Inventor
Terence M. Thomas
Inventor
Newark, DE, US
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
C09GPolishing compositions21%
C09KMaterials for miscellaneous applications, not provided for elsewhere16%
B24BMachines, devices, or processes for grinding or polishing10%
C23FNon-mechanical removal of metallic material from surface6%
Y10TTechnical subjects covered by former us classification4%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
A47JKitchen equipment1%
B08BCleaning in general1%
PatentTitleYear
9,633,865'Low-stain polishing composition'20178,563,436'Chemical mechanical polishing composition and methods relating thereto'20138,540,893'Chemical mechanical polishing composition and methods relating thereto'20137,785,487'Polymeric barrier removal polishing slurry'20107,387,964'Copper polishing cleaning solution'20087,270,762'Polishing compositions for noble metals'20077,253,111'Barrier polishing solution'20077,132,058'Tungsten polishing solution'20067,084,059'CMP system for metal deposition'20067,070,485'Polishing composition'20066,971,945'Multi-step polishing solution for chemical mechanical planarization'20056,936,541'Method for planarizing metal interconnects'20056,699,299'Composition and method for polishing in metal CMP'20046,664,188'Semiconductor wafer with a resistant film'20036,641,631'Polishing of semiconductor substrates'20036,616,717'Composition and method for polishing in metal CMP'20036,607,424'Compositions for insulator and metal CMP and methods relating thereto'20036,605,537'Polishing of metal substrates'20036,602,112'Dissolution of metal particles produced by polishing'20036,530,824'Method and composition for polishing by CMP'20036,475,069'Control of removal rates in CMP'20026,447,373'Chemical mechanical polishing slurries for metal'20026,379,406'Polishing compositions for semiconductor substrates'20026,331,134'Composition and method for polishing in metal CMP'20014,547,432'Method of bonding silver to glass and mirrors produced according to this method'1985Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1985Based in Arvada, CO, US· patent location history
2001–2017Based in Newark, DE, US· patent location history
2002–2004Patents assigned to RODEL INC (10)· patent assignee history
2005–2013Patents assigned to ROHM & HAAS ELECT MAT (10)· patent assignee history
2013–2017Patents assigned to THOMAS TERENCE M (2)· patent assignee history
2013–2017Patents assigned to WANG HONGYU (2)· patent assignee history
2013Patents assigned to GHOSH TIRTHANKAR (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RODEL INC | 10 | 2002–2004 |
| ROHM & HAAS ELECT MAT | 10 | 2005–2013 |
| THOMAS TERENCE Mself | 2 | 2013–2017 |
| WANG HONGYU | 2 | 2013–2017 |
| GHOSH TIRTHANKAR | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Newark, Delaware, US | 24 | 2001–2017 |
| Arvada, CO, US | 1 | 1985 |