Inventor
Dirk Robert Walter Leipold
Inventor
San Jose, CA, US
Overview
Patents· 211 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H03Fprimary
H03FAmplifiers12%
H04BTransmission9%
H01LSemiconductor devices9%
H03HImpedance networks, e.g. resonant circuits9%
H10DInorganic electric semiconductor devices8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H01FMagnets5%
H03KPulse technique4%
B82YSpecific uses or applications of nanostructures3%
PatentTitleYear
11,094,459Substrates with integrated three dimensional inductors with via columns202111,069,970Multi-radio access technology antenna assembly and related front-end package202111,063,021Microelectronics package with vertically stacked dies202111,049,859Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process202111,043,921Doherty amplifier system202111,038,472Power amplifier system202111,018,702Multi-radio access technology circuit202111,011,498Microelectronics package with vertically stacked dies202111,004,853Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process202111,005,181Multi-layer antenna assembly and related antenna array202110,998,900Radio frequency switch202110,992,270Power amplifier apparatus supporting reverse intermodulation product cancellation202110,985,033Semiconductor package with reduced parasitic coupling effects and process for making the same202110,978,999Doherty radio frequency amplifier circuitry202110,964,672Microelectronics package with vertically stacked dies202110,965,258Weakly coupled tunable RF receiver architecture202110,951,183PA output memory neutralization using baseband I/O capacitance current compensation202110,943,905Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process202110,943,797Semiconductor package with reduced parasitic coupling effects and process for making the same202110,934,163Classic-quantum injection interface device202110,917,145Radio frequency transmitter with reduced interconnect signal paths for beamforming202110,903,413Semiconductor process optimized for quantum structures202110,896,908Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process202110,897,246Radio frequency switching circuitry with reduced switching time202110,886,148Semiconductor package with reduced parasitic coupling effects and process for making the same202110,873,310RF filtering circuitry202010,873,019Topological programmable scalable quantum computing machine utilizing chord line quasi unidimensional aperature tunneling semiconductor structures202010,868,119Semiconductor quantum structures using preferential tunneling through thin insulator layers202010,865,106Semiconductor controlled quantum interaction gates202010,861,940Semiconductor process for quantum structures with staircase active well incorporating shared gate control202010,850,978Quantum shift register structures202010,854,738Semiconductor process for quantum structures with staircase active well202010,845,496Multistage semiconductor quantum detector circuit incorporating anticorrelation202010,843,924Quantum shift register structures202010,822,231Semiconductor controlled quantum ancillary interaction gate202010,804,246Microelectronics package with vertically stacked dies202010,800,654Semiconductor controlled quantum swap interaction gate202010,796,835Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff202010,793,431Semiconductor controlled quantum annealing interaction gate202010,784,149Air-cavity module with enhanced device isolation202010,756,675Broadband power amplifier circuit202010,749,518Stacked field-effect transistor switch202010,742,253Radio frequency front-end apparatus202010,715,133Radio frequency switch202010,707,095Semiconductor package with reduced parasitic coupling effects and process for making the same202010,692,645Coupled inductor structures202010,680,565Power amplifier system202010,658,202Semiconductor package with reduced parasitic coupling effects and process for making the same202010,630,248Low-noise amplifier system202010,622,309Transmission line structure with high Q factor and low insertion loss for millimeter wave applications202010,615,147Microelectronics package with vertically stacked dies202010,600,659Semiconductor package with reduced parasitic coupling effects and process for making the same202010,562,765Quantum shift register incorporating bifurcation202010,562,764Quantum shift register based ancillary quantum interaction gates202010,553,564Microelectronics package with vertically stacked dies202010,553,530Three-dimensional (3D) inductor-capacitor (LC) circuit202010,504,750Semiconductor package with reduced parasitic coupling effects and process for making the same201910,491,175Power amplifier apparatus supporting reverse intermodulation product cancellation201910,492,301Method for manufacturing an integrated circuit package201910,483,035Substrates with integrated three dimensional solenoid inductors201910,468,172Advanced 3D inductor structures with confined magnetic field201910,468,329Thermally enhanced semiconductor package having field effect transistors with back-gate feature201910,448,516Method for manufacturing an integrated circuit package201910,447,344RF branch with accelerated turn-on and high Q value201910,447,222Dynamic thermal compensation in a power amplifier201910,431,523Thermally enhanced semiconductor package having field effect transistors with back-gate feature201910,405,433Method for manufacturing an integrated circuit package201910,381,289Thermally enhanced semiconductor package having field effect transistors with back-gate feature201910,374,788Phase locked loop (PLL)-less millimeter wave power head201910,361,667Low noise amplifier circuit201910,349,529Method for manufacturing an integrated circuit package201910,340,202Thermally enhanced semiconductor package having field effect transistors with back-gate feature201910,333,479Power