USPatent applicationPatented

Transistor substrate

Granted 5 Jun 2001

Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho

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Inventors: Toshiaki Nagase, Jun Ishikawa · Examiner: Brian N. Vinson · AU 2911 · TC 2900

Application· this page
116954
filed 13 Jan 2000
Publication
Not published
not published
Patent
US D443253
granted 5 Jun 2001

Life of the application

4 dated events
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Description

1 parts
›FIG. 1 is a front elevational view showing…

FIG. 1 is a front elevational view showing a transistor substrate according to a first embodiment of the present invention;

FIG. 2 is a rear elevational view of the substrate of FIG. 1;

FIG. 3 is a top plan view of the substrate of FIG. 1;

FIG. 4 is a bottom plan view of the substrate of FIG. 1;

FIG. 5 is a right side elevational view of the substrate of FIG. 1, the left side elevational view being a mirror image of the right side elevational view;

FIG. 6 is a top front perspective view of the substrate of FIG. 1;

FIG. 7 is a top plan view showing a transistor substrate according to a second embodiment of the present invention, wherein the front elevational view, the rear elevational view, the bottom plan view, the right side elevational view and the left side elevational view are identical with those of the first embodiment;

FIG. 8 is a top front perspective view of the substrate of FIG. 7;

FIG. 9 is a top plan view showing a transistor substrate according to a third embodiment of the present invention, wherein the front elevational view, the rear elevational view, the bottom plan view, the right side elevational view and the left side elevational view are identical with those of the first embodiment;

FIG. 10 is a top front perspective view of the substrate of FIG. 9;

FIG. 11 is a top plan view showing a transistor substrate according to a fourth embodiment of the present invention, wherein the front elevational view, the rear elevational view, the bottom plan view, the right side elevational view and the left side elevational view are identical with those of the first embodiment; and,

FIG. 12 is a top front perspective view of the substrate of FIG. 11.

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Claims as granted

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Classifications

1 codes
USPC · US Patent Classification
D13/182

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File wrapper

Pendency
1.4 y
509 days filing → grant
Office actions
0
on the grant's record
Examiner
Brian N. Vinson
art unit 2911 · TC 2900
Citations: 5 back · 0 forward

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Chain of title

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