A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.

Claims

7 · 1 independent · depth 6

7 granted claims

›1.independentA multi-layer bonding method comprising:nforming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding cham…+6

›2.↳ 1The multi-layer bonding method according to claim 1, wherein a load applied between said second substrate and said first bonded substrate when said se…d2+4

›7.↳ 1The multi-layer bonding method according to claim 1, further comprising:ndecompressing an internal space of a load lock chamber, when said cartridge i…d2

Classifications

5 codes

IPC · International Patent Classification

Section B — Performing operations; transporting

B81C1/00
B81C99/00
B29C70/68

Section H — Electricity

H01L21/67

USPC · US Patent Classification

156/272.2

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Pendency

4.5 y

1,651 days filing → grant

Office actions

non-final + final

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1 RCE

Examiner

Daniel McNally

art unit 1746 · TC 1700

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Citations: 20 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20120031557 A1	9 Feb 2012

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