USPatent applicationPatented

Electrical connector

Granted 17 Aug 2010 · 1 office action

Assignee: Foxconn Technology Group

Law firm: Law firm · Log in to unlock

Attorney: Attorney · Log in to unlock

Inventors: Hong-Bo Zhang · Examiner: Chandrika Prasad · AU 2839 · TC 2800

Life of the application

8 dated events
⤢ drag to zoom20102012201420162018202020222024202620282030ProsecutionOwnershipTerm & fees
ProsecutionOwnershipTerm & feeshover for detail · click to open

Abstract

A modular jack assembly ( 100 ) for being mounted to a mother board includes an insulative element ( 10 ) and an electrical unit ( 20 ) mounted to the insulative element. The electrical unit has a housing ( 21 ), a terminal module ( 23 ) assembled to the housing, a daughter board ( 27 ) attached to a side portion of the housing, a LED (Light Emitting Diode) ( 271 ) disposed on the daughter board and a connecting module ( 25 ) mounted bellow the housing. The connecting module has a base ( 251 ) and a mating portion ( 259 ) extending from the base, a number of pins ( 250 ) assembled to the base, and a number of contacts ( 257 ) located to the mating portion and mounted to the mother board. The contacts electrically connect with the LED by electrically connecting to the pins.

Description

4 parts
›BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an electrical connector and particularly to an electrical connector connected to a mother board for transmitting electrical signals.

2. Description of the Prior Art

A W.O. Pat. No. 2005/076,413 published on Aug. 18, 2005 discloses an electrical connector. The electrical connector mounted to a printed circuit board comprises an insluative housing, a daughter board attached to a side of the housing, a plurality of LEDs (Light Emitting Diodes), a terminal module having a plurality of terminals extending through the printed circuit board, and a connecting module mounted to a bottom surface of the housing and having a base. The connecting module has a set of first contacts and a set of second contacts assembled to a side of base in a line and extending through a group of channels defined on the daughter board for forming a first electrical trace and a second electrical trace.

During assembly, it is difficult to mount the first and second contacts which are retained to a base of a connecting module in a line to expose from the corresponding channels of the printed circuit board. The assembly of the two components places maximum demands on accuracy. However even in the case of a high production quality and assembly accuracy a rubbing of the first and second contacts in the channels is not completely excluded and this can consequently lead to a premature wearing including associated maintenance and/or repair costs.

Hence, a modular jack assembly is needed to solve the above problem.

›BRIEF SUMMARY OF THE INVENTION

One object of the present invention is to provide a modular jack assembly having an improved connecting module for easily connecting with a daughter board.

The modular jack assembly for being mounted to a mother board comprises an insulative element and an electrical unit mounted to the insulative element. The electrical unit comprises a housing having a front wall, a top wall and a bottom wall, a terminal module assembled to the front wall of the housing and having a plurality of terminals mounted thereto, a daughter board attached to a side portion of the housing, a LED (Light Emitting Diode) disposed on the daughter board and a connecting module mounted to the bottom wall. The connecting module has a base and a mating portion extending from the base and exposed from the bottom wall of the housing, a plurality of pins assembled to the base and extending through the daughter board for connecting the daughter board to the mother board, and a plurality of contacts located to the mating portion. The contacts are mounted to the mother board for electrically contacting with the pins by a plurality of conductive traces of the mother board formed between the contacts and the pins for electrically connecting the contacts to the LED by a plurality of conductive traces of the daughter board created between the pins and the LED.

During assembly, it is easy to electrically connect the LEDs to the mother board by the conductive trace formed between the pins, the contacts and the daughter board, therefore reducing a cost of manufacture.

Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiments when taken in conjunction with the accompanying drawings.

›BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an assembled perspective view of a modular jack assembly mounted on a mother board, according to the present invention;

FIG. 2 is an exploded view of the modular jack assembly and the mother board as shown in FIG. 1 ;

FIG. 3 is an exploded view of the modular jack assembly and the mother board as shown in FIG. 2 , taken from another aspect;

FIG. 4 is a perspective view of an electrical unit as shown in FIG. 3 ;

FIG. 5 is an exploded view of the electrical unit as shown in FIG. 3 and a grounding plate; and

FIG. 6 is a perspective view of a connecting module.

›DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made to the drawing figures to describe the present invention in detail. Referring to FIGS. 1 and 2 , a multiple “stacked jack” is depicted at a modular jack assembly 100 . The modular jack assembly 100 for being mounted on a mother board 200 and engaging with a mating plug (not shown) comprises an insulative element 10 , a plurality of electrical units 20 received into the insulative element 10 , a power over ethernet assembly 40 mounted to a rear portion of the electrical units 20 , an outer shield 50 surrounding the insulative element 10 , the power over ethernet assembly 40 and the electrical unit 20 .

Referring to FIGS. 3 , 5 , the power over ethernet assembly 40 is provided with a substrate 41 and a plurality of electrical elements 42 such as capacitors mounted to the substrate 41 .

Referring to FIG. 2 , the insulative element 10 has a plurality of cavities 13 which profiled one above other for receiving the mating plugs.

As shown in FIGS. 1-6 , the electrical unit 20 is mounted in the cavity 13 of the insulative element 10 and comprises a terminal module 23 , a housing 21 , a pair of daughter boards 27 respectively having LED 271 mounted thereon, and a connecting module 25 . The insulative element 10 further has a plurality of ports 131 defined therethrough for retaining a number of light pipes 17 which are adapted for showing the LEDs 271 .

