An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Claims

20 · 3 independent · depth 4

20 granted claims

›1.independentAn apparatus to temperature-control a semiconductive device, comprising:na structure including a planar surface defining a plurality of heat-transfer …+5

›2.↳ 1The apparatus of claim 1, wherein the at least one supply-orifice comprises a plurality of supply-orifices.d2

›3.↳ 1The apparatus of claim 1, wherein the at least one supply- orifice comprises a first supply-orifice and a second supply-orifice, the first supply-orif…d2

›4.↳ 1The apparatus of claim 1, the structure further comprising a liquid impermeable seal positioned to surround a periphery of the plurality of heat trans…d2

›5.↳ 1The apparatus of claim 1, wherein the structure including at least one heat-transfer fluid unit cell is part of a direct fluid-contact thermal block, …d2

›6.↳ 1The apparatus of claim 1, wherein the unit cell makes up one-third of a unit block in an array of supply-orifices and return-orifices disposed in the …d2

›7.independentA chip-testing system comprising:na device under test (DUT) footprint on a direct fluid-contact thermal block including at least one supply-orifice an…+8

›8.↳ 7The chip-testing system of claim 7, wherein the direct fluid-contact thermal block including at least one supply-orifice and at least one return-orifi…d2+1

›9.↳ 7The chip-testing system of claim 7, wherein the DUT comprises a semiconductive device, wherein the DUT is disposed on a mounting substrate and affixed…d2

›10.↳ 7The chip-testing system of claim 7, further including a resistive heater disposed in the direct fluid-contact thermal block.d2

›11.↳ 7The chip-testing system of claim 7, further including a controller wherein the controller includes pulse-width modulated H-bridge pump control.d2

›12.↳ 7The chip-testing system of claim 7, further including a controller wherein the controller includes proportional, integral, and derivative control and …d2

›13.↳ 7The chip-testing system of claim 7, further including a controller wherein the controller includes servo control.d2

›14.↳ 7The chip-testing system of claim 7, further including a coolant fluid that is a two-phase refrigerant.d2

›16.independentAn apparatus to temperature-control a semiconductive device, comprising:na structure including a planar surface defining at least one heat-transfer fl…+4

Classifications

3 codes

IPC · International Patent Classification

Section F — Mechanical engineering; lighting; heating; weapons

F28F3/12

Section G — Physics

G01R31/28

Section H — Electricity

H01L23/473

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6.1 y

2,223 days filing → grant

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Christopher McAndrew

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1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20110109335 A1	12 May 2011

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