amplifier with improved linearity201910,326,490Multi radio access technology power management circuit201910,320,339Weakly coupled based harmonic rejection filter for feedback linearization power amplifier201910,304,753Thermally enhanced semiconductor package having field effect transistors with back-gate feature201910,298,196RF filtering circuitry201910,298,186Diversity receive modules using one or more shared tunable notch filters for transmit blocker rejection201910,290,632AC-coupled switch and metal capacitor structure for nanometer or low metal layer count processes201910,284,178BAW/SAW-assisted LC filters and multiplexers201910,276,495Backside semiconductor die trimming201910,277,222Radio frequency switch201910,269,680Thermally enhanced semiconductor package having field effect transistors with back-gate feature201910,270,437RF switch having reduced signal distortion201910,262,915Thermally enhanced semiconductor package with thermal additive and process for making the same201910,263,616Radio frequency switch201910,242,945Backside semiconductor die trimming201910,236,235Thermally enhanced semiconductor package having field effect transistors with back-gate feature201910,229,860Thermally enhanced semiconductor package with thermal additive and process for making the same201910,224,891Radio frequency power amplifier with noise reduction feedback linearization201910,205,436High-voltage converter based tuning of acoustic filters201910,205,425Variable gain low noise amplifier201910,199,304Thermally enhanced semiconductor package having field effect transistors with back-gate feature201910,199,301Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer201910,192,803Thermally enhanced semiconductor package with thermal additive and process for making the same201910,187,016Amplifier with improved linearity201910,181,478Radio frequency switch having field effect transistor cells201910,163,748Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer201810,153,223Thermally enhanced semiconductor package with thermal additive and process for making the same201810,148,227RF power amplifier dynamic supply boosting circuit201810,121,718Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer201810,116,298Apparatus with main transistor-based switch and on-state linearization network201810,109,548Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer201810,109,502Semiconductor package with reduced parasitic coupling effects and process for making the same201810,103,080Thermally enhanced semiconductor package with thermal additive and process for making the same201810,090,262Microelectronics package with inductive element and magnetically enhanced mold compound component201810,090,339Radio frequency (RF) switch201810,085,352Method for manufacturing an integrated circuit package201810,079,196Thermally enhanced semiconductor package having field effect transistors with back-gate feature201810,062,629Antenna impedance matching and aperture tuning circuitry201810,062,583Microelectronics package with inductive element and magnetically enhanced mold compound component201810,062,628Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer201810,062,494Apparatus with 3D inductors201810,049,993Microelectronics package with inductive element and magnetically enhanced mold compound component201810,044,349Radio frequency (RF) switch with on and off switching acceleration201810,037,929Thermally enhanced semiconductor package having field effect transistors with back-gate feature201810,026,626Microelectronics package with inductive element and magnetically enhanced mold compound component201810,026,669Thermally enhanced semiconductor package with thermal additive and process for making the same201810,028,390Method for manufacturing an integrated circuit package201810,020,405Microelectronics package with integrated sensors201810,014,265Microelectronics package with inductive element and magnetically enhanced mold compound component201810,008,431Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer201810,008,434Thermally enhanced semiconductor package having field effect transistors with back-gate feature20189,997,426Thermally enhanced semiconductor package with thermal additive and process for making the same20189,992,876Method for manufacturing an integrated circuit package20189,984,952Thermally enhanced semiconductor package having field effect transistors with back-gate feature20189,978,697Microelectronics package with inductive element and magnetically enhanced mold compound component20189,978,886Microelectronics package with integrated sensors20189,978,615Microelectronics package with inductive element and magnetically enhanced mold compound component20189,978,659Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer20189,973,154Dual output RF LNA20189,966,905Weakly coupled based harmonic rejection filter for feedback linearization power amplifier20189,966,981Passive acoustic resonator based RF receiver20189,960,095Thermally enhanced semiconductor package with thermal additive and process for making the same20189,954,498Weakly coupled tunable RF receiver architecture20189,948,251Low noise amplifier (LNA) system20189,942,991Method for manufacturing an integrated circuit package20189,935,031Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer20189,935,064Microelectronics package with inductive element and magnetically enhanced mold compound component20189,935,210Microelectronics package with integrated sensors20189,929,458'Hybrid cavity and lumped filter architecture'20189,922,898'Thermally enhanced semiconductor package with thermal additive and process for making the same'20189,922,847'Microelectronics package with inductive element and magnetically enhanced mold compound component'20189,899,133'Advanced 3D inductor structures with confined magnetic field'20189,899,340'Microelectronics