The housing 21 has a front wall 211 , a top wall 213 , a bottom wall 215 , a central wall 217 and a pair of receiving rooms 219 defined therebetween for receiving a plurality of magnetic cores 272 of the daughter boards 27 , and a plurality of connecting terminals 22 mounted to the rear portion thereof.

The terminal module 23 is mounted to the front wall 211 of the housing 21 . The terminal module 23 has a pair of opposite rectangular member 231 and two groups of mating terminals 233 respectively mounted to the rectangular member 231 . The mating terminals 233 has a plurality of tail portions 2330 extending perpendicularly from the rectangular member 231 into a plurality of mating holes 273 disposed on the daughter board 27 , thereby forming a conductive trace between the daughter board 27 and the terminal module 23 .

As shown in FIG. 6 , the front wall 211 of the housing 21 defines an opening 2110 for engaging with the rectangular member 231 of the contacting module 23 . Each connecting terminal 22 has a front end connecting with the daughter board 27 , and a rear end extending rearwardly from the housing 21 , thus electrically connecting the daughter board 27 to the power over ethernet assembly 40 . The bottom wall 215 of the housing 21 is provided with a pair of protruding posts (not shown).

Referring to FIGS. 4-6 , the connecting module 25 is mounted below the bottom wall 215 of the housing 21 . The connecting module 25 has a base 251 defining a pair of recesses 2550 thereon for engaging with a pair of protruding posts of the bottom wall 215 , and two rows of L-shaped pins 250 assembled to the opposite portions of the base 251 . The base 251 has a mating portion 259 extending therefrom and exposed from the bottom wall 215 and has a plurality of contacts 257 located thereto. The L-shaped pins 250 have first pins 253 formed with a first bending portion 2531 extending through a first hole 275 defined on the lower edge of the daughter board 27 so as to electrically connecting with the mating terminals 233 of the terminal module 23 , and second pins 255 formed with a second bending portion 2551 extending through second holes 277 which are positioned in alignment with the first holes 275 of the daughter board 27 for connecting with the LED 271 . The first pins 253 have soldering portions 2532 soldered onto the mother board and the bending portions 2531 extending through the first holes 275 of the daughter board 27 , thereby electrically forming a conductive trace between the daughter board 27 and the mother board. The contacts 257 are mounted to a bottom substrate 30 and the mother board 200 . The second pin 255 is formed with another bending portion 2552 inserting through the bottom substrate 30 . The second pins 255 electrically connect with the contacts 257 via the bottom substrate 30 . The pins 255 extend downwardly from the base 251 a first length. The contacts 257 extend downwardly from the base 251 a second length greater than the first length. The mating portion 259 of the base 251 is located between two adjacent housings 21 and the contacts 257 are positioned in a row.

Referring to FIG. 5 , the electrical unit 20 further comprises a grounding plate 29 mounted to a rear portion of the housing 21 and connected to the mother board for grounding.

Referring to FIGS. 1-6 , in assembling of the modular jack assembly 100 , firstly, the terminal module 23 is inserted into the opening 2110 of the housing 21 . Secondly, the connecting module 25 is mounted below the bottom wall 215 of the housing 21 by the engagement between the protruding posts and the recesses 2550 . The pair of daughter boards 27 are assembled to the side portions of the housing 21 . Then the power over ethernet assembly 40 is mounted to the rear of housing 21 and is electrically connected with the connecting terminals 22 . The soldering portions 2532 of the L-shaped pins 250 are fixed to the mother board. Thirdly, the terminal module 23 is mounted in the cavity 13 of the insulative element 10 and then the assembly is ready to be mounted to the mother board. The outer shields 50 are attached to an outer side of the insulative element 10 for shielding purpose.

It is to be understood, however, that even though numerous, characteristics and advantages of the present invention have been set fourth in the foregoing description, together with details of the structure and function of the invention, the disclosed is illustrative only, and changes may be made in detail, especially in matters of number, shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims as granted

14 claims

Log in to read the claims of this application.

Log in to unlock

Classifications

3 codes
IPC · International Patent Classification
Section H — Electricity
  • H01R12/71
  • H01R13/66
USPC · US Patent Classification
439/541.5

Claim changes

Soon
Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this application are not paired with the granted ones in what we hold.

File wrapper

⤢ drag to zoomApr 2009Jul 2009Oct 2009Jan 2010Apr 2010Jul 2010Oct 2010USPTOApplicantNon-final rejectionResponse after non-finalNotice of allowance
USPTOApplicanthover for detail · click to open
Pendency
1.4 y
496 days filing → grant
Office actions
1
non-final + final
Responses
1
no RCE
Interviews
1
examiner interview summaries
Examiner
Chandrika Prasad
art unit 2839 · TC 2800
Citations: 3 back · 3 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Log in to unlock

Documents

Log in to open the documents of this file: the application as filed, every office action and response, the notice of allowance.

Log in to unlock

Chain of title

⤢ drag to zoom20102012201420162018202020222024202620282030Owner 1
Titlehover for detail · click to open

See the full assignment history — every owner this patent has passed through, with recordation dates and reel/frame numbers.

Log in to unlock