LexDanaLexDanabeta
Inventor

Thorsten Meyer

Inventor
Regensburg, DE

Overview

198→
Patents
1996–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 198 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10DInorganic electric semiconductor devices7%
H05KPrinted circuits2%
Y10TTechnical subjects covered by former us classification2%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
H01QAntennas, i.e. radio aerials1%
B62DMotor vehicles1%
PatentTitleYear
11,081,455Semiconductor device with bond pad extensions formed on molded appendage202110,784,033Vertical inductor for WLCSP202010,777,491Package comprising carrier with chip and component mounted via opening202010,734,352Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement202010,707,158Package with vertical interconnect between carrier and clip202010,700,037Reinforcement for electrical connectors202010,629,575Stacked die semiconductor package with electrical interposer202010,625,769Motor vehicle steering system, assembly tool and assembly method for a motor vehicle steering system202010,566,309Multi-purpose non-linear semiconductor package assembly line202010,535,634Multi-layer package202010,522,454Microelectronic package having a passive microelectronic device disposed within a package body201910,453,804Radio die package with backside conductive plate201910,394,280Wearable electronic devices and components thereof201910,373,844Integrated circuit package configurations to reduce stiffness201910,354,925Semiconductor device including at least one lateral IGFET and at least one vertical IGFET and corresponding manufacturing method201910,319,688Antenna on ceramics for a packaged die201910,301,176Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)201910,290,412Vertical inductor for WLCSP201910,249,598Integrated circuit package having wirebonded multi-die stack201910,229,858Conductive paths through dielectric with a high aspect ratio for semiconductor devices201910,228,725Flexible band wearable electronic device201910,217,695Connector block with two sorts of through connections, and electronic device comprising a connector block201910,211,182Package-on-package stacked microelectronic structures201910,170,409Package on package architecture and method for making201910,168,391Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto201910,157,869Integrated circuit package201810,150,668Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)201810,147,710Method of embedding WLCSP components in E-WLB and E-PLB201810,128,205Embedded die flip-chip package assembly201810,122,420Wireless in-chip and chip to chip communication201810,096,584Method for producing a power semiconductor module201810,056,352High density chip-to-chip connection201810,043,768Semiconductor device and method of manufacture thereof20189,997,444Microelectronic package having a passive microelectronic device disposed within a package body20189,991,239Method of embedding WLCSP components in e-WLB and e-PLB20189,985,005Chip package-in-package20189,984,900Semiconductor device including at least one element20189,972,601Integrated circuit package having wirebonded multi-die stack20189,904,321'Wearable electronic devices and components thereof'20189,888,577'Passive electrical devices with a polymer carrier'20189,874,820System and process for fabricating semiconductor packages20189,856,136'Chip arrangement and method for manufacturing a chip arrangement'20189,837,530Semiconductor device and method of manufacturing the same20179,825,148'Semiconductor device comprising an isolation trench'20179,819,327'Bulk acoustic wave resonator tuner circuits'20179,761,665'Method of manufacturing an integrated circuit having field effect transistors including a peak in a body dopant concentration'20179,716,068'Semiconductor device'20179,711,492'Three dimensional structures within mold compound'20179,711,621'Trench transistor having a doped semiconductor region'20179,663,353'Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)'20179,653,324'Integrated circuit package configurations to reduce stiffness'20179,653,439'Three dimensional structures within mold compound'20179,646,856'Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip'20179,601,475'Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips'20179,576,918'Conductive paths through dielectric with a high aspect ratio for semiconductor devices'20179,564,578'Semiconductor package with integrated magnetic field sensor'20179,564,425'Integrated transistor structure having a power transistor and a bipolar transistor'20179,564,400'Methods of forming stacked microelectronic dice embedded in a microelectronic substrate'20179,550,670'Stress buffer layer for integrated microelectromechanical systems (MEMS)'20179,543,224'Hybrid exposure for semiconductor devices'20179,472,515'Integrated circuit package'20169,461,164'Semiconductor device and method of manufacturing the same'20169,455,161'Semiconductor device and methods of manufacturing semiconductor devices'20169,397,019'Integrated circuit package configurations to reduce stiffness'20169,385,105'Semiconductor devices'20169,373,700'Field plate trench transistor and method for producing it'20169,373,588'Stacked