Inventor
Konstantin Volodarsky
Inventor
San Francisco, CA, US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing39%
C25DProcesses for the electrolytic or electrophoretic production of coatings24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
C25FProcesses for the electrolytic removal of materials from objects5%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool2%
PatentTitleYear
7,316,602'Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing'20086,988,932'Apparatus of sealing wafer backside for full-face processing'20066,969,456'Method of using vertically configured chamber used for multiple processes'20056,939,206'Method and apparatus of sealing wafer backside for full-face electrochemical plating'20056,932,679'Apparatus and method for loading a wafer in polishing system'20056,884,334'Vertically configured chamber used for multiple processes'20056,855,037'Method of sealing wafer backside for full-face electrochemical plating'20056,773,576'Anode assembly for plating and planarizing a conductive layer'20046,716,084'Carrier head for holding a wafer and allowing processing on a front face thereof to occur'20046,612,915'Work piece carrier head for plating and polishing'20036,604,988'Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein'20036,533,646'Polishing head with removable subcarrier'20036,478,936'Anode assembly for plating and planarizing a conductive layer'20026,468,139'Polishing apparatus and method with a refreshing polishing belt and loadable housing'20026,464,571'Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein'20026,454,332'Apparatus and methods for handling a substrate'20026,425,812'Polishing head for chemical mechanical polishing using linear planarization technology'20026,352,623'Vertically configured chamber used for multiple processes'20026,244,946'Polishing head with removable subcarrier'20016,227,585'Apparatus and methods for handling a substrate'20015,913,714'Method for dressing a polishing pad during polishing of a semiconductor wafer'19995,857,899'Wafer polishing head with pad dressing element'19995,803,799'Wafer polishing head'19985,800,248'Control of chemical-mechanical polishing rate across a substrate surface'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–1999Patents assigned to ONTRAK SYSTEMS INC (4)· patent assignee history
1998–2008Based in San Francisco, CA, US· patent location history
2001–2003Patents assigned to LAM RES CORP (3)· patent assignee history
2002–2004Patents assigned to NUTOOL INC (8)· patent assignee history
2002Patents assigned to APPLIED MATERIALS INC (1)· patent assignee history
2005–2006Patents assigned to ASM NUTOOL INC (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NUTOOL INC | 8 | 2002–2004 |
| ASM NUTOOL INC | 6 | 2005–2006 |
| ONTRAK SYSTEMS INC | 4 | 1998–1999 |
| LAM RES CORP | 3 | 2001–2003 |
| APPLIED MATERIALS INC | 1 | 2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Francisco, California, US | 24 | 1998–2008 |