Heat sink assembly incorporating spring clip

1. Field of the Invention

The present invention relates to a heat sink assembly, and particularly to heat sink assembly incorporating a spring clip which can readily and firmly mount a heat sink to an electronic device.

2. Prior Art

As computer technology continues to advance, electronic components of computers are being made to provide faster operational speeds and greater functional capabilities. When an electronic component operates at high speed in a computer enclosure, its temperature can increase greatly. It is desirable to dissipate the generated heat quickly, for example by using a heat sink attached to the electronic component in the enclosure. This allows the electronic component in the enclosure to function within their normal operating temperature ranges, thereby assuring the quality of data management, storage and transfer. Oftentimes, a clip is required for mounting the heat sink to the electronic component.

A wide variety of clips, such as: linear type of wire clips, plate-type of clips, pin-type of clips, are available in the prior art. FIG. 4 shows a conventional linear clip 1 mounting a heat sink 5 to an electronic package 7 . The clip 1 comprises an elongated central pressing portion 2 defining a major axis and a pair of end portions 3 , 4 extending in substantially opposite directions normal to the axis of the pressing portion 2 to define a substantially Z-shaped device. In assembly, the pressing portion 2 of the clip 1 is positioned in a groove 6 of the heat sink 5 . The end portions 3 , 4 are pressed downward to engage with tabs 8 formed on opposite sides of the package 7 . The clip 1 is deformed and the pressing portion 2 presses the heat sink 5 toward the package 7 . The heat sink 5 is therefore secured to the package 7 and connected with an electronic component installed on the package 7 .

However, the pressing portion 2 is linear shape and is readily to slide in the groove 6 of the heat sink 5 , which results in the heat sink 5 not being capable of intimate contact the electronic component on the package 7 .

Accordingly, an object of the present invention is to provide a clip which can firmly and readily secure a heat sink to an electronic device.

To achieve the above-mentioned object, a heat sink assembly in accordance with a preferred embodiment of the present invention comprises a heat sink and a pair of clips attached on opposite sides of the heat sink for securing the heat sink to an electronic device. The heat sink includes a base and a plurality of fins extending from the base. A pair of protrusions is formed on bottom portions of adjacent two fins. A locking slot is therefore formed between the base, the bottom portions of the two adjacent fins, and the protrusions. The clip includes a pressing portion squeenzedly received in the locking slot of the heat sink, a pair of extension portions extending from opposite ends of the pressing portion, and a pair of hooks formed on free ends of the extension portions for engaging with the electronic device. When the clips are deformed to cause the hooks to engage with the electronic device, the pressing portions of the clips press the heat sink toward the electronic device.

Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of a preferred embodiment of the present invention with attached drawings, in which:

FIG. 1 is an exploded isometric view of a heat sink assembly in accordance with a preferred embodiment of the present invention;

FIG. 2 is an assembled isometric view of the heat sink assembly of FIG. 1 ;

FIG. 3 is a side elevation view of the heat sink assembly of FIG. 1 mounted on a printed circuit board; and

FIG. 4 shows a conventional clip mounting a heat sink to an electronic device.

FIG. 1 shows a heat sink assembly in accordance with a preferred embodiment of the present invention. The heat sink assembly comprises a heat sink 20 and a pair of clips 10 for securing the heat sink 20 to an electronic component 40 mounted on a printed circuit board 30 for heat dissipation therefrom ( FIG. 3 ).

The heat sink 20 comprises a rectangular base 22 and a plurality of spaced fins 24 extending upwardly from the base 22 . A central channel 26 ( FIG. 2 ) is defined between two adjacent middle fins 24 . A pair of protrusions 28 are formed from bottom portions of the two adjacent middle fins 24 to the channel 26 . A locking slot 29 is therefore formed between the base 22 , the bottom portions of the two adjacent fins 24 , and the protrusions 28 in a bottom of the channel 26 . A plurality of grooves (not labeled) is defined in the fins 24 perpendicular to the locking slot 29 .

One clip 10 will be described in detail since both are identical in construction, function and operation. The clip 10 can be formed front any suitable material which is flexible such as a rod or heavy wire of steel, aluminum or the lick. The clip 10 comprises a pressing portion 12 , a pair of extension portions 14 extending outwardly and upwardly from opposite ends of the pressing portion 12 , and a pair of locking portions 16 formed on free ends of the extension portions 14 respectively. The pressing portion 12 is substantially V-shaped and comprises an arc acute angle. The locking portion 16 is a hook.

Referring also to FIG. 2 , in assembly, the pressing portions 12 of the clips 10 are pushed into the locking slot 29 of the heat sink 20 from opposite sides of the heat sink 20 . The pressing portions 12 are squeezed by the two adjacent middle fins 24 to be U-shaped. The pressing portions 12 are therefore deformed to secure the clips 10 to the heat sink 20 .

Referring to FIG. 3 , in use, the locking portions 16 of the clips 10 are downwardly pressed to engage with rings of the locking members 32 mounted on the printed circuit board 30 . The clips 10 are deformed to cause the pressing portions 12 of the clips 10 to press the heat sink 20 toward the printed circuit board 30 . The heat sink 20 is thus firmly secured to the printed circuit board 30 with the base 22 in intimate contact with the electronic component 40 .

In the present invention, the pressing portions 12 of the clips 10 are squeezedly received in the locking slot 29 of the heat sink 20 . The clips 10 cannot slide in the locking slot 29 . The clips 10 can firmly secure the heat sink 20 to the electronic component 40 .

It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.