Inventor
Ashish Gupta
Inventor
Chandler, AZ, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing21%
H04LTransmission of digital information, e.g. telegraphic communication12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application7%
G01RMeasuring electric variables7%
H01LSemiconductor devices7%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use7%
H05KPrinted circuits4%
Y10TTechnical subjects covered by former us classification4%
B01LChemical or physical laboratory apparatus for general use1%
PatentTitleYear
11,025,644Data verification via independent processors of a device202111,019,619Reference signal multiplexing in shortened transmission time intervals202110,380,046High performance interconnect physical layer201910,357,939High performance light weight carbon fiber fabric-electrospun carbon nanofibers hybrid polymer composites201910,248,591High performance interconnect20199,916,266'High performance interconnect physical layer'20189,865,521'Copper nanorod-based thermal interface material (TIM)'20189,626,321'High performance interconnect'20179,601,406'Copper nanorod-based thermal interface material (TIM)'20179,477,275'Thermal management solution for circuit products'20169,448,278'Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same'20169,418,035'High performance interconnect physical layer'20169,347,987'Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same'20169,207,274'Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same'20158,891,235'Thermal interface for multi-chip packages'20148,410,802'System including thermal control unit having conduit for dispense and removal of liquid thermal interface material'20137,982,478'Liquid TIM dispense and removal method and assembly'20117,742,299'Piezo fans for cooling an electronic device'20107,739,876'Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator'20107,376,775'Apparatus, system, and method to enable transparent memory hot plug/remove'20087,328,375'Pass through debug port on a high speed asynchronous link'20087,249,273'Synchronized serial interface'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2019Patents assigned to INTEL CORP (18)· patent assignee history
2007–2021Based in San Jose, CA, US· patent location history
2010–2019Based in Chandler, AZ, US· patent location history
2013–2017Patents assigned to GUPTA ASHISH (4)· patent assignee history
2013Patents assigned to ABAZARNIA NADER N (1)· patent assignee history
2014–2016Patents assigned to MAVEETY JAMES G (2)· patent assignee history
2016Patents assigned to ACIKALIN TOLGA (1)· patent assignee history
2019Based in New Delhi, IN· patent location history
2021Based in Santa Clara, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 18 | 2007–2019 |
| GUPTA ASHISHself | 4 | 2013–2017 |
| MAVEETY JAMES G | 2 | 2014–2016 |
| ABAZARNIA NADER N | 1 | 2013 |
| ACIKALIN TOLGA | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 15 | 2010–2019 |
| San Jose, California, US | 5 | 2007–2021 |
| Santa Clara, California, US | 1 | 2021 |
| New Delhi, IN | 1 | 2019 |