package with inductive element and magnetically enhanced mold compound component'20189,899,289'Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer'20189,899,543'Microelectronics package with integrated sensors'20189,893,710'High quality factor interconnect for RF circuits'20189,892,987'Thermally enhanced semiconductor package with thermal additive and process for making the same'20189,892,938'Microelectronics package with inductive element and magnetically enhanced mold compound component'20189,871,499'Multi-band impedance tuners using weakly-coupled LC resonators'20189,870,855'Multiplexers using weakly-coupled networks in RF front end circuitry'20189,865,553'Microelectronics package with inductive element and magnetically enhanced mold compound component'20189,866,197'Tunable RF filter based RF communications system'20189,859,183'Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer'20189,859,863'RF filter structure for antenna diversity and beam forming'20189,852,930Microelectronics package with inductive element and magnetically enhanced mold compound component20179,853,340Coupled slow-wave transmission lines20179,847,564Slow-wave transmission line formed in a multi-layer substrate20179,847,565Tunable slow-wave transmission line20179,831,149Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer20179,825,656'Weakly coupled tunable RF transmitter architecture'20179,824,951'Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same'20179,800,282'Passive voltage-gain network'20179,786,575'Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same'20179,787,270'Overstress management for power amplifiers'20179,787,353'Radio frequency (RF) front-end without signal switches'20179,780,817'RX shunt switching element-based RF front-end circuit'20179,780,756'Calibration for a tunable RF filter structure'20179,774,311'Filtering characteristic adjustments of weakly coupled tunable RF filters'20179,761,367'Multiplexers using weakly-coupled networks in RF front end circuitry'20179,755,671'VSWR detector for a tunable filter structure'20179,748,905'RF replicator for accurate modulated amplitude and phase measurement'20179,741,632'Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same'20179,742,374'Filtering characteristic adjustments of weakly coupled tunable RF filters'20179,716,481'Multi-band impedance tuners using weakly-coupled LC resonators'20179,705,463'High efficiency radio frequency power amplifier circuitry with reduced distortion'20179,705,478'Weakly coupled tunable RF receiver architecture'20179,705,542'Reconfigurable RF filter'20179,698,751'Radio frequency filtering circuitry with resonators'20179,685,928'Interference rejection RF filters'20179,680,440'Multi-band impedance tuners using weakly-coupled LC resonators'20179,653,772'Semiconductor resonators with reduced substrate losses'20179,647,641'Weakly coupled tunable RF receiver architecture'20179,628,042'Multi-band impedance tuners using weakly-coupled LC resonators'20179,628,045'Cooperative tunable RF filters'20179,614,490'Multi-band interference optimization'20179,584,085'Amplifying system'20179,571,056'Power amplifier with self aligned peaking stage'20179,564,869'Multi-band interference optimization'20179,559,644'Low noise amplifier'20179,530,709'Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer'20169,525,395'Multi-band interference optimization'20169,484,879'Nonlinear capacitance linearization'20169,455,680'Tunable RF filter structure formed by a matrix of weakly coupled resonators'20169,444,411'RF power amplifier with total radiated power stabilization'20169,444,417'Weakly coupled RF network based power amplifier architecture'20169,419,578'Tunable RF filter paths for tunable RF filter structures'20169,294,046'RF power amplifier with PM feedback linearization'20169,294,045'Gain and phase calibration for closed loop feedback linearized amplifiers'20169,196,406'High Q factor inductor structure'20159,048,836'Body bias switching for an RF switch'20158,917,075'Switched inductor DC-DC converter'20148,896,276'Boost-buck DC-DC converter'20148,508,296'Tunable directional power combiner'20138,497,736'Direct DC coupled push-pull BJT driver for power amplifier with built-in gain and bias current signal dependent expansion'20138,389,868'Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits'20137,863,994'System and method for increasing radio frequency (RF) microwave inductor-capacitor (LC) oscillator frequency tuning range'20117,375,598'System and method for increasing radio frequency (RF)/microwave inductor-capacitor (LC) oscillator frequency tuning range'20087,023,272'Multi-band low noise amplifier system'20066,348,718'Integrated CMOS circuit for use at high frequencies'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2013Patents assigned to TEXAS INSTRUMENTS INC (5)· patent assignee history
2006–2011Based in Plano, TX, US· patent location history
2013–2014Patents assigned to ANADIGICS INC (4)· patent assignee history
2013–2014Based in Califon, NJ, US· patent location history
2013Based in Igis, CH· patent location history
2015–2019Patents assigned to RF MICRO DEVICES INC (43)· patent assignee history
2015–2021Based in San Jose, CA, US· patent location history
2016–2021Patents assigned to QORVO US INC (113)· patent assignee history
2020–2021Patents assigned to EQUAL1 LABS INC (15)· patent assignee history
2020–2021Based in Fremont, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QORVO US INC | 113 | 2016–2021 |
| RF MICRO DEVICES INC | 43 | 2015–2019 |
| EQUAL1 LABS INC | 15 | 2020–2021 |
| TEXAS INSTRUMENTS INC | 5 | 2002–2013 |
| ANADIGICS INC | 4 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 187 | 2015–2021 |
| Fremont, California, US | 15 | 2020–2021 |
| Califon, New Jersey, US | 4 | 2013–2014 |
| Plano, Texas, US | 3 | 2006–2011 |
| Igis, CH | 1 | 2013 |