Inventor
ANIKET PATIL
Inventor
US
Overview
Patents· 48 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices32%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H05KPrinted circuits7%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes2%
H01QAntennas, i.e. radio aerials2%
H10BElectronic memory devices2%
LOC132%
LOC152%
G01CMeasuring distances, levels or bearings1%
PatentTitleYear
12,593,709Substrate(s) for an integrated circuit (IC) package employing a core layer and an adjacent insulation layer(s) with an embedded metal structure(s) positioned from the core layer202612,564,107Package comprising optical integrated device202612,543,599Package comprising a first substrate, a second substrate and an electrical device coupled to a bottom surface of the second substrate202612,512,412Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods202512,511,608System and method for address verification202512,411,015System and method for predicted pins202512,381,174Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methods202512,243,855Package comprising channel interconnects located between solder interconnects202512,230,552Recess structure for padless stack via202512,100,645Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods202412,021,063Circular bond finger pad202411,955,409Substrate comprising interconnects in a core layer configured for skew matching202411,948,877Hybrid package apparatus and method of fabricating202411,889,650Integrated direct mount branch protection for variable frequency drive202411,832,391Terminal connection routing and method the same202311,817,365Thermal mitigation die using back side etch202311,804,645Multi-sided antenna module employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related fabrication methods202311,791,276Package comprising passive component between substrates for improved power distribution network (PDN) performance202311,791,320Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods202311,784,151Redistribution layer connection202311,769,732Integrated circuit (IC) with reconstituted die interposer for improved connectivity, and related methods of fabrication202311,749,579Thermal structures adapted to electronic device heights in integrated circuit (IC) packages202311,749,611Package with a substrate comprising periphery interconnects202311,715,688Variable dielectric constant materials in same layer of a package202311,682,607Package having a substrate comprising surface interconnects aligned with a surface of the substrate202311,658,391Antenna module202311,637,057Uniform via pad structure having covered traces between partially covered pads202311,605,595Packages with local high-density routing region embedded within an insulating layer202311,581,251Package comprising inter-substrate gradient interconnect structure202311,581,262Package comprising a die and die side redistribution layers (RDL)202311,562,962Package comprising a substrate and interconnect device configured for diagonal routing2023D0975665Susceptor shaft202311,552,015Substrate comprising a high-density interconnect portion embedded in a core layer202311,545,439Package comprising an integrated device coupled to a substrate through a cavity202311,502,049Package comprising multi-level vertically stacked redistribution portions2022D0965524Susceptor support202211,456,291Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die ("die") module employing stacked dice, and related fabrication methods2022D0965044Susceptor shaft202211,444,019Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package202211,437,335Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods202211,393,808Ultra-low profile stacked RDL semiconductor package202211,342,246Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices202211,302,656Passive device orientation in core for improved power delivery in package202211,296,022Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape2022D0947913Susceptor shaft202211,296,024Nested interconnect structure in concentric arrangement for improved package architecture202211,289,453Package comprising a substrate and a high-density interconnect structure coupled to the substrate202211,177,223Electromagnetic interference shielding for packages and modules2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to QUALCOMM INC (41)· patent assignee history
2021–2026Based in US· patent location history
2022–2023Patents assigned to ASM IP HOLDING BV (4)· patent assignee history
2024Patents assigned to EATON INTELLIGENT POWER LTD (1)· patent assignee history
2024Based in IN· patent location history
2025Patents assigned to DOORDASH INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 41 | 2021–2026 |
| ASM IP HOLDING BV | 4 | 2022–2023 |
| DOORDASH INC | 2 | 2025 |
| EATON INTELLIGENT POWER LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 47 | 2021–2026 |
| IN | 1 | 2024 |