Inventor
Rajeev Bajaj
Inventor
Fremont, CA, US
Overview
Patents· 79 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
B24DTools for grinding, buffing or sharpening12%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering9%
B29CShaping or joining of plastics7%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts5%
B29LIndexing scheme associated with subclass b29c, relating to particular articles4%
C09GPolishing compositions4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
B23KSoldering or unsoldering2%
PatentTitleYear
11,072,050Polishing pad with window and manufacturing methods thereof202110,953,515Apparatus and method of forming a polishing pads by use of an additive manufacturing process202110,919,123Piezo-electric end-pointing for 3D printed CMP pads202110,875,145Polishing pads produced by an additive manufacturing process202010,875,153Advanced polishing pad materials and formulations202010,843,306Printing a chemical mechanical polishing pad202010,821,573Polishing pads produced by an additive manufacturing process202010,800,000Multi-layered nano-fibrous CMP pads202010,773,509Pad structure and fabrication methods202010,618,141Apparatus for forming a polishing article that has a desired zeta potential202010,593,574Techniques for combining CMP process tracking data with 3D printed CMP consumables202010,537,973Correction of fabricated shapes in additive manufacturing202010,537,974CMP pad construction with composite material properties using additive manufacturing processes202010,500,694Chemical mechanical polishing apparatus and methods201910,493,691Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles201910,456,886Porous chemical mechanical polishing pads201910,399,201Advanced polishing pads having compositional gradients by use of an additive manufacturing process201910,399,205Systems, apparatus, and methods for chemical polishing201910,391,605Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process201910,384,330Polishing pads produced by an additive manufacturing process201910,322,491Printed chemical mechanical polishing pad201910,226,853Methods and apparatus for conditioning of chemical mechanical polishing pads201910,086,500Method of manufacturing a UV curable CMP polishing pad201810,029,405Printing a chemical mechanical polishing pad20189,873,180CMP pad construction with composite material properties using additive manufacturing processes20189,776,361'Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles'20179,744,724'Apparatus for printing a chemical mechanical polishing pad'20179,669,512'CMP pads having material composition that facilitates controlled conditioning'20179,597,770'Method of fabricating a polishing'20179,486,893'Conditioning of grooving in polishing pads'20169,457,520'Apparatus for printing a chemical mechanical polishing pad'20169,296,085'Polishing pad with homogeneous body having discrete protrusions thereon'20169,162,344'Method and apparatus for CMP conditioning'20159,067,299'Printed chemical mechanical polishing pad'20158,920,219'Polishing pad with alignment aperture'20148,398,463'Pad conditioner and method'20138,292,692'Polishing pad with endpoint window and systems and method using the same'20128,177,603'Polishing pad composition'20128,075,745'Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance'20118,066,555'Polishing pad'20117,846,008'Method and apparatus for improved chemical mechanical planarization and CMP pad'20107,815,778'Electro-chemical mechanical planarization pad with uniform polish performance'20107,762,871'Pad conditioner design and method of use'20107,759,165'Nanospring'20107,530,880'Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor'20097,153,188'Temperature control in a chemical mechanical polishing system'20066,960,521'Method and apparatus for polishing metal and dielectric substrates'20056,911,136'Method for regulating the electrical power applied to a substrate during an immersion process'20056,872,329'Chemical mechanical polishing composition and process'20056,869,332'Chemical mechanical polishing of a metal layer with polishing rate monitoring'20056,790,768'Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects'20046,783,432'Additives for pressure sensitive polishing compositions'20046,638,143'Ion exchange materials for chemical mechanical polishing'20036,632,124'Optical monitoring in a two-step chemical mechanical polishing process'20036,629,881'Method and apparatus for controlling slurry delivery during polishing'20036,620,027'Method and apparatus for hard pad polishing'20036,602,724'Chemical mechanical polishing of a metal layer with polishing rate monitoring'20036,585,574'Polishing pad with reduced moisture absorption'20036,569,349'Additives to CMP slurry to polish dielectric films'20036,561,873'Method and apparatus for enhanced CMP using metals having reductive properties'20036,537,144'Method and apparatus for enhanced CMP using metals having reductive properties'20036,520,840'CMP slurry for planarizing metals'20036,506,097'Optical monitoring in a two-step chemical mechanical polishing process'20036,436,832'Method to reduce polish initiation time in a polish process'20026,435,944'CMP slurry for planarizing metals'20026,436,302'Post CU CMP polishing for reduced defects'20026,261,157'Selective damascene chemical mechanical polishing'20016,254,459'Wafer polishing device with movable window'20016,204,169'Processing for polishing dissimilar conductive layers in a semiconductor device'20016,071,816'Method of chemical mechanical planarization using a water rinse to prevent particle contamination'20006,068,539'Wafer polishing device with movable window'20006,045,435'Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects'20006,001,730'Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers'19996,001,726'Method for using a conductive tungsten nitride etch stop layer to form conductive interconnects and tungsten nitride contact structure'19995,985,755'Processing for polishing dissimilar conductive layers in a semiconductor device'19995,916,011'Process for polishing a semiconductor device substrate'19995,899,745'Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor'19995,897,375'Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture'19995,882,243'Method for polishing a semiconductor wafer using dynamic control'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2001Patents assigned to MOTOROLA INC (9)· patent assignee history
1999–2021Based in Fremont, CA, US· patent location history
1999–2001Based in Austin, TX, US· patent location history
1999Based in San Jose, CA, US· patent location history
2001–2021Patents assigned to APPLIED MATERIALS INC (53)· patent assignee history
2009–2012Patents assigned to SEMIQUEST INC (7)· patent assignee history
2010–2019Patents assigned to BAJAJ RAJEEV (12)· patent assignee history
2014–2017Patents assigned to NEXPLANAR CORP (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 53 | 2001–2021 |
| BAJAJ RAJEEVself | 12 | 2010–2019 |
| MOTOROLA INC | 9 | 1999–2001 |
| SEMIQUEST INC | 7 | 2009–2012 |
| NEXPLANAR CORP | 3 | 2014–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fremont, California, US | 71 | 1999–2021 |
| Austin, Texas, US | 7 | 1999–2001 |
| San Jose, California, US | 1 | 1999 |