Grooves formed around a semiconductor device on a circuit board

FIG. 1 shows a plan view of the design according to a first embodiment of the invention.

FIG. 2 shows a bottom view of the design according to the invention. A claimed portion is not seen from the bottom.

FIG. 3 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1 .

FIG. 4 shows an enlarged sectional view along the line 4 — 4 in FIG. 3 .

FIG. 5 shows an enlarged sectional view along the line 5 — 5 in FIG. 3 .

FIG. 6 shows a perspective view of the design in FIG. 1 , on which an semiconductor device (not claimed) is disposed.

FIG. 7 shows an enlarged sectional view along the line 5 — 5 in FIG. 3 , on which a semiconductor device (not claimed) is disposed.

FIG. 8 shows a plan view of the design according to a second embodiment of the invention.

FIG. 9 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 8 .

FIG. 10 shows an enlarged sectional view along the line 10 — 10 in FIG. 9 ; and,

FIG. 11 shows an enlarged sectional view along the line 11 — 11 in FIG. 9 .

The elements shown in broken lines are for illustrative purpose only and form no part of the claimed invention.