Inventor

HSIEN-WEI CHEN

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 279 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices35%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%

H10DInorganic electric semiconductor devices3%

G02BOptical elements, systems or apparatus3%

H10HInorganic light-emitting semiconductor devices having potential barriers1%

H10BElectronic memory devices1%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%

H01FMagnets0%

H01GCapacitors0%

PatentTitleYear

12,581,985Pad design for reliability enhancement in packages2026 12,543,571Method of making package including stress relief structures and package2026 12,538,819Inductor RF isolation structure in an interposer and methods of forming the same2026 12,517,311Semiconductor package and manufacturing method thereof2026 12,512,376Semiconductor structure and method of forming2025 12,512,382Semiconductor device including stress control layer and methods of forming the same2025 12,500,127Method of fabricating semiconductor structure2025 12,500,192Package and manufacturing method thereof2025 12,489,029Redistribution structure with warpage tuning layer2025 12,489,043Reconstructed substrates for high I/O counts application and methods for forming the same2025 12,482,787Semiconductor packaging and methods of forming same2025 12,482,772Bonding structure of dies with dangling bonds2025 12,476,217Semiconductor structure2025 12,477,847Method of manufacturing semiconductor devices with system on chip devices2025 12,476,206Seal ring for hybrid-bond2025 12,469,781Package structure and manufacturing method thereof2025 12,469,753Integrated circuit component and package structure having the same2025 12,451,4353D stacking architecture through TSV and methods forming same2025 12,444,714Semiconductor structure2025 12,412,860Package structure2025 12,412,882Buffer design for package integration2025 12,406,965Package2025 12,400,999Semiconductor devices and methods of manufacture2025 12,394,758Packages with metal line crack prevention design2025 12,394,772Molded dies in semiconductor packages and methods of forming same2025 12,387,945Semiconductor structures including glass core layer and methods of forming the same2025 12,368,147Semiconductor structure having photonic die and electronic die2025 12,368,115Supporting InFO packages to reduce warpage2025 12,368,109Interposer structure for semiconductor package including peripheral metal pad around alignment mark and methods of fabricating same2025 12,362,282Semiconductor structure and manufacturing method thereof2025 12,362,342Semiconductor package2025 12,362,326Semiconductor package and method of manufacturing semiconductor package2025 12,362,261Semiconductor device and method of manufacture2025 12,362,178Method for fabricating a chip package2025 12,354,938Semiconductor package and methods of manufacturing2025 12,353,008Package, optical device, and manufacturing method of package2025 12,355,007Package and method of fabricating the same2025 12,347,758Dual-underfill encapsulation for packaging and methods of forming the same2025 12,334,459Integrated circuits2025 12,327,819Devices employing thermal and mechanical enhanced layers and methods of forming same2025 12,322,728Method of manufacturing die stack structure2025 12,315,842Package structure2025 12,317,655Semiconductor package and manufacturing method of semiconductor package2025 12,308,323Package-on-package device2025 12,308,321Structures to increase substrate routing density and methods of forming the same2025 12,308,298Semiconductor die, manufacturing method thereof, and semiconductor package2025 12,300,619Interposer with die to die bridge solution and methods of forming the same2025 12,288,802Structure and method for forming integrated high density MIM capacitor2025 12,283,570Package structure2025 12,283,543Semiconductor packages2025 12,272,678Semiconductor package and manufacturing method thereof2025 12,266,637Die stack structure and manufacturing method thereof2025 12,266,584Integrated circuit package and method2025 12,261,163Molded dies in semiconductor packages and methods of forming same2025 12,248,178Packaged device including an optical path structure aligned to an optical feature2025 12,249,580Passivation scheme design for wafer singulation2025 12,243,681Programmable inductor and methods of manufacture2025 12,243,830Semiconductor devices and methods of manufacture2025 12,243,833Semiconductor device with electromagnetic interference film and method of manufacture2025 12,237,283Semiconductor structure and method for manufacturing the same2025 12,224,257Semiconductor structure and manufacturing method thereof2025 12,224,247Fan-out package having a main die and a dummy die2025 12,218,105Package and method of forming the same2025 12,218,097Bonding to alignment marks with dummy alignment marks2025 