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Inventor

Kensuke Ide

Inventor
Hamamatsu, JP

Overview

29→
Patents
1988–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
G10HElectrophonic musical instruments14%
B23KSoldering or unsoldering11%
H01LSemiconductor devices11%
Y10TTechnical subjects covered by former us classification7%
H04BTransmission6%
H04MTelephonic communication6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems5%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
PatentTitleYear
10,486,263Room-temperature-bonded semiconductor device and manufacturing method of room-temperature-bonded semiconductor device201910,112,376Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus20189,580,306'Room temperature bonding apparatus and room temperature bonding method'20179,443,711'Room-temperature bonding apparatus'20169,130,000'Wafer bonding device and wafer bonding method'20159,064,910'Bonding unit control unit and multi-layer bonding method'20159,023,170'Bonding unit control unit and multi-layer bonding method'20159,005,390'Room temperature bonding apparatus'20158,985,175'Room temperature bonding machine and room temperature bonding method'20158,936,998'Manufcaturing method for room-temperature substrate bonding'20158,906,175'Room temperature bonding apparatus'20148,857,487'Room temperature bonding apparatus'20148,608,048'Room-temperature bonding method and room-temperature bonding apparatus including sputtering'20138,602,289'Room temperature bonding using sputtering'20138,222,508'Tone signal creating apparatus and method'20127,940,263'Curved-surface generating method and program, and three-dimensional shape processing apparatus'20117,531,737'Music processing apparatus and management method therefor'20097,514,624'Portable telephony apparatus with music tone generator'20097,161,081'Portable telephony apparatus with music tone generator'20077,119,268'Portable telephony apparatus with music tone generator'20067,091,410'Apparatus and computer program for providing arpeggio patterns'20066,967,276'Portable telephony apparatus with music tone generator'20056,911,592'Portable telephony apparatus with music tone generator'2005RE038554'Method of extending capability of music apparatus by networking'20046,698,982'Machine tool'20046,429,365'Performance control apparatus and method capable of shifting performance style during performance'20025,892,171'Method of extending capability of music apparatus by networking'19994,747,734'Profiling apparatus'19884,719,578'Profiling control apparatus and control method thereof'1988

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988–2015Patents assigned to MITSUBISHI HEAVY IND LTD (13)· patent assignee history
1988Based in Hiroshima, JP· patent location history
1999–2012Patents assigned to YAMAHA CORP (11)· patent assignee history
1999–2012Based in Hamamatsu, JP· patent location history
2004–2018Based in Ritto, JP· patent location history
2012–2016Patents assigned to IDE KENSUKE (11)· patent assignee history
2013–2016Patents assigned to GOTO TAKAYUKI (10)· patent assignee history
2014–2016Patents assigned to KINOUCHI MASATO (7)· patent assignee history
2014–2015Based in Shiga, JP· patent location history
2015–2019Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI HEAVY IND LTD131988–2015
IDE KENSUKEself112012–2016
YAMAHA CORP111999–2012
GOTO TAKAYUKI102013–2016
KINOUCHI MASATO72014–2016
Locations
LocationPatentsSpan
Hamamatsu, JP111999–2012
Ritto, JP82004–2018
Tokyo, JP52015–2019
Shiga, JP32014–2015
Hiroshima, JP21988