Inventor

Toshiki Naito

Inventor

Osaka, JP

Overview

1994–2016

Patent span

Electricity

Primary field (CPC H)

Patents· 49 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits31%

Y10TTechnical subjects covered by former us classification18%

G11BInformation storage based on relative movement between record carrier and transducer13%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%

G02BOptical elements, systems or apparatus7%

H01LSemiconductor devices3%

H10HInorganic light-emitting semiconductor devices having potential barriers3%

G01NInvestigating or analysing materials by determining their chemical or physical properties3%

LOC133%

Y02PClimate change mitigation technologies in the production or processing of goods3%

PatentTitleYear

9,450,160'Reflecting resin sheet, light emitting diode device and producing method thereof'2016 9,412,920'Phosphor reflecting sheet, light emitting diode device, and producing method thereof'2016 9,214,611'Reflecting resin sheet, light emitting diode device and producing method thereof'2015 8,877,528'Producing method of light emitting element transfer sheet, producing method of light emitting device, light emitting element transfer sheet, and light emitting device'2014 8,776,579'Substance detection sensor'2014 8,767,352'Suspension board with circuit having an opening extending therethrough in the thickness direction for light emitted from a light emitting device'2014 8,647,517'Producing method of suspension board with circuit'2014 8,587,904'Suspension board with circuit having a light emitting device exposed from a surface thereof opposite to that on which a slider is mounted'2013 8,511,142'Substance detection sensor'2013 8,487,189'Wired circuit board assembly sheet'2013 8,362,360'Wired circuit board assembly sheet'2013 8,354,597'Wired circuit board and producing method thererof'2013 8,351,743'Suspension board with circuit and producing method thereof'2013 8,314,338'Wired circuit board and connection structure between wired circuit boards'2012 8,252,237'Substance detection sensor'2012 8,236,186'Production method of suspension board with circuit'2012 8,208,225'Suspension board with circuit and producing method thereof'2012 8,194,353'Suspension board with circuit'2012 8,184,404'Suspension board with circuit'2012 8,184,931'Suspension board with circuit'2012 8,056,223'Method of producing a suspension board with circuit'2011 8,017,871'Wired circuit board assembly sheet'2011 8,014,103'Suspension board with circuit'2011 8,000,566'Suspension board with circuit and producing method thereof'2011 7,971,353'Production method of a wired circuit board'2011 7,957,614'Suspension board with circuit and producing method thereof'2011 7,925,127'Suspension board with circuit and producing method thereof'2011 7,872,200'Wired circuit board and connection structure between wired circuit boards'2011 7,787,718'Suspension board with circuit'2010 7,629,540'Wired circuit board and production method thereof'2009 7,592,551'Wired circuit board assembly sheet'2009 7,546,003'Suspension board with circuit and producing method thereof'2009 D0580895'Grooves formed around a semiconductor device on a circuit board'2008 7,439,451'Tape carrier'2008 7,417,316'Wired circuit forming board, wired circuit board, and thin metal layer forming method'2008 D0574339'Pattern formed on the ground layer of a multilayer printed circuit board'2008 7,396,635'Producing method of wired circuit board'2008 7,371,971'Wired circuit board and producing method thereof'2008 D0568838'Grooves formed around a semiconductor device on a circuit board'2008 7,354,697'Process for producing wiring circuit board'2008 7,323,093'Producing method of flexible wired circuit board'2008 7,205,482'Tape carrier for TAB'2007 6,996,901'Production method of wired circuit board'2006 6,939,745'Method of producing tab tape carrier'2005 6,889,432'Method of manufacturing double-sided circuit board'2005 6,157,084'Film carrier and semiconductor device using same'2000 6,017,438'Method for producing circuit substrate having bump contact point and jet stream type plating apparatus used therefor'2000 6,011,310'Film carrier and semiconductor device using the same'2000 5,374,469'Flexible printed substrate'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2016Patents assigned to NITTO DENKO CORP (49)· patent assignee history

1994–2016Based in Osaka, JP· patent location history

2000–2008Based in Ibaraki, JP· patent location history

2000Based in Ibaraski, JP· patent location history

2011–2016Patents assigned to NAITO TOSHIKI (18)· patent assignee history

2011–2013Patents assigned to ISHII JUN (4)· patent assignee history

2012–2013Patents assigned to OHSAWA TETSUYA (6)· patent assignee history

2012–2016Patents assigned to OOYABU YASUNARI (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
NITTO DENKO CORP	49	1994–2016
NAITO TOSHIKIself	18	2011–2016
OHSAWA TETSUYA	6	2012–2013
OOYABU YASUNARI	5	2012–2016
ISHII JUN	4	2011–2013

Locations

Location	Patents	Span
Osaka, JP	44	1994–2016
Ibaraki, JP	4	2000–2008
Ibaraski, JP	1	2000