12,218,108Package and manufacturing method thereof2025 12,211,823Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same2025 12,211,707Integrated circuit package and method of forming thereof2025 12,210,187Semiconductor structure2025 12,205,911Bonding structure and method of forming same2025 12,205,856Semiconductor structure including interconnection to probe pad with probe mark2025 12,205,853Integrated circuit test method and structure thereof2025 12,199,024Semiconductor device and method of manufacture2025 12,199,049Advanced seal ring structure and method of making the same2025 12,191,163Packaged semiconductor devices and methods of packaging semiconductor devices2025 12,191,283Manufacturing method of three-dimensional stacking structure2025 12,183,728Process control for package formation2024 12,176,270Package structure with photonic die and method2024 12,176,257Semiconductor structure having an anti-arcing pattern disposed on a passivation layer2024 12,176,344Methods of forming semiconductor structure2024 12,176,248Wafer level dicing method and semiconductor device2024 12,170,207Stacked semiconductor devices and methods of forming same2024 12,165,980Semiconductor package and methods of manufacturing2024 12,165,971Package having different metal densities in different regions and manufacturing method thereof2024 12,154,876Semiconductor interconnect structure and method2024 12,148,728Multi-chip integrated fan-out package2024 12,136,619Methods of manufacturing three-dimensional integrated circuit structures2024 12,125,769Package structure and method of fabricating the same2024 12,119,320Chip package structure with bump2024 12,119,338Semiconductor device packages, packaging methods, and packaged semiconductor devices2024 12,119,318Bonding structure and method of forming same2024 12,113,036Semiconductor package and manufacturing method thereof2024 12,087,668Semiconductor package and method for manufacturing the same2024 12,087,755Method of fabricating package structure2024 12,080,629Manufacturing method of semiconductor structure2024 12,080,702Method of fabricating package structure2024 12,074,136Package structure and method of manufacturing the same2024 12,074,131Package structure and manufacturing method thereof2024 12,068,285Stacked die structure and method of fabricating the same2024 12,068,241Semiconductor structure2024 12,062,608Semiconductor packages2024 12,057,438Die stack structure and manufacturing method thereof2024 12,046,480Manufacturing method of a semiconductor device2024 12,046,579Package having bonding layers2024 12,021,064Semiconductor devices and methods of manufacture2024 12,020,953Fan-out structure and method of fabricating the same2024 12,020,997Methods of forming semiconductor device packages having alignment marks on a carrier substrate2024 12,021,051Semiconductor package and method of forming the same2024 12,021,057Semiconductor structure and semiconductor die2024 12,009,386Structure and method for forming integrated high density MIM capacitor2024 12,009,335Structure and method of forming a joint assembly2024 12,009,316Semiconductor structure and method of manufacturing a semiconductor structure2024 12,002,778Semiconductor packages and methods of forming the same2024 11,996,401Packaged die and RDL with bonding structures therebetween2024 11,984,405Pad structure design in fan-out package2024 11,978,716Package2024 11,973,170Semiconductor package and manufacturing method of semiconductor package2024 11,967,563Fan-out package having a main die and a dummy die2024 11,960,127Semiconductor package and manufacturing method thereof2024 11,955,433Package-on-package device2024 11,942,454Package and manufacturing method thereof2024 11,942,436Passivation scheme design for wafer singulation2024 11,935,802Integrated circuit package and method of forming same2024 11,929,322Method of forming device and package structure2024 11,908,692Method for fabricating a chip package2024 11,908,817Bonding structure of dies with dangling bonds2024 11,908,836Semiconductor package and method of manufacturing semiconductor package2024 11,899,242Method of manufacturing a packaged device with optical pathway2024 11,869,819Integrated circuit component and package structure having the same2024 11,862,606Packages with metal line crack prevention design2024 11,862,605Integrated circuit package and method of forming same2024 11,862,599Bonding to alignment marks with dummy alignment marks2024 11,862,590Integrated circuit package and method of forming thereof2024 11,854,921Integrated circuit package and method2023 11,855,063Buffer design for package integration2023 11,854,918Seal ring between interconnected chips mounted on an integrated circuit2023 11,856,800Semiconductor devices with system on chip devices2023 11,855,018Semiconductor device and method of manufacture2023 