Inventor
Hong-Bo Shi
Inventor
Shenzhen, CN
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1078%
F04DNon-positive-displacement pumps11%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
7,301,769'Fan holder'20077,218,520'Retainer for heat sink'20077,203,066'Heat sink assembly incorporating spring clip'20077,190,584'Retaining device for heat sink'20077,102,890'Heat sink retention device'20067,100,676'Fan duct'20067,072,183'Locking device for heat dissipating device'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2007Patents assigned to HON HAI PREC IND CO LTD (4)· patent assignee history
2006–2007Based in Shenzhen, CN· patent location history
2007Patents assigned to FOXCONN TECH CO LTD (2)· patent assignee history
2007Patents assigned to FOXCON TECHNOLOGY CO LTD (1)· patent assignee history
2007Patents assigned to FU ZHUN PREC INDUSTRY SHENZHEN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HON HAI PREC IND CO LTD | 4 | 2006–2007 |
| FOXCONN TECH CO LTD | 2 | 2007 |
| FOXCON TECHNOLOGY CO LTD | 1 | 2007 |
| FU ZHUN PREC INDUSTRY SHENZHEN | 1 | 2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shenzhen, CN | 7 | 2006–2007 |