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Inventor

Hsing-Kuo Hsia

Inventor
Jhubei City, TW

Overview

42→
Patents
2012–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 42 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10HInorganic light-emitting semiconductor devices having potential barriers20%
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
G02BOptical elements, systems or apparatus8%
H10DInorganic electric semiconductor devices4%
H05KPrinted circuits3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
B82YSpecific uses or applications of nanostructures2%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light2%
PatentTitleYear
11,101,260Method of forming a dummy die of an integrated circuit having an embedded annular structure202110,996,410Methods of forming semiconductor packages202110,937,736Hybrid integrated circuit package and method202110,930,628Photonic semiconductor device and method202110,866,373Optical transceiver and manufacturing method thereof202010,867,982Hybrid integrated circuit package and method202010,746,923Photonic semiconductor device and method202010,665,560Optical semiconductor package and method for manufacturing the same202010,481,351Semicondcutor packages201910,371,893Hybrid interconnect device and method201910,267,990Hybrid interconnect device and method201910,162,139Semicondcutor package20189,691,855'Method of growing a high quality III-V compound layer on a silicon substrate'20179,472,714'Dicing-free LED fabrication'20169,449,954'LED with IC integrated lighting module'20169,391,067'Multiple silicide integration structure and method'20169,379,299'LED device with improved thermal performance'20169,312,432'Growing an improved P-GaN layer of an LED through pressure ramping'20169,224,636'Methods of forming through silicon via openings'20159,117,968'Light-emitting diode structure'20159,099,593'III-V group compound devices with improved efficiency and droop rate'20159,099,632'Light emitting diode emitter substrate with highly reflective metal bonding'20159,065,015'Forming light-emitting diodes using seed particles'20158,993,393'Multiple silicide integration structure and method'20158,993,447'LED device with improved thermal performance'20158,981,534'Pre-cutting a back side of a silicon substrate for growing better III-V group compound layer on a front side of the substrate'20158,912,033'Dicing-free LED fabrication'20148,716,128'Methods of forming through silicon via openings'20148,653,542'Micro-interconnects for light-emitting diodes'20148,618,564'High efficiency light emitting diodes'20138,598,617'Methods of fabricating light emitting diode packages'20138,592,242'Etching growth layers of light emitting devices to reduce leakage current'20138,563,334'Method to remove sapphire substrate'20138,546,165'Forming light-emitting diodes using seed particles'20138,519,409'Light emitting diode components integrated with thermoelectric devices'20138,519,538'Laser etch via formation'20138,476,659'Light emitting device'20138,415,684'LED device with improved thermal performance'20138,415,183'Wafer level conformal coating for LED devices'20138,409,965'Method and structure for LED with nano-patterned substrate'20138,241,932'Methods of fabricating light emitting diode packages'20128,236,584'Method of forming a light emitting diode emitter substrate with highly reflective metal bonding'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2017Patents assigned to HSIA HSING-KUO (22)· patent assignee history
2012–2016Patents assigned to TSMC SOLID STATE LIGHTING LTD (22)· patent assignee history
2012–2015Patents assigned to YU CHIH-KUANG (10)· patent assignee history
2012–2015Patents assigned to CHIU CHING-HUA (9)· patent assignee history
2012–2021Based in Jhubei City, TW· patent location history
2015Based in Hsin Chu Hsien, TW· patent location history
2016Based in Hsinchu, TW· patent location history
2018–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (12)· patent assignee history
2018–2021Based in Hsinchu County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HSIA HSING-KUOself222012–2017
TSMC SOLID STATE LIGHTING LTD222012–2016
TAIWAN SEMICONDUCTOR MFG CO LTD122018–2021
YU CHIH-KUANG102012–2015
CHIU CHING-HUA92012–2015
Locations
LocationPatentsSpan
Jhubei City, TW342012–2021
Hsinchu County, TW42018–2021
Hsin Chu Hsien, TW22015
Hsinchu, TW12016