Inventor
Hideko Fukushima
Inventor
Saitama, JP
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C04Bprimary
C04BLime, magnesia23%
Y10TTechnical subjects covered by former us classification15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
C22CAlloys8%
B22CFoundry moulding6%
B28BShaping clay or other ceramic compositions4%
C23CCoating metallic material4%
H01LSemiconductor devices4%
H10DInorganic electric semiconductor devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
10,040,116Method of manufacturing ceramic sintered body and ceramic sintered body20189,839,957'Ceramic core, manufacturing method for the same, manufacturing method for casting using the ceramic core, and casting manufactured by the method'20179,837,543Oxide semiconductor target, oxide semiconductor film and method for producing same, and thin film transistor20179,539,639'Ceramic core and method for producing same'20179,276,123'Oxide semiconductor target and oxide semiconductor material, as well as semiconductor device using the same'20169,240,490'Oxide semiconductor target and oxide semiconductor material, as well as semiconductor device using the same'20169,209,312'Oxide semiconductor target and oxide semiconductor material, as well as semiconductor device using the same'20157,923,103'Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods'20117,851,055'High-thermal-conductivity graphite-particles-dispersed-composite and its production method'20107,708,050'Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods'20107,282,265'Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods'20076,705,860'Setter for burning'20046,362,120'Alumina ceramic composition'20026,221,271'Piezoelectric sintered ceramics and piezoelectric ceramic elements constituted thereby'20016,045,893'Multilayered electronic part with minimum silver diffusion'20005,457,075'Sintered ceramic composite and molten metal contact member produced therefrom'19955,096,863'Diffusion-bonded assembly of AlN ceramic bodies and heat dissipation member constituted thereby'19925,077,244'Aluminum nitride sintered body and semiconductor substrate thereof'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2018Patents assigned to HITACHI METALS LTD (16)· patent assignee history
1991–2010Based in Kumagaya, JP· patent location history
2000–2011Based in Saitama, JP· patent location history
2015–2016Based in Tokyo, JP· patent location history
2017Patents assigned to FUKUSHIMA HIDEKO (1)· patent assignee history
2017–2018Based in Shimane, JP· patent location history
2017Based in Yasugi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI METALS LTD | 16 | 1991–2018 |
| FUKUSHIMA HIDEKOself | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Saitama, JP | 6 | 2000–2011 |
| Kumagaya, JP | 5 | 1991–2010 |
| Tokyo, JP | 3 | 2015–2016 |
| Shimane, JP | 2 | 2017–2018 |
| Yasugi, JP | 2 | 2017 |