microelectronic dice embedded in a microelectronic substrate'20169,362,144'Article and panel comprising semiconductor chips, casting mold and methods of producing the same'20169,355,909'Method of manufacturing an integrated circuit having field effect transistors including a peak in a body dopant concentration'20169,349,834'Method of manufacturing a semiconductor device'20169,331,057'Semiconductor device'20169,312,198'Chip package-in-package and method thereof'20169,293,423'Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips'20169,281,359'Semiconductor device comprising contact trenches'20169,263,376'Chip interposer, semiconductor device, and method for manufacturing a semiconductor device'20169,219,034'Semiconductor module having deflecting conductive layer over a spacer structure'20159,205,868'Steering spindle arrangement'20159,171,841'Field plate trench transistor and method for producing it'20159,165,841'System and process for fabricating semiconductor packages'20159,164,404'System and process for fabricating semiconductor packages'20159,126,622'Steering arrangement'20159,123,801'Semiconductor device, integrated circuit and method of manufacturing a semiconductor device'20159,111,947'Chip arrangement with a recessed chip housing region and a method for manufacturing the same'20159,112,021'High voltage bipolar transistor with trench field plate'20159,093,322'Semiconductor device'20159,064,883'Chip with encapsulated sides and exposed surface'20159,064,787'Integrated antennas in wafer level package'20159,056,763'Stress buffer layer for integrated microelectromechanical systems (MEMS)'20159,059,304'Enhanced flip chip package'20159,030,019'Semiconductor device and method of manufacture thereof'20158,941,206'Semiconductor device including a diode and method of manufacturing a semiconductor device'20158,907,480'Chip arrangements'20148,878,360'Stacked fan-out semiconductor chip'20148,878,335'Method and system for providing fusing after packaging of semiconductor devices'20148,829,663'Stackable semiconductor package with encapsulant and electrically conductive feed-through'20148,827,354'Vehicle interior fitting part and method for the production thereof'20148,815,686'Lateral trench transistor, as well as a method for its production'20148,786,105'Semiconductor device with chip having low-k-layers'20148,779,564'Semiconductor device with capacitive coupling structure'20148,779,563'Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips'20148,772,861'Field effect trench transistor having active trenches'20148,759,905'Field plate trench transistor and method for producing it'20148,754,522'Repairable semiconductor device and method'20148,741,690'Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads'20148,742,563'Component and method for producing a component'20148,729,714'Flip-chip wafer level package and methods thereof'20148,716,859'Enhanced flip chip package'20148,656,646'Vehicle door'20148,659,154'Semiconductor device including adhesive covered element'20148,643,068'Integrated circuit having field effect transistors and manufacturing method'20148,637,954'Integrated circuit technology with different device epitaxial layers'20148,616,611'Door module for a vehicle door, and mounting method'20138,617,929'On-Chip RF shields with front side redistribution lines'20138,604,622'Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device'20138,598,716'Semiconductor apparatus having stacked semiconductor components'20138,598,709'Method and system for routing electrical connections of semiconductor chips'20138,502,307'Vertical power semiconductor carrier having laterally isolated circuit areas'20138,487,448'Method for producing chip packages, and chip package produced in this way'20138,471,393'Semiconductor component including a semiconductor chip and a passive component'20138,461,691'Chip-packaging module for a chip and a method for forming a chip-packaging module'20138,451,618'Integrated antennas in wafer level package'20138,431,988'Lateral trench transistor, as well as a method for its production'20138,421,226'Device including an encapsulated semiconductor chip and manufacturing method thereof'20138,415,803'Method and system for routing electrical connections of semiconductor chips'20138,390,107'Semiconductor device and methods of manufacturing semiconductor devices'20138,334,564'Field plate trench transistor and method for producing it'20128,319,282'High-voltage bipolar transistor with trench field plate'20128,309,454'Structure for electrostatic discharge in embedded wafer level packages'20128,258,633'Semiconductor package and multichip arrangement having a polymer layer and an encapsulant'20128,217,504'Article and panel comprising semiconductor chips, casting mold and methods of producing the same'20128,202,763'Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device'20128,188,585'Electronic device and method for producing a device'20128,183,696'Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads'20128,178,965'Semiconductor module having deflecting conductive layer over a spacer structure'20128,178,953'On-chip RF shields with front side redistribution lines'20128,124,521'Electrical through