USPatentGranted
S1

Light emitting diode package

Granted 6 Sep 2005 · no office action yet

Assignee: HARVATEK CORPORATION

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Attorney: Attorney · Log in to unlock

Inventors: Jonnie Chuang, Yann Lee, Bily Wang · Examiner: Stella Reid · AU 2912 · TC 2900

Application
29/179,243
filed 8 Apr 2003
Publication
Not published
not published
Patent· this page
US D509195
granted 6 Sep 2005

Life of the patent

5 dated events
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Description

1 parts
›A light emitting diode (LED) with two top…

A light emitting diode (LED) with two top electrodes is mounted on a first metal plate. One of the electrodes is wire-bonded to the first metal plate serving as one terminal of the LED. The other electrode of the LED is connected by wire-bonding to a second metal plate serving as a second terminal of the LED. The inner ends of the metal plates and the LED are imbedded in a transparent glue, leaving the outer ends of the metal plates for external connection. The transparent glue allows the light emitted from the LED to be radiated.

FIG. 1 is a top plan view of the light emitting diode package showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof; and,

FIG. 5 is a side elevation view thereof.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/180

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File wrapper

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Pendency
2.4 y
882 days filing → grant
Office actions
0
none on record
Examiner
Stella Reid
art unit 2912 · TC 2900
Citations: 8 back · 0 forward

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Chain of title

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Term & fees

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Citations

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