Inventor
Naohiko Hirano
Inventor
Okazaki, JP
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1049%
H05KPrinted circuits11%
H10DInorganic electric semiconductor devices9%
B23KSoldering or unsoldering5%
B22FWorking metallic powder4%
C22CAlloys4%
H01LSemiconductor devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling2%
C30BSingle-crystal growth2%
PatentTitleYear
10,081,852Solder preform and a process for its manufacture201810,002,841Semiconductor device20189,269,576'Silicon carbide semiconductor substrate and method for manufacturing same'20167,800,230'Solder preform and electronic component'20107,793,820'Solder preform and a process for its manufacture'20107,468,318'Method for manufacturing mold type semiconductor device'20087,345,369'Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same'20087,239,016'Semiconductor device having heat radiation plate and bonding member'20077,235,876'Semiconductor device having metallic plate with groove'20077,193,326'Mold type semiconductor device'20077,145,254'Transfer-molded power device and method for manufacturing transfer-molded power device'20067,019,395'Double-sided cooling type semiconductor module'20066,927,167'Method for manufacturing semiconductor device having controlled surface roughness'20056,917,103'Molded semiconductor power device having heat sinks exposed on one surface'20056,884,953'Switching circuit'20056,803,667'Semiconductor device having a protective film'20046,787,898'Molded semiconductor power device having heat sinks exposed on one surface'20046,384,431'Insulated gate bipolar transistor'20026,111,317'Flip-chip connection type semiconductor integrated circuit device'20005,814,891'Flip-chip connecting type semiconductor device'19985,801,447'Flip chip mounting type semiconductor device'19985,648,686'Connecting electrode portion in semiconductor device'19975,645,123'Semiconductor device having temperature regulation means formed in circuit board'19975,633,479'Multilayer wiring structure for attaining high-speed signal propagation'19975,629,566'Flip-chip semiconductor devices having two encapsulants'19975,567,983'Semiconductor apparatus capable of cooling a semiconductor element with radiation efficiency'19965,548,161'Semiconductor apparatus capable of cooling a semiconductor element with low radiation efficiency'19965,530,289'Semiconductor device and method of manufacturing the same'19965,401,688'Semiconductor device of multichip module-type'19955,309,024'Multilayer package'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2000Patents assigned to TOSHIBA KK (12)· patent assignee history
1994–1995Based in Yokohama, JP· patent location history
1996–2000Based in Kawasaki, JP· patent location history
2002–2018Patents assigned to DENSO CORP (17)· patent assignee history
2002–2018Based in Okazaki, JP· patent location history
2010–2018Patents assigned to SENJU METAL INDUSTRY CO (3)· patent assignee history
2018Patents assigned to HIRANO NAOHIKO (1)· patent assignee history
2018Patents assigned to ISHII TAKASHI (1)· patent assignee history
2018Based in Kariya, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DENSO CORP | 17 | 2002–2018 |
| TOSHIBA KK | 12 | 1994–2000 |
| SENJU METAL INDUSTRY CO | 3 | 2010–2018 |
| HIRANO NAOHIKOself | 1 | 2018 |
| ISHII TAKASHI | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Okazaki, JP | 17 | 2002–2018 |
| Kawasaki, JP | 10 | 1996–2000 |
| Yokohama, JP | 2 | 1994–1995 |
| Kariya, JP | 1 | 2018 |