11,854,967Semiconductor packages2023 11,848,267Functional component within interconnect structure of semiconductor device and method of forming same2023 11,846,802Semiconductor structure2023 11,848,271Redistribution layer structures for integrated circuit package2023 11,848,246Integrated circuit package and method2023 11,842,983Semiconductor structure2023 11,837,578Package structure2023 11,837,579Semiconductor structure2023 11,830,825Advanced seal ring structure and method of making the same2023 11,823,912Stacked semiconductor devices and methods of forming same2023 11,817,445Semiconductor device packages, packaging methods, and packaged semiconductor devices2023 11,817,363Semiconductor die, manufacturing method thereof, and semiconductor package2023 11,817,426Package and method of fabricating the same2023 11,810,883Package structure2023 11,804,475Semiconductor package for thermal dissipation2023 11,798,931Semiconductor package2023 11,791,246Package structure with photonic die and method2023 11,789,201Package, optical device, and manufacturing method of package2023 11,791,243Semiconductor device and method of manufacture2023 11,791,333Three-dimensional integrated circuit structures and method of forming the same2023 11,784,124Plurality of different size metal layers for a pad structure2023 11,769,724Package having different metal densities in different regions and manufacturing method thereof2023 11,769,704Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern2023 11,764,165Supporting InFO packages to reduce warpage2023 11,756,901Seal ring for hybrid-bond2023 11,756,933Inactive structure on SoIC2023 11,756,731Programmable inductor2023 11,756,931Chip package structure with molding layer2023 11,756,907Bonding structure and method of forming same2023 11,749,651Semiconductor package and manufacturing method thereof2023 11,742,298Alignment mark design for packages2023 11,735,555Manufacturing method of semiconductor structure2023 11,735,544Semiconductor packages with stacked dies and methods of forming the same2023 11,735,487Semiconductor structure and method of fabricating the same2023 11,735,536Semiconductor package and manufacturing method thereof2023 11,728,324Semiconductor structure having photonic die and electronic die2023 11,728,247Manufacturing method of semiconductor structure2023 11,728,334Three-dimensional integrated circuit structures and method of forming the same2023 11,728,275Semiconductor package and manufacturing method thereof2023 11,728,312Semiconductor packaging and methods of forming same2023 11,721,559Integrated circuit package pad and methods of forming2023 11,721,598Method of forming semiconductor device package having testing pads on an upper die2023 11,721,676Package structure with dummy die2023 11,715,755Structure and method for forming integrated high density MIM capacitor2023 11,705,343Integrated circuit package and method of forming thereof2023 11,705,423Package structure2023 11,699,663Passivation scheme design for wafer singulation2023 11,682,594Semiconductor structure including interconnection to probe pad with probe mark2023 11,676,942Semiconductor structure and method of manufacturing the same2023 11,676,939Discrete polymer in fan-out packages2023 11,670,621Die stack structure2023 11,664,336Bonding structure and method of forming same2023 11,652,063Semiconductor package and method of forming the same2023 11,640,958Packaged die and RDL with bonding structures therebetween2023 11,626,378Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices2023 11,626,296Fan-out structure and method of fabricating the same2023 11,621,214Semiconductor package and method for manufacturing the same2023 11,612,057Opening in the pad for bonding integrated passive device in InFO package2023 11,609,391Semiconductor package and manufacturing method thereof2023 11,600,587Pad design for reliability enhancement in packages2023 11,594,520Semiconductor package for thermal dissipation2023 11,587,922Process control for package formation2023 11,587,907Package structure2023 11,574,847Seal ring between interconnected chips mounted on an integrated circuit2023 11,574,878Semiconductor structure and manufacturing method thereof2023 11,562,935Semiconductor structure2023 11,557,581Package structure and method of fabricating the same2023 11,532,567Electric magnetic shielding structure in packages2022 11,532,524Integrated circuit test method and structure thereof2022 11,532,598Package structure with protective structure and method of fabricating the same2022 11,527,465Packages with Si-substrate-free interposer and method forming same2022 11,527,417Packaged semiconductor devices and methods of packaging semiconductor devices2022 11,527,490Packaging devices and methods of manufacture thereof2022 11,508,695Redistribution layers in semiconductor packages and methods of forming same2022 