contact'20128,093,711'Semiconductor device'20128,080,880'Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads'20118,076,784'Stacked semiconductor chips'20118,076,180'Repairable semiconductor device and method'20118,071,428'Semiconductor device'20118,063,469'On-chip radio frequency shield with interconnect metallization'20118,012,807'Method for producing chip packages, and chip package produced in this way'20118,003,515'Device and manufacturing method'20117,952,200'Semiconductor device including a copolymer layer'20117,943,423'Reconfigured wafer alignment'20117,919,868'Carrier substrate and integrated circuit'20117,911,068'Component and method for producing a component'20117,906,860'Semiconductor device'20117,893,486'Field plate trench transistor and method for producing it'20117,867,878'Stacked semiconductor chips'20117,868,446'Semiconductor device and methods of manufacturing semiconductor devices'20117,834,464'Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device'20107,800,171'Integrated circuit including a semiconductor device'20107,772,652'Semiconductor component arrangement having a first and second region'20107,759,792'Integrated circuit including parylene material layer'20107,759,163'Semiconductor module'20107,732,242'Composite board with semiconductor chips and plastic housing composition and method'20107,719,254'Method for setting a reference potential of a current sensor and arrangement for determining the reference potential of a power semiconductor device'20107,687,895'Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips'20107,663,248'Flip-chip component'20107,646,090'Semiconductor module for making electrical contact with a connection device via a rewiring device'20107,537,268'Adjustable armrest'20097,481,459'Shaft for a motor vehicle steering column and associated assembly process'20097,339,237'Connection, configuration, and production of a buried semiconductor layer'20087,307,328'Semiconductor device with temperature sensor'20077,274,110'Semiconductor component having a CSP housing'20077,274,107'Semiconductor device'20077,247,948'Semiconductor device and method for fabricating the semiconductor device'20077,221,053'Integrated device and electronic system'20077,217,646'Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement'20077,211,451'Process for producing a component module'20077,208,345'Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device'20077,137,917'Transport tooth chain with reduced wear on the vertical dimension of its link members'20067,087,512'Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions'20067,080,988'Flexible contact-connection device'20067,074,649'Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit'20067,022,549'Method for connecting an integrated circuit to a substrate and corresponding arrangement'20066,953,708'Method of producing a semiconductor component having a compliant buffer layer'20056,936,928'Semiconductor component and method for its production'20056,927,157'Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device'20056,905,954'Method for producing a semiconductor device and corresponding semiconductor device'20056,888,256'Compliant relief wafer level packaging'20056,864,575'Electronic interface structures and methods'20056,845,554'Method for connection of circuit units'20056,826,037'Electronic structure'20046,807,064'Electronic component with at least one semiconductor chip and method for producing the electronic component'20046,727,576'Transfer wafer level packaging'20046,727,586'Semiconductor component'20046,714,418'Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another'20046,696,319'Method of attaching semiconductor devices on a switching device and such an attached device'20046,664,176'Method of making pad-rerouting for integrated circuit chips'20036,386,587'Adjusting arrangement for a steering column tube of a steering system of a motor vehicle'20025,868,040'Gas pedal with friction structure'19995,855,146'Control pedal unit for a vehicle'19995,794,490'Control pedal unit for vehicles'19985,794,489'Control pedal unit for motor vehicles'19985,546,904'Motion transmission mechanism for controlling an internal combustion engine'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2020Patents assigned to INFINEON TECHNOLOGIES AG (104)· patent assignee history
2003–2007Based in Erlangen, DE· patent location history
2004–2007Based in Dresden, DE· patent location history
2005–2021Based in Regensburg, DE· patent location history
2007–2019Based in Munich, DE· patent location history
2010–2015Based in München, DE· patent location history
2011–2019Patents assigned to MEYER THORSTEN (61)· patent assignee history
2011–2016Patents assigned to BRUNNBAUER MARKUS (19)· patent assignee history
2012–2018Patents assigned to INTEL MOBILE COMM GMBH (20)· patent assignee history
2015–2020Patents assigned to INTEL CORP (22)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AG1042003–2020
MEYER THORSTENself612011–2019
INTEL CORP222015–2020
INTEL MOBILE COMM GMBH202012–2018
BRUNNBAUER MARKUS192011–2016
Locations
LocationPatentsSpan
Regensburg, DE1332005–2021
Munich, DE232007–2019
Dresden, DE122004–2007
München, DE72010–2015
Erlangen, DE72003–2007