Inventor
Jiro Kajiwara
Inventor
Cupertino, CA, US
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing72%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
B08BCleaning in general4%
B22FWorking metallic powder4%
C30BSingle-crystal growth4%
F26BDrying solid materials or objects by removing liquid therefrom4%
PatentTitleYear
9,250,014'Vacuum storage method and device for crystalline material'20169,212,850'Vacuum storage method and device for crystalline material'20157,311,586'Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure'20077,118,456'Polishing head, retaining ring for use therewith and method fo polishing a substrate'20067,029,382'Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure'20066,966,822'System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control'20056,893,327'Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface'20056,887,132'Slurry distributor for chemical mechanical polishing apparatus and method of using the same'20056,641,461'Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal'20036,623,343'System and method for CMP head having multi-pressure annular zone subcarrier material removal control'20036,558,232'System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control'20036,540,590'Chemical mechanical polishing apparatus and method having a rotating retaining ring'20036,527,625'Chemical mechanical polishing apparatus and method having a soft backed polishing head'20036,508,696'Wafer-polishing head and polishing apparatus having the same'20036,506,105'System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control'20036,398,906'Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer'20026,368,189'Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure'20026,346,038'Wafer loading/unloading device and method for producing wafers'20025,527,209'Wafer polisher head adapted for easy removal of wafers'19965,443,416'Rotary union for coupling fluids in a wafer polishing apparatus'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–1996Patents assigned to CYBEQ SYST INC (2)· patent assignee history
1995–1996Based in Foster City, CA, US· patent location history
2002–2003Patents assigned to MITSUBISHI MATERIALS CORP (4)· patent assignee history
2002–2007Based in Cupertino, CA, US· patent location history
2002Based in Omiya, JP· patent location history
2003–2005Patents assigned to MULTI PLANAR TECHNOLOGIES INC (9)· patent assignee history
2005–2006Based in Saitama, JP· patent location history
2006–2007Patents assigned to EBARA CORP (2)· patent assignee history
2015–2016Based in Tokyo, JP· patent location history
2016Patents assigned to HORIOKA YUKICHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MULTI PLANAR TECHNOLOGIES INC | 9 | 2003–2005 |
| MITSUBISHI MATERIALS CORP | 4 | 2002–2003 |
| CYBEQ SYST INC | 2 | 1995–1996 |
| EBARA CORP | 2 | 2006–2007 |
| HORIOKA YUKICHI | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cupertino, California, US | 12 | 2002–2007 |
| Tokyo, JP | 2 | 2015–2016 |
| Saitama, JP | 2 | 2005–2006 |
| Omiya, JP | 2 | 2002 |
| Foster City, California, US | 2 | 1995–1996 |