LexDanaLexDanabeta
Inventor

Paul Brillhart

Inventor
Pleasanton, CA, US

Overview

50→
Patents
2002–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 50 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H01LSemiconductor devices12%
C23CCoating metallic material11%
H01JElectric discharge tubes or discharge lamps10%
C30BSingle-crystal growth7%
F25BRefrigeration machines, plants or systems5%
H05HPlasma technique5%
H05BElectric heating5%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,930,543Thermal processing susceptor202110,883,190Apparatus and methods for alignment of a susceptor202110,727,093Light pipe window structure for low pressure thermal processes202010,458,040Upper dome with injection assembly201910,306,708Absorbing reflector for semiconductor processing chamber201910,269,614Susceptor design to reduce edge thermal peak201910,202,707Substrate processing system with lamphead having temperature management201910,119,192EPI base ring201810,077,508Multizone control of lamps in a conical lamphead using pyrometers201810,062,598Thermal processing susceptor20189,870,919'Process chamber having separate process gas and purge gas regions'20189,863,043'Window cooling using compliant material'20189,845,550Upper dome with injection assembly20179,842,753'Absorbing lamphead face'20179,832,816Absorbing reflector for semiconductor processing chamber20179,814,099'Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same'20179,768,043'Quartz upper and lower domes'20179,748,121'Thermal coupled quartz dome heat sink'20179,711,382'Dome cooling using compliant material'20179,580,835'Multizone control of lamps in a conical lamphead using pyrometers'20179,570,275'Heated showerhead assembly'20179,532,401'Susceptor support shaft with uniformity tuning lenses for EPI process'20169,322,097'EPI base ring'20169,230,837'Multizone control of lamps in a conical lamphead using pyrometers'20168,980,044'Plasma reactor with a multiple zone thermal control feed forward control apparatus'20158,876,024'Heated showerhead assembly'2014D0716240'Lower chamber liner'2014D0711331'Upper chamber liner'20148,801,893'Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor'20148,772,055'Multizone control of lamps in a conical lamphead using pyrometers'20148,608,900'Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes'20138,596,336'Substrate support temperature control'20138,546,267'Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control'20138,337,660'Capacitively coupled plasma reactor having very agile wafer temperature control'20128,329,586'Method of processing a workpiece in a plasma reactor using feed forward thermal control'20128,231,799'Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone'20128,221,580'Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops'20128,157,951'Capacitively coupled plasma reactor having very agile wafer temperature control'20128,123,902'Gas flow diffuser'20128,092,638'Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution'20128,092,639'Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes'20128,034,180'Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor'20118,021,521'Method for agile workpiece temperature control in a plasma reactor using a thermal model'20118,012,304'Plasma reactor with a multiple zone thermal control feed forward control apparatus'20117,988,872'Method of operating a capacitively coupled plasma reactor with dual temperature control loops'20117,649,729'Electrostatic chuck assembly'20107,541,292'Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones'20097,540,971'Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content'20097,431,859'Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation'20086,406,522'Dual mode air treatment apparatus and method'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002Based in Park Ridge, IL, US· patent location history
2008–2021Patents assigned to APPLIED MATERIALS INC (45)· patent assignee history
2008–2021Based in Pleasanton, CA, US· patent location history
2012–2015Patents assigned to BERA KALLOL (12)· patent assignee history
2012–2015Patents assigned to HOFFMAN DANIEL J (12)· patent assignee history
2012–2015Patents assigned to BRILLHART PAUL LUKAS (11)· patent assignee history
2012–2015Patents assigned to FOVELL RICHARD (11)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC452008–2021
BERA KALLOL122012–2015
HOFFMAN DANIEL J122012–2015
BRILLHART PAUL LUKASself112012–2015
FOVELL RICHARD112012–2015
Locations
LocationPatentsSpan
Pleasanton, California, US492008–2021
Park Ridge, Illinois, US12002