11,495,559Integrated circuits2022 11,482,499Seal ring for hybrid-bond2022 11,482,649Semiconductor package and manufacturing method of semiconductor package2022 11,476,201Package-on-package device2022 11,470,720Opening in the pad for bonding integrated passive device in InFO package2022 11,469,218Devices employing thermal and mechanical enhanced layers and methods of forming same2022 11,462,458Semiconductor device and method of manufacture2022 11,456,240Semiconductor device and method of manufacture2022 11,450,579Integrated circuit component and package structure having the same2022 11,444,021Device and package structure and method of forming the same2022 11,444,057Package structures and methods of forming2022 11,443,995Integrated circuit package and method2022 11,430,670Stacked semiconductor devices and methods of forming same2022 11,424,191Semiconductor devices and methods of manufacture2022 11,424,205Semiconductor interconnect structure and method2022 11,424,189Pad structure design in fan-out package2022 11,417,587Package structure and method of fabricating the same2022 11,417,599Plurality of different size metal layers for a pad structure2022 11,417,619Package and manufacturing method thereof2022 11,417,610Post-passivation interconnect structure2022 11,410,956Chip package structure with bump2022 11,410,948Semiconductor structure and manufacturing method thereof2022 11,404,404Semiconductor structure having photonic die and electronic die2022 11,393,797Chip package with redistribution layers2022 11,387,204Semiconductor structure and method of fabricating the same2022 11,387,209Package structure2022 11,380,598Integrated circuit package and method of forming same2022 11,380,653Die stack structure and manufacturing method thereof2022 11,373,953Semiconductor structure and manufacturing method thereof2022 11,372,160Package, optical device, and manufacturing method of package2022 11,373,962Advanced seal ring structure and method of making the same2022 11,373,969Semiconductor package and method of forming the same2022 11,362,064Semiconductor package with shared barrier layer in redistribution and via2022 11,362,066Semiconductor structure and manufacturing method thereof2022 11,362,069Three-dimensional stacking structure and manufacturing method thereof2022 11,362,065Package and manufacturing method thereof2022 11,355,468Structure and method of forming a joint assembly2022 11,347,001Semiconductor structure and method of fabricating the same2022 11,342,196Integrated circuit package pad and methods of forming2022 11,342,297Package structure and manufacturing method thereof2022 11,335,610Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the same2022 11,315,855Package structure with photonic die and method2022 11,309,223Method of forming semiconductor device package having dummy devices on a first die2022 11,309,291Die stack structure and manufacturing method thereof2022 RE049046Methods and apparatus for package on package devices2022 11,309,243Package having different metal densities in different regions and manufacturing method thereof2022 11,309,289Integrated circuit package having heat dissipation structure2022 11,276,656Integrated fan-out structure and method of forming2022 11,270,989Semiconductor device packages, packaging methods, and packaged semiconductor devices2022 11,264,343Bond pad structure for semiconductor device and method of forming same2022 11,257,787Package structure and method of fabricating the same2022 11,257,791Stacked die structure and method of fabricating the same2022 11,257,775Mechanisms for forming post-passivation interconnect structure2022 11,251,157Die stack structure with hybrid bonding structure and method of fabricating the same and package2022 11,251,100Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure2022 11,239,225Three-dimensional integrated circuit structures and methods of manufacturing the same2022 11,217,552Multi-chip integrated fan-out package2022 11,195,810Bonding structure and method of forming same2021 11,195,804Semiconductor structure2021 11,183,454Functional component within interconnect structure of semiconductor device and method of forming same2021 11,183,475Semiconductor structure2021 11,177,201Semiconductor packages including routing dies and methods of forming same2021 11,177,238Semiconductor structure2021 11,177,200Pad design for reliability enhancement in packages2021 11,164,832Package with UBM and methods of forming2021 11,164,857Semiconductor device packages, packaging methods, and packaged semiconductor devices2021 11,152,323Package with UBM and methods of forming2021 11,145,622Discrete polymer in fan-out packages2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (279)· patent assignee history

2021–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	279	2021–2026

Locations

Location	Patents	Span
TW	279	2021–2026