USPatent applicationPatented

HBT/FET process integration

Granted 12 Jul 2011

Application· this page
11/941,065
filed 15 Nov 2007
Publication
Not published
not published
Patent
US 7,977,708
granted 12 Jul 2011

Life of the application

5 dated events
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Abstract

A co-integrated HBT/FET apparatus and system, and methods for making the same, are disclosed. A co-integrated HBT/FET apparatus may include a first epitaxial structure formed over a substrate, the first epitaxial structure forming, at least in part, a FET device, a separation layer formed over the first epitaxial structure, and a second epitaxial structure formed over the separation layer, the second epitaxial structure forming, at least in part, a heterojunction bipolar transistor (HBT) device.

Claims as granted

9 claims

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Classifications

6 codes
IPC · International Patent Classification
Section H — Electricity
  • H01L29/66
USPC · US Patent Classification
257/195257/E29.218257/192257/E29.171257/197

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Pendency
3.7 y
1,335 days filing → grant
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