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Inventor

Sanghoon Ha

Inventor
Kanagawa, JP

Overview

20→
Patents
2004–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H04Nprimary
H04NPictorial communication, e.g. television32%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation32%
H01LSemiconductor devices21%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
Y02PClimate change mitigation technologies in the production or processing of goods4%
G09GArrangements or circuits for control of indicating devices using static means to present variable information2%
H03MCoding2%
PatentTitleYear
10,770,495Solid-state imaging device, manufacturing method thereof, and camera with alternatively arranged pixel combinations202010,692,909Solid-state imaging device, manufacturing method thereof, and camera with alternatively arranged pixel combinations202010,484,630Image sensor including feedback device to reduce noise during reset operation201910,249,663Solid-state imaging device, manufacturing method thereof, and camera with arranged pixel combinations alternatively201910,068,939Solid-state imaging device, manufacturing method thereof, and camera with arranged pixel combinations alternatively201810,062,719Solid-state imaging device, manufacturing method thereof, and camera with arranged pixel combinations alternatively20189,793,313'Solid-state imaging device, manufacturing method thereof, and camera with arranged pixel combinations alternatively'20179,299,867'Method of manufacturing solid-state imaging apparatus'20169,245,918'Solid-state imaging device, manufacturing method thereof, and camera with alternately arranged pixel combinations and shared floating diffusion'20169,219,097'Method for production of solid-state imaging element, solid-state imaging element, and imaging apparatus'20158,976,283'Solid-state imaging device, manufacturing method thereof, and camera with alternately arranged pixel combinations having differing on-chip lenses'20158,941,766'Solid-state imaging device, manufacturing method thereof, and camera with alternately arranged pixel combinations having differing on-chip lenses'20158,786,740'Imaging device, electric charge readout method, and imaging apparatus'20148,710,559'Solid-state imaging apparatus, method of manufacturing solid-state imaging apparatus, and electronic apparatus'20148,704,921'Solid-state imaging device, manufacturing method thereof, and camera with grouped on-chip lens formation'20148,697,477'Method for production of solid-state imaging element, solid-state imaging element, and imaging apparatus'20148,618,623'Solid-state image pickup device and method for manufacturing same, and image pickup apparatus'20138,446,498'Solid-state imaging device, manufacturing method thereof, and camera with alternately arranged pixel combinations'20138,428,377'Device and method of processing image data to be displayed on a display device'20136,718,357'Microcomputer including an upper and lower clip circuit'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004Based in Hyogo, JP· patent location history
2013–2016Patents assigned to SONY CORP (10)· patent assignee history
2013–2014Patents assigned to HA SANGHOON (6)· patent assignee history
2013–2014Patents assigned to ISHIWATA HIROAKI (4)· patent assignee history
2013–2019Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2013–2020Based in Kanagawa, JP· patent location history
2013Based in Seoul, KR· patent location history
2017–2020Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (6)· patent assignee history
2019Based in Seongnam-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SONY CORP102013–2016
HA SANGHOONself62013–2014
SONY SEMICONDUCTOR SOLUTIONS CORP62017–2020
ISHIWATA HIROAKI42013–2014
SAMSUNG ELECTRONICS CO LTD22013–2019
Locations
LocationPatentsSpan
Kanagawa, JP172013–2020
Seongnam-si, KR12019
Seoul, KR12013
Hyogo, JP12004