Molded semiconductor power device having heat sinks exposed on one surface
Granted 7 Sep 2004 · 4 office actions
Assignee: Denso Corporation
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Naohiko Hirano, Yoshimi Nakase, Shoji Miura, Takanori Teshima · Examiner: Eddie Lee
Life of the patent
11 dated eventsAbstract
A semiconductor device includes a semiconductor chip, a first heat sink, a second heat sink, and a mold resin. The first heat sink is electrically and thermally connected to a surface of the semiconductor chip for functioning as an electrode for the semiconductor chip and releasing the heat generated by the semiconductor chip. The second heat sink is electrically and thermally connected to another surface of the semiconductor chip for functioning as another electrode for the semiconductor chip and releasing the heat. The semiconductor chip and the first and second heat sinks are covered with the mold resin such that the heat sinks are exposed on a substantially flat surface of the mold resin.
Classifications
4 codes- H01L2/334
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20030122232 A1 | 3 Jul 2003 |
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