Strip LED'20128,183,065'LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same'2012D0659655'LED package base'2012D0659654'LED package base'20128,162,514'Illumination device with a fire-fighting function'20128,162,510'LED chip package structure with multifunctional integrated chips and a method for making the same'20128,137,999'Package for a light emitting diode and method for fabricating the same'20128,138,508'LED chip package structure with different LED spacings and a method for making the same'20128,107,720'Detection system for detecting appearances of many electronic elements and methods of using the same'20128,079,737'Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency'20118,053,904'Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same'20118,053,961'Color-mixture display unit and image display apparatus using the same'20118,053,885'Wafer level vertical diode package structure and method for making the same'20118,031,930'Testing system and testing method for inspecting electonic devices'2011D0645421'LED base'20118,017,969'LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same'20118,003,413'Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same'20118,002,436'LED chip package structure using a substrate as a lampshade and method for making the same'20117,964,420'LED chip package structure with an embedded ESD function and method for manufacturing the same'20117,951,621'LED chip package structure with high-efficiency light-emitting effect and method of packaging the same'20117,923,745'LED chip package structure with high-efficiency light-emitting effect and method of packaging the same'20117,923,747'Wafer level LED package structure and method for making the same'20117,898,663'Uniform light generating system for testing an image-sensing device and method of using the same'20117,876,593'LED chip package structure with an embedded ESD function and method for manufacturing the same'20117,842,964'Front and rear covering type LED package structure and method for packaging the same'20107,834,365'LED chip package structure with high-efficiency light-emitting effect and method of packing the same'20107,829,901'LED chip package structure with high-efficiency light-emitting effect and method for making the same'20107,828,464'LED lamp structure and system with high-efficiency heat-dissipating function'20107,824,938'Method for manufacturing an LED chip package structure'20107,815,346'Method for calculating out an optimum arrangement pitch between each two LED chip package units'20107,803,641'Mold structure for packaging LED chips and method thereof'20107,804,162'Multi-wavelength white light-emitting structure'20107,800,841'Optical object distance simulation device for reducing total optical path'20107,749,781'Method for manufacturing a light-emitting diode having high heat-dissipating efficiency'20107,741,648'Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same'20107,737,635'High efficiency white light emitting diode and method for manufacturing the same'20107,701,124'White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blend'20107,696,990'LED driving circuit and a serial LED illumination system using the same'20107,671,374'LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same'20107,671,373'LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same'20107,662,661'Method of manufacturing a substrate structure for increasing cutting precision and strength thereof'20107,655,997'Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same'20107,614,766'Modular illumination device with adjustable lighting angles'20097,563,641'Laminated light-emitting diode display device and manufacturing method thereof'2009D0595674'Light emitting diode'2009D0595675'Light emitting diode'20097,515,061'LED package structure for increasing light-emitting efficiency and method of packaging the same'20097,489,251'Real-time tracing, transmitting and analyzing system for flight animals'20097,485,480'Method of manufacturing high power light-emitting device package and structure thereof'20097,391,365'Micro-tracking device for tracing action track of animals and method for using the same'20087,379,171'Optical object distance simulation device'20087,329,028'Uniform light generating system for adjusting output brightness and method of using the same'20087,303,984'Semiconductor substrate structure and processing method thereof'20077,256,603'Apparatus for measuring the static parameters of integrated circuits'20077,255,463'Lighting module'20077,237,938'Backlight module'20077,211,882'LED package structure and method for making the same'20077,154,155'Wing-shaped surface mount package for light emitting diodes'20067,140,753'Water-cooling heat dissipation device adopted for modulized LEDs'20067,142,181'Circuit board for large screen LED matrix array display'20067,138,995'Circuit for driving LED display'20067,080,924'LED light source with reflecting side wall'20067,049,639'LED packaging structure'2006D0511328'Light-emitting diode'2005D0509809'Metal base design for surface mount device LED'2005D0509195'Light emitting diode package'2005D0507544'Light emitting diode package'20056,919,584'White light source'2005D0507246'Light emitting diode package'2005D0506732'Light-emitting diode'2005D0506187'Metal base design for surface mount device LED (light emitting diode)'20056,885,037'IC package with stacked sheet metal substrate'20056,841,934'White light source from light emitting diode'20056,794,686'White light source'20046,784,458'Random partitionable dot matrix LED display'20046,627,482'Mass production technique for surface mount optical device with a focusing cup'20036,583,447'Multiple LED chip package'20036,574,254'Laser diode package with heat sinking substrate'20036,569,698'Focusing cup on a folded frame for surface mount optoelectric semiconductor package'20036,534,799'Surface mount light emitting diode package'20036,438,391'Laser diode antenna for mobile phone'20026,423,906'Surface mount package for long lead devices'20026,398,983'Fluorescent material for packaging optical devices'20026,307,479'Running indicator for integrated circuit package'20016,300,674'Flat package for semiconductor diodes'20016,297,598'Single-side mounted light emitting diode module'20016,262,481'Folded heat sink for semiconductor device package'20016,078,092'Resettable fuse integrated circuit package'20005,962,922'Cavity grid array integrated circuit package'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2014Based in Hsinchu, TW· patent location history
2000–2014Patents assigned to HARVATEK CORP (84)· patent assignee history
2002–2015Patents assigned to YOUNGTEK ELECTRONICS CORP (17)· patent assignee history
2004–2015Based in Hsin Chu, TW· patent location history
2011–2014Patents assigned to WANG BILY (23)· patent assignee history
2012–2014Patents assigned to CHEN HSIN-CHENG (6)· patent assignee history
2012–2014Patents assigned to CHEN KUEI-PAO (6)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HARVATEK CORP842000–2014
WANG BILYself232011–2014
YOUNGTEK ELECTRONICS CORP172002–2015
CHEN HSIN-CHENG62012–2014
CHEN KUEI-PAO62012–2014
Locations
LocationPatentsSpan
Hsinchu, TW681999–2014
Hsin Chu, TW352004–2015