LexDanaLexDanabeta
Inventor

Rezaur Rahman Khan

Inventor
Rancho Santa Margarita, CA, US

Overview

60→
Patents
2007–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 60 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1049%
H01LSemiconductor devices24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H05KPrinted circuits7%
H04BTransmission3%
B82YSpecific uses or applications of nanostructures2%
H10DInorganic electric semiconductor devices2%
Y10TTechnical subjects covered by former us classification2%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application1%
H01FMagnets1%
PatentTitleYear
10,615,110Thin recon interposer package without TSV for fine input/output pitch fan-out202010,276,403High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer201910,079,191Heat spreader having thermal interface material retainment201810,008,439Thin recon interposer package without TSV for fine input/output pitch fan-out20189,842,827'Wafer level system in package (SiP) using a reconstituted wafer and method of making'20179,837,378Fan-out 3D IC integration structure without substrate and method of making the same20179,693,461'Magnetic-core three-dimensional (3D) inductors and packaging integration'20179,548,251'Semiconductor interposer having a cavity for intra-interposer die'20179,431,370'Compliant dielectric layer for semiconductor device'20169,431,371'Semiconductor package with a bridge interposer'20169,406,636'Interposer package-on-package structure'20169,338,880'Mutual capacitance and magnetic field distribution control for transmission lines'20169,299,634'Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages'20169,293,393'Stacked packaging using reconstituted wafers'20169,287,189'Flexible routing for chip on board applications'20169,275,976'System-in-package with integrated socket'20169,236,442'Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections'20169,230,875'Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding'20169,219,054'Compliant dielectric layer for semiconductor device'20159,153,507'Semiconductor package with improved testability'20159,129,980'Package 3D interconnection and method of making same'20159,070,627'Interposer package-on-package structure'20159,064,781'Package 3D interconnection and method of making same'20159,059,179'Semiconductor package with a bridge interposer'20159,041,171'Programmable interposer with conductive particles'20159,024,436'Thermal interface material for integrated circuit package'20159,013,041'Semiconductor package with ultra-thin interposer without through-semiconductor vias'20159,013,035'Thermal improvement for hotspots on dies in integrated circuit packages'20158,928,128'Semiconductor package with integrated electromagnetic shielding'20158,872,321'Semiconductor packages with integrated heat spreaders'20148,829,655'Semiconductor package including a substrate and an interposer'20148,829,654'Semiconductor package with interposer'20148,829,656'Semiconductor package including interposer with through-semiconductor vias'20148,823,144'Semiconductor package with interface substrate having interposer'20148,791,533'Semiconductor package having an interposer configured for magnetic signaling'20148,749,072'Semiconductor package with integrated selectively conductive film interposer'20148,718,550'Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding'20148,664,772'Interface substrate with interposer'20148,587,132'Semiconductor package including an organic substrate and interposer having through-semiconductor vias'20138,587,123'Multi-chip and multi-substrate reconstitution based packaging'20138,581,381'Integrated circuit (IC) package stacking and IC packages formed by same'20138,558,395'Organic interface substrate having interposer with through-semiconductor vias'20138,508,045'Package 3D interconnection and method of making same'20138,417,200'Wideband power efficient high transmission power radio frequency (RF) transmitter'20138,367,475'Chip scale package assembly in reconstitution panel process format'20138,269,323'Integrated circuit package with etched leadframe for package-on-package interconnects'20128,212,149'Mutual capacitance and magnetic field distribution control for transmission lines'20128,183,687'Interposer for die stacking in semiconductor packages and the method of making the same'20128,183,680'No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement'20128,169,067'Low profile ball grid array (BGA) package with exposed die and method of making same'20128,102,027'IC package sacrificial structures for crack propagation confinement'20128,039,949'Ball grid array package having one or more stiffeners'20117,872,335'Lead frame-BGA package with enhanced thermal performance and I/O counts'20117,808,087'Leadframe IC packages having top and bottom integrated heat spreaders'20107,714,453'Interconnect structure and formation for package stacking of molded plastic area array package'20107,618,849'Integrated circuit package with etched leadframe for package-on-package interconnects'20097,579,217'Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader'20097,566,590'Low voltage drop and high thermal performance ball grid array package'20097,462,933'Ball grid array package enhanced with a thermal and electrical connector'20087,202,559'Method of assembling a ball grid array package with patterned stiffener layer'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2017Patents assigned to BROADCOM CORP (53)· patent assignee history
2007–2017Based in Rancho Santa Margarita, CA, US· patent location history
2012–2017Patents assigned to KHAN REZAUR RAHMAN (26)· patent assignee history
2012–2017Patents assigned to ZHAO SAM ZIQUN (21)· patent assignee history
2013–2017Patents assigned to HU KEVIN KUNZHONG (11)· patent assignee history
2013–2015Based in Santa Margarita, CA, US· patent location history
2014–2017Patents assigned to CHEN XIANGDONG (10)· patent assignee history
2015–2020Based in Irvine, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
BROADCOM CORP532007–2017
KHAN REZAUR RAHMANself262012–2017
ZHAO SAM ZIQUN212012–2017
HU KEVIN KUNZHONG112013–2017
CHEN XIANGDONG102014–2017
Locations
LocationPatentsSpan
Rancho Santa Margarita, California, US472007–2017
Irvine, California, US112015–2020
Santa Margarita, California, US22013–2015