Inventor

Hong-Bo Zhang

Inventor

Kunshan, CN

Overview

20→

Patents

2009–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Rprimary

H01RElectrically-conductive connections25%

H01GCapacitors17%

Y10TTechnical subjects covered by former us classification17%

H05KPrinted circuits8%

C09DCoating compositions, e.g. paints, varnishes or lacquers6%

D01HSpinning or twisting6%

H01FMagnets6%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

B05DProcesses for applying fluent materials to surfaces, in general3%

B82YSpecific uses or applications of nanostructures3%

PatentTitleYear

10,949,128Data protection method2021 10,109,428Process to improve coverage and electrical performance of solid electrolytic capacitors2018 9,761,347'Process to improve coverage and electrical performance of solid electrolytic capacitor'2017 9,761,378'Process to improve coverage and electrical performance of solid electrolytic capacitors'2017 9,719,193'Method for drafting spun yarns in three stages'2017 9,637,842'Spinning method and device of drafting with initial twist'2017 9,524,829'Solid electrolytic capacitor and improved method for manufacturing a solid electrolytic capacitor'2016 9,343,239'Solid electrolytic capacitor and improved method for manufacturing a solid electrolytic capacitor'2016 8,771,381'Process for producing electrolytic capacitors and capacitors made thereby'2014 8,619,436'Electrical component and method for making the same'2013 7,948,771'Electrical component and method for making the same'2011 7,819,699'Electrical connector assembly having improved substrate'2010 7,775,829'Electrical connector'2010 7,775,828'Electrical connector having improved grounding member'2010 7,736,176'Modular jack assembly having improved connecting terminal'2010 7,670,172'Modular jack assembly'2010 7,588,457'Electrical connector having improved indicating module'2009 7,575,483'Electrical connector having substrate having conductive trace to balance electrical couplings among terminals'2009 7,517,254'Modular jack assembly having improved base element'2009 7,510,441'Electrical connector having improved based element'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2013Patents assigned to HON HAI PREC IND CO LTD (11)· patent assignee history

2009–2013Based in Kunshan, CN· patent location history

2014–2018Patents assigned to KEMET ELECTRONICS CORP (6)· patent assignee history

2014–2017Patents assigned to CHACKO ANTONY P (2)· patent assignee history

2014–2017Patents assigned to CHEN QINGPING (2)· patent assignee history

2014–2018Based in Jiangsu, CN· patent location history

2017Patents assigned to UNIV JIANGNAN (2)· patent assignee history

2021Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HON HAI PREC IND CO LTD	11	2009–2013
KEMET ELECTRONICS CORP	6	2014–2018
CHACKO ANTONY P	2	2014–2017
CHEN QINGPING	2	2014–2017
UNIV JIANGNAN	2	2017

Locations

Location	Patents	Span
Kunshan, CN	11	2009–2013
Jiangsu, CN	8	2014–2018
New Taipei